IC,MICROCONTROLLER,32-BIT,SPC56 CPU,CMOS,BGA,208PIN,PLASTIC
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
厂商名称 | ST(意法半导体) |
零件包装代码 | BGA |
针数 | 208 |
Reach Compliance Code | compliant |
位大小 | 32 |
CPU系列 | SPC56 |
JESD-30 代码 | S-PBGA-B208 |
端子数量 | 208 |
最高工作温度 | 125 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | BGA |
封装等效代码 | BGA208,16X16,40 |
封装形状 | SQUARE |
封装形式 | GRID ARRAY |
电源 | 1.2,3.3,5 V |
认证状态 | Not Qualified |
RAM(字节) | 65536 |
ROM(单词) | 1048576 |
ROM可编程性 | FLASH |
速度 | 64 MHz |
最大压摆率 | 195 mA |
表面贴装 | YES |
技术 | CMOS |
温度等级 | AUTOMOTIVE |
端子形式 | BALL |
端子节距 | 1 mm |
端子位置 | BOTTOM |
SPC563M60B2CBR | SPC563M60L5CBR | SPC563M60L5CBY | SPC563M60L5CAY | SPC563M60L5CCR | SPC563M60L5CAR | SPC563M60L5CCY | SPC563M60B2CBY | SPC563M60B2CAY | SPC563M60B2CAR | |
---|---|---|---|---|---|---|---|---|---|---|
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是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
零件包装代码 | BGA | QFP | QFP | QFP | QFP | QFP | QFP | BGA | BGA | BGA |
针数 | 208 | 144 | 144 | 144 | 144 | 144 | 144 | 208 | 208 | 208 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
位大小 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
CPU系列 | SPC56 | SPC56 | SPC56 | E200Z3 | SPC56 | E200Z3 | SPC56 | SPC56 | E200Z3 | E200Z3 |
JESD-30 代码 | S-PBGA-B208 | S-PQFP-G144 | S-PQFP-G144 | S-PQFP-G144 | S-PQFP-G144 | S-PQFP-G144 | S-PQFP-G144 | S-PBGA-B208 | S-PBGA-B208 | S-PBGA-B208 |
端子数量 | 208 | 144 | 144 | 144 | 144 | 144 | 144 | 208 | 208 | 208 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | BGA | QFP | QFP | LFQFP | QFP | LFQFP | QFP | BGA | LBGA | LBGA |
封装等效代码 | BGA208,16X16,40 | QFP144,.87SQ,20 | QFP144,.87SQ,20 | QFP144,.86SQ,20 | QFP144,.87SQ,20 | QFP144,.86SQ,20 | QFP144,.87SQ,20 | BGA208,16X16,40 | BGA208,16X16,40 | BGA208,16X16,40 |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | GRID ARRAY | FLATPACK | FLATPACK | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK | GRID ARRAY | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
ROM(单词) | 1048576 | 1048576 | 1048576 | 1048576 | 1048576 | 1048576 | 1048576 | 1048576 | 1048576 | 1048576 |
ROM可编程性 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
速度 | 64 MHz | 64 MHz | 64 MHz | 80 MHz | 40 MHz | 80 MHz | 40 MHz | 64 MHz | 80 MHz | 80 MHz |
最大压摆率 | 195 mA | 195 mA | 195 mA | 250 mA | 195 mA | 250 mA | 195 mA | 195 mA | 250 mA | 250 mA |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
端子形式 | BALL | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | BALL | BALL | BALL |
端子节距 | 1 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 1 mm | 1 mm | 1 mm |
端子位置 | BOTTOM | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | BOTTOM | BOTTOM | BOTTOM |
电源 | 1.2,3.3,5 V | 1.2,3.3,5 V | 1.2,3.3,5 V | - | 1.2,3.3,5 V | - | 1.2,3.3,5 V | 1.2,3.3,5 V | - | - |
RAM(字节) | 65536 | 65536 | 65536 | - | 65536 | - | 65536 | 65536 | - | - |
Base Number Matches | - | 1 | 1 | 1 | 1 | 1 | 1 | - | - | - |
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