IC SAMPLE AND HOLD AMPLIFIER, 3.5 us ACQUISITION TIME, UUC7, 2.235 X 2.108 MM, DIE-7, Sample and Hold Circuit
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | ADI(亚德诺半导体) |
| 零件包装代码 | DIE |
| 包装说明 | 2.235 X 2.108 MM, DIE-7 |
| 针数 | 7 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 标称采集时间 | 3.5 µs |
| 放大器类型 | SAMPLE AND HOLD CIRCUIT |
| 最大模拟输入电压 | 11 V |
| 最小模拟输入电压 | -11 V |
| 最大下降率 | 0.2 V/s |
| JESD-30 代码 | R-XUUC-N7 |
| JESD-609代码 | e0 |
| 负供电电压上限 | -18 V |
| 标称负供电电压 (Vsup) | -15 V |
| 功能数量 | 1 |
| 端子数量 | 7 |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | DIE |
| 封装形状 | RECTANGULAR |
| 封装形式 | UNCASED CHIP |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 认证状态 | Not Qualified |
| 采样并保持/跟踪并保持 | SAMPLE |
| 供电电压上限 | 18 V |
| 标称供电电压 (Vsup) | 15 V |
| 表面贴装 | YES |
| 技术 | BIPOLAR |
| 端子面层 | TIN LEAD |
| 端子形式 | NO LEAD |
| 端子位置 | UPPER |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| SMP11N | SMP11GPZ | SMP11GSZ | SMP11-803Y | SMP11AY883C | |
|---|---|---|---|---|---|
| 描述 | IC SAMPLE AND HOLD AMPLIFIER, 3.5 us ACQUISITION TIME, UUC7, 2.235 X 2.108 MM, DIE-7, Sample and Hold Circuit | IC SAMPLE AND HOLD AMPLIFIER, 5 us ACQUISITION TIME, PDIP14, HERMETIC SEALED, PLASTIC, DIP-14, Sample and Hold Circuit | IC SAMPLE AND HOLD AMPLIFIER, 5 us ACQUISITION TIME, PDSO16, SOL-16, Sample and Hold Circuit | IC CDIP14, CERAMIC, DIP-14, Sample and Hold Circuit | SAMPLE AND HOLD AMPLIFIER, 5us ACQUISITION TIME, CDIP14, HERMETIC SEALED, CERDIP-14 |
| 零件包装代码 | DIE | DIP | SOIC | DIP | DIP |
| 包装说明 | 2.235 X 2.108 MM, DIE-7 | DIP, | SOP, | DIP, | HERMETIC SEALED, CERDIP-14 |
| 针数 | 7 | 14 | 16 | 14 | 14 |
| Reach Compliance Code | compliant | compliant | compliant | unknown | unknown |
| 放大器类型 | SAMPLE AND HOLD CIRCUIT | SAMPLE AND HOLD CIRCUIT | SAMPLE AND HOLD CIRCUIT | SAMPLE AND HOLD CIRCUIT | SAMPLE AND HOLD CIRCUIT |
| 最大模拟输入电压 | 11 V | 18 V | 18 V | 10.5 V | 18 V |
| 最小模拟输入电压 | -11 V | -18 V | -18 V | -10.5 V | -18 V |
| 最大下降率 | 0.2 V/s | 0.9 V/s | 0.9 V/s | 5 V/s | 4 V/s |
| JESD-30 代码 | R-XUUC-N7 | R-PDIP-T14 | R-PDSO-G16 | R-GDIP-T14 | R-GDIP-T14 |
| 负供电电压上限 | -18 V | -18 V | -18 V | -36 V | -18 V |
| 标称负供电电压 (Vsup) | -15 V | -15 V | -15 V | -15 V | -15 V |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 7 | 14 | 16 | 14 | 14 |
| 封装主体材料 | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | DIE | DIP | SOP | DIP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | UNCASED CHIP | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 采样并保持/跟踪并保持 | SAMPLE | SAMPLE | SAMPLE | SAMPLE | SAMPLE |
| 供电电压上限 | 18 V | 18 V | 18 V | 36 V | 18 V |
| 标称供电电压 (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V |
| 表面贴装 | YES | NO | YES | NO | NO |
| 端子形式 | NO LEAD | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE |
| 端子位置 | UPPER | DUAL | DUAL | DUAL | DUAL |
| 是否Rohs认证 | 不符合 | 符合 | 符合 | - | 不符合 |
| 厂商名称 | ADI(亚德诺半导体) | - | - | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
| ECCN代码 | EAR99 | EAR99 | EAR99 | - | EAR99 |
| 标称采集时间 | 3.5 µs | 5 µs | 5 µs | - | 5 µs |
| JESD-609代码 | e0 | e3 | e3 | - | e0 |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT APPLICABLE | 260 | - | - |
| 端子面层 | TIN LEAD | Matte Tin (Sn) | MATTE TIN | - | Tin/Lead (Sn/Pb) |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT APPLICABLE | 40 | - | - |
| 长度 | - | 19.305 mm | 10.3 mm | - | 19.43 mm |
| 最高工作温度 | - | 85 °C | 85 °C | 125 °C | 125 °C |
| 最低工作温度 | - | -40 °C | -40 °C | -55 °C | -55 °C |
| 座面最大高度 | - | 5.33 mm | 2.65 mm | - | 5.08 mm |
| 温度等级 | - | INDUSTRIAL | INDUSTRIAL | MILITARY | MILITARY |
| 端子节距 | - | 2.54 mm | 1.27 mm | - | 2.54 mm |
| 宽度 | - | 7.62 mm | 7.5 mm | - | 7.62 mm |
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