
Single 3-Input Positive-OR Gate 6-SON -40 to 125
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 包装说明 | VSON, |
| Reach Compliance Code | compli |
| Factory Lead Time | 8 weeks |
| 系列 | LVC/LCX/Z |
| JESD-30 代码 | S-PDSO-N6 |
| JESD-609代码 | e4 |
| 长度 | 1 mm |
| 逻辑集成电路类型 | OR GATE |
| 最大I(ol) | 0.032 A |
| 湿度敏感等级 | 1 |
| 功能数量 | 1 |
| 输入次数 | 3 |
| 端子数量 | 6 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | VSON |
| 封装形状 | SQUARE |
| 封装形式 | SMALL OUTLINE, VERY THIN PROFILE |
| 峰值回流温度(摄氏度) | 260 |
| 传播延迟(tpd) | 20 ns |
| 座面最大高度 | 0.4 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 1.65 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.35 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 1 mm |
| SN74LVC1G332DSF2 | SN74LVC1G332YZPR | SN74LVC1G332DCKR | SN74LVC1G332DCKRG4 | SN74LVC1G332DRLR | 74LVC1G332DBVRG4 | 74LVC1G332DCKRE4 | SN74LVC1G332DRYR | SN74LVC1G332DSFR | SN74LVC1G332DRY2 | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | Single 3-Input Positive-OR Gate 6-SON -40 to 125 | Single 3-Input Positive-OR Gate 6-DSBGA -40 to 85 | Single 3-Input Positive-OR Gate 6-SC70 -40 to 125 | Single 3-Input Positive-OR Gate 6-SC70 -40 to 125 | Single 3-Input Positive-OR Gate 6-SOT-5X3 -40 to 125 | Single 3-Input Positive-OR Gate 6-SOT-23 -40 to 125 | Single 3-Input Positive-OR Gate 6-SC70 -40 to 125 | Single 3-Input Positive-OR Gate 6-SON -40 to 125 | Single 3-Input Positive-OR Gate 6-SON -40 to 125 | Single 3-Input Positive-OR Gate 6-SON -40 to 125 |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 包装说明 | VSON, | VFBGA, BGA6,2X3,20 | TSSOP, TSSOP6,.08 | TSSOP, TSSOP6,.08 | VSOF, FL6,.047,20 | LSSOP, TSOP6,.11,37 | TSSOP, TSSOP6,.08 | VSON, SOLCC6,.04,20 | VSON, SOLCC6,.04,14 | VSON, |
| Reach Compliance Code | compli | compli | compli | compli | compli | compli | compli | compli | compli | compli |
| Factory Lead Time | 8 weeks | 1 week | 1 week | 1 week | 1 week | 6 weeks | 6 weeks | 1 week | 1 week | 6 weeks |
| 系列 | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z |
| JESD-30 代码 | S-PDSO-N6 | R-XBGA-B6 | R-PDSO-G6 | R-PDSO-G6 | R-PDSO-F6 | R-PDSO-G6 | R-PDSO-G6 | R-PDSO-N6 | S-PDSO-N6 | R-PDSO-N6 |
| JESD-609代码 | e4 | e1 | e4 | e4 | e4 | e4 | e4 | e4 | e4 | e4 |
| 长度 | 1 mm | 1.4 mm | 2 mm | 2 mm | 1.6 mm | 2.9 mm | 2 mm | 1.45 mm | 1 mm | 1.45 mm |
| 逻辑集成电路类型 | OR GATE | OR GATE | OR GATE | OR GATE | OR GATE | OR GATE | OR GATE | OR GATE | OR GATE | OR GATE |
| 最大I(ol) | 0.032 A | 0.032 A | 0.032 A | 0.032 A | 0.032 A | 0.032 A | 0.032 A | 0.032 A | 0.032 A | 0.032 A |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 输入次数 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
| 端子数量 | 6 | 6 | 6 | 6 | 6 | 6 | 6 | 6 | 6 | 6 |
| 最高工作温度 | 125 °C | 85 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | VSON | VFBGA | TSSOP | TSSOP | VSOF | LSSOP | TSSOP | VSON | VSON | VSON |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, VERY THIN PROFILE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE |
| 峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
| 传播延迟(tpd) | 20 ns | 17.2 ns | 20 ns | 17.2 ns | 17.2 ns | 17.2 ns | 17.2 ns | 17.2 ns | 17.2 ns | 20 ns |
| 座面最大高度 | 0.4 mm | 0.5 mm | 1.1 mm | 1.1 mm | 0.6 mm | 1.45 mm | 1.1 mm | 0.6 mm | 0.4 mm | 0.6 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V |
| 标称供电电压 (Vsup) | 3.3 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | INDUSTRIAL | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin/Silver/Copper (Sn/Ag/Cu) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | NO LEAD | BALL | GULL WING | GULL WING | FLAT | GULL WING | GULL WING | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | 0.35 mm | 0.5 mm | 0.65 mm | 0.65 mm | 0.5 mm | 0.95 mm | 0.65 mm | 0.5 mm | 0.35 mm | 0.5 mm |
| 端子位置 | DUAL | BOTTOM | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 1 mm | 0.9 mm | 1.25 mm | 1.25 mm | 1.2 mm | 1.6 mm | 1.25 mm | 1 mm | 1 mm | 1 mm |
| 零件包装代码 | - | BGA | SOIC | SOIC | SOT | SOT-23 | SOIC | SON | SON | - |
| 针数 | - | 6 | 6 | 6 | 6 | 6 | 6 | 6 | 6 | - |
| ECCN代码 | - | EAR99 | EAR99 | EAR99 | EAR99 | - | - | EAR99 | EAR99 | EAR99 |
| 负载电容(CL) | - | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | - |
| 封装等效代码 | - | BGA6,2X3,20 | TSSOP6,.08 | TSSOP6,.08 | FL6,.047,20 | TSOP6,.11,37 | TSSOP6,.08 | SOLCC6,.04,20 | SOLCC6,.04,14 | - |
| 包装方法 | - | TR | TR | TR | TR | TR | TR | TR | TR | - |
| 电源 | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - |
| 最大电源电流(ICC) | - | 0.01 mA | 0.01 mA | 0.01 mA | 0.01 mA | 0.01 mA | 0.01 mA | 0.01 mA | 0.01 mA | - |
| Prop。Delay @ Nom-Su | - | 4.8 ns | 20 ns | 4.8 ns | 4.8 ns | 4.8 ns | 4.8 ns | 4.8 ns | 4.8 ns | - |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
| 施密特触发器 | - | NO | NO | NO | NO | NO | NO | NO | NO | - |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved