Flash, 32KX8, 90ns, PDSO32, 8 X 14 MM, LEAD FREE, MO-142BA, TSOP1-32
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Silicon Laboratories Inc |
| 零件包装代码 | TSOP1 |
| 包装说明 | TSOP1, TSSOP32,.56,20 |
| 针数 | 32 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 最长访问时间 | 90 ns |
| 命令用户界面 | NO |
| 数据轮询 | NO |
| JESD-30 代码 | R-PDSO-G32 |
| 长度 | 12.4 mm |
| 内存密度 | 262144 bit |
| 内存集成电路类型 | FLASH |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 32 |
| 字数 | 32768 words |
| 字数代码 | 32000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 32KX8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSOP1 |
| 封装等效代码 | TSSOP32,.56,20 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE |
| 并行/串行 | PARALLEL |
| 电源 | 5 V |
| 编程电压 | 12 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.2 mm |
| 最大待机电流 | 0.0001 A |
| 最大压摆率 | 0.03 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 切换位 | NO |
| 宽度 | 8 mm |

| SST27SF256-90-3C-WHE | SST27SF256-70-3C-PGE | SST27SF256-90-3C-NHE | SST27SF256-90-3C-PGE | SST27SF256-70-3C-NHE | SST27SF256-70-3C-WHE | |
|---|---|---|---|---|---|---|
| 描述 | Flash, 32KX8, 90ns, PDSO32, 8 X 14 MM, LEAD FREE, MO-142BA, TSOP1-32 | Flash, 32KX8, 70ns, PDIP28, LEAD FREE, PLASTIC, MO-015AH, DIP-28 | Flash, 32KX8, 90ns, PQCC32, LEAD FREE, PLASTIC, MO-016AE, LCC-32 | Flash, 32KX8, 90ns, PDIP28, LEAD FREE, PLASTIC, MO-015AH, DIP-28 | Flash, 32KX8, 70ns, PQCC32, LEAD FREE, PLASTIC, MO-016AE, LCC-32 | Flash, 32KX8, 70ns, PDSO32, 8 X 14 MM, LEAD FREE, MO-142BA, TSOP1-32 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Silicon Laboratories Inc | Silicon Laboratories Inc | Silicon Laboratories Inc | Silicon Laboratories Inc | Silicon Laboratories Inc | Silicon Laboratories Inc |
| 零件包装代码 | TSOP1 | DIP | QFJ | DIP | QFJ | TSOP1 |
| 包装说明 | TSOP1, TSSOP32,.56,20 | DIP, DIP28,.6 | QCCJ, LDCC32,.5X.6 | DIP, DIP28,.6 | QCCJ, LDCC32,.5X.6 | TSOP1, TSSOP32,.56,20 |
| 针数 | 32 | 28 | 32 | 28 | 32 | 32 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 90 ns | 70 ns | 90 ns | 90 ns | 70 ns | 70 ns |
| 命令用户界面 | NO | NO | NO | NO | NO | NO |
| 数据轮询 | NO | NO | NO | NO | NO | NO |
| JESD-30 代码 | R-PDSO-G32 | R-PDIP-T28 | R-PQCC-J32 | R-PDIP-T28 | R-PQCC-J32 | R-PDSO-G32 |
| 长度 | 12.4 mm | 36.83 mm | 13.97 mm | 36.83 mm | 13.97 mm | 12.4 mm |
| 内存密度 | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit |
| 内存集成电路类型 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 32 | 28 | 32 | 28 | 32 | 32 |
| 字数 | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words |
| 字数代码 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSOP1 | DIP | QCCJ | DIP | QCCJ | TSOP1 |
| 封装等效代码 | TSSOP32,.56,20 | DIP28,.6 | LDCC32,.5X.6 | DIP28,.6 | LDCC32,.5X.6 | TSSOP32,.56,20 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE | IN-LINE | CHIP CARRIER | IN-LINE | CHIP CARRIER | SMALL OUTLINE, THIN PROFILE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 编程电压 | 12 V | 12 V | 12 V | 12 V | 12 V | 12 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | 5.08 mm | 3.556 mm | 5.08 mm | 3.556 mm | 1.2 mm |
| 最大待机电流 | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A | 0.0001 A |
| 最大压摆率 | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | YES | NO | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | GULL WING | THROUGH-HOLE | J BEND | THROUGH-HOLE | J BEND | GULL WING |
| 端子节距 | 0.5 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 0.5 mm |
| 端子位置 | DUAL | DUAL | QUAD | DUAL | QUAD | DUAL |
| 切换位 | NO | NO | NO | NO | NO | NO |
| 宽度 | 8 mm | 15.24 mm | 11.43 mm | 15.24 mm | 11.43 mm | 8 mm |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved