UPD703101GJ-33-XXX-UEN-A
| 参数名称 | 属性值 |
| Brand Name | Renesas |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Renesas(瑞萨电子) |
| 零件包装代码 | LFQFP |
| 针数 | 144 |
| 制造商包装代码 | PLQP0144KD-D144 |
| Reach Compliance Code | compliant |
| ECCN代码 | 3A991.A.2 |
| 位大小 | 32 |
| CPU系列 | V850 |
| JESD-30 代码 | S-PQFP-G144 |
| 端子数量 | 144 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QFP |
| 封装等效代码 | QFP144,.87SQ,20 |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK |
| 电源 | 3.3,5 V |
| 认证状态 | Not Qualified |
| RAM（字节） | 4096 |
| ROM（单词） | 98304 |
| ROM可编程性 | MROM |
| 速度 | 33 MHz |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| UPD703101GJ-33-XXX-UEN-A | UPD70F3102GJ-33-8EU-A | UPD703100GJ-33-UEN-A | UPD703100AGJ-40-UEN-A | UPD703100AGJ-33-UEN-A | UPD703100AF1-33-FA3-A | UPD70F3102AGJ-33-8EU-A | UPD703100GJ-40-UEN-A | UPD703102AGJ-33-XXX-UEN-A | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | UPD703101GJ-33-XXX-UEN-A | UPD70F3102GJ-33-8EU-A | UPD703100GJ-33-UEN-A | UPD703100AGJ-40-UEN-A | UPD703100AGJ-33-UEN-A | UPD703100AF1-33-FA3-A | UPD70F3102AGJ-33-8EU-A | UPD703100GJ-40-UEN-A | UPD703102AGJ-33-XXX-UEN-A |
| Brand Name | Renesas | Renesas | Renesas | Renesas | Renesas | Renesas | Renesas | Renesas | Renesas |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | LFQFP | LFQFP | LFQFP | LFQFP | LFQFP | LFBGA | LFQFP | LFQFP | LFQFP |
| 针数 | 144 | 144 | 144 | 144 | 144 | 157 | 144 | 144 | 144 |
| 制造商包装代码 | PLQP0144KD-D144 | PLQP0144KD-C144 | PLQP0144KD-D144 | PLQP0144KD-D144 | PLQP0144KD-D144 | PLBG0157GA-A157 | PLQP0144KD-C144 | PLQP0144KD-D144 | PLQP0144KD-D144 |
| Reach Compliance Code | compliant | compliant | compliant | unknown | compliant | compliant | compliant | compliant | compli |
| 厂商名称 | Renesas(瑞萨电子) | - | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) |
| ECCN代码 | 3A991.A.2 | 3A991.A.2 | - | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 | 3A991.A.2 |
| 位大小 | 32 | - | 32 | 32 | 32 | 32 | - | - | 32 |
| CPU系列 | V850 | - | V850 | - | V850 | V850 | - | - | V850 |
| JESD-30 代码 | S-PQFP-G144 | - | S-PQFP-G144 | S-PQFP-G144 | S-PQFP-G144 | S-PBGA-B157 | - | - | S-PQFP-G144 |
| 端子数量 | 144 | - | 144 | 144 | 144 | 157 | - | - | 144 |
| 最高工作温度 | 85 °C | - | 85 °C | 70 °C | 85 °C | 85 °C | - | - | 85 °C |
| 最低工作温度 | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C | - | - | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY |
| 封装代码 | QFP | - | LFQFP | LFQFP | LFQFP | LFBGA | - | - | QFP |
| 封装等效代码 | QFP144,.87SQ,20 | - | QFP144,.87SQ,20 | - | QFP144,.87SQ,20 | BGA157,16X16,32 | - | - | QFP144,.87SQ,20 |
| 封装形状 | SQUARE | - | SQUARE | SQUARE | SQUARE | SQUARE | - | - | SQUARE |
| 封装形式 | FLATPACK | - | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | - | - | FLATPACK |
| 电源 | 3.3,5 V | - | 3.3,5 V | - | 3.3 V | 3.3 V | - | - | 3.3 V |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | - | Not Qualified |
| RAM（字节） | 4096 | - | 4096 | - | 4096 | 4096 | - | - | 4096 |
| 速度 | 33 MHz | - | 33 MHz | 40 MHz | 33 MHz | 33 MHz | - | - | 33 MHz |
| 表面贴装 | YES | - | YES | YES | YES | YES | - | - | YES |
| 技术 | CMOS | - | CMOS | MOS | MOS | MOS | - | - | CMOS |
| 温度等级 | INDUSTRIAL | - | INDUSTRIAL | OTHER | INDUSTRIAL | INDUSTRIAL | - | - | INDUSTRIAL |
| 端子形式 | GULL WING | - | GULL WING | GULL WING | GULL WING | BALL | - | - | GULL WING |
| 端子节距 | 0.5 mm | - | 0.5 mm | 0.5 mm | 0.5 mm | 0.8 mm | - | - | 0.5 mm |
| 端子位置 | QUAD | - | QUAD | QUAD | QUAD | BOTTOM | - | - | QUAD |
| 包装说明 | - | LFQFP, QFP144,.87SQ,20 | LFQFP, QFP144,.87SQ,20 | LFQFP, | LFQFP, QFP144,.87SQ,20 | LFBGA, BGA157,16X16,32 | LFQFP, QFP144,.87SQ,20 | LFQFP, | - |
| 标称供电电压 | - | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - | - | 3.3 V |
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