IC 16-BIT, DSP-MULTIPLIER ACCUMULATOR/SUMMER, CDIP64, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-64, DSP Peripheral
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | ADI(亚德诺半导体) |
| 零件包装代码 | DIP |
| 包装说明 | HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-64 |
| 针数 | 64 |
| Reach Compliance Code | unknown |
| ECCN代码 | 3A001.A.2.C |
| 边界扫描 | NO |
| 外部数据总线宽度 | 16 |
| JESD-30 代码 | R-CDIP-T64 |
| JESD-609代码 | e0 |
| 长度 | 81.28 mm |
| 低功率模式 | NO |
| 端子数量 | 64 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出数据总线宽度 | 35 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP |
| 封装等效代码 | DIP64,.9 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 4.29 mm |
| 最大压摆率 | 100 mA |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 22.86 mm |
| uPs/uCs/外围集成电路类型 | DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER |
| ADSP-1010ASD/+ | ADSP-1010ATE/+ | ADSP-1010ATG/+ | ADSP-1010ASG/+ | ADSP-1010ASE/+ | ADSP-1010ATD/+ | |
|---|---|---|---|---|---|---|
| 描述 | IC 16-BIT, DSP-MULTIPLIER ACCUMULATOR/SUMMER, CDIP64, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-64, DSP Peripheral | IC 16-BIT, DSP-MULTIPLIER ACCUMULATOR/SUMMER, CQCC68, LCC-68, DSP Peripheral | IC 16-BIT, DSP-MULTIPLIER ACCUMULATOR/SUMMER, CPGA68, HERMETIC SEALED, PGA-68, DSP Peripheral | IC 16-BIT, DSP-MULTIPLIER ACCUMULATOR/SUMMER, CPGA68, HERMETIC SEALED, PGA-68, DSP Peripheral | IC 16-BIT, DSP-MULTIPLIER ACCUMULATOR/SUMMER, CQCC68, LCC-68, DSP Peripheral | IC 16-BIT, DSP-MULTIPLIER ACCUMULATOR/SUMMER, CDIP64, HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-64, DSP Peripheral |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
| 零件包装代码 | DIP | LCC | PGA | PGA | LCC | DIP |
| 包装说明 | HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-64 | LCC-68 | HERMETIC SEALED, PGA-68 | HERMETIC SEALED, PGA-68 | LCC-68 | HERMETIC SEALED, SIDE BRAZED, CERAMIC, DIP-64 |
| 针数 | 64 | 68 | 68 | 68 | 68 | 64 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | compliant |
| ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| 边界扫描 | NO | NO | NO | NO | NO | NO |
| 外部数据总线宽度 | 16 | 16 | 16 | 16 | 16 | 16 |
| JESD-30 代码 | R-CDIP-T64 | S-CQCC-N68 | S-CPGA-P68 | S-CPGA-P68 | S-CQCC-N68 | R-CDIP-T64 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 81.28 mm | 24.195 mm | 27.81 mm | 27.81 mm | 24.195 mm | 81.28 mm |
| 低功率模式 | NO | NO | NO | NO | NO | NO |
| 端子数量 | 64 | 68 | 68 | 68 | 68 | 64 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出数据总线宽度 | 35 | 35 | 35 | 35 | 35 | 35 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP | QCCN | PGA | PGA | QCCN | DIP |
| 封装形状 | RECTANGULAR | SQUARE | SQUARE | SQUARE | SQUARE | RECTANGULAR |
| 封装形式 | IN-LINE | CHIP CARRIER | GRID ARRAY | GRID ARRAY | CHIP CARRIER | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 4.29 mm | 2.62 mm | 4.17 mm | 4.17 mm | 2.62 mm | 4.29 mm |
| 最大压摆率 | 100 mA | 100 mA | 100 mA | 100 mA | 100 mA | 100 mA |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | NO | NO | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | NO LEAD | PIN/PEG | PIN/PEG | NO LEAD | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | QUAD | PERPENDICULAR | PERPENDICULAR | QUAD | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 22.86 mm | 24.195 mm | 27.81 mm | 27.81 mm | 24.195 mm | 22.86 mm |
| uPs/uCs/外围集成电路类型 | DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER | DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER | DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER | DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER | DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER | DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER |
| 封装等效代码 | DIP64,.9 | LCC68,.95SQ | PGA68,11X11 | PGA68,11X11 | LCC68,.95SQ | - |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | - |
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