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IDT71V016S12BF: 产品描述Standard SRAM, 64KX16, 12ns, CMOS, PBGA48, 7 X 7 MM, FBGA-48; 产品类别存储存储; 文件大小105KB，共8页; 制造商IDT (Integrated Device Technology)

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IDT71V016S12BF概述

Standard SRAM, 64KX16, 12ns, CMOS, PBGA48, 7 X 7 MM, FBGA-48

IDT71V016S12BF规格参数

参数名称	属性值
是否无铅	含铅
是否Rohs认证	不符合
厂商名称	IDT (Integrated Device Technology)
零件包装代码	BGA
包装说明	LFBGA,
针数	48
Reach Compliance Code	compliant
ECCN代码	3A991.B.2.B
最长访问时间	12 ns
JESD-30 代码	S-PBGA-B48
JESD-609代码	e0
长度	7 mm
内存密度	1048576 bit
内存集成电路类型	STANDARD SRAM
内存宽度	16
湿度敏感等级	3
功能数量	1
端子数量	48
字数	65536 words
字数代码	64000
工作模式	ASYNCHRONOUS
最高工作温度	70 °C
最低工作温度
组织	64KX16
封装主体材料	PLASTIC/EPOXY
封装代码	LFBGA
封装形状	SQUARE
封装形式	GRID ARRAY, LOW PROFILE, FINE PITCH
并行/串行	PARALLEL
峰值回流温度（摄氏度）	225
认证状态	Not Qualified
座面最大高度	1.34 mm
最大供电电压 (Vsup)	3.6 V
最小供电电压 (Vsup)	3 V
标称供电电压 (Vsup)	3.3 V
表面贴装	YES
技术	CMOS
温度等级	COMMERCIAL
端子面层	TIN LEAD
端子形式	BALL
端子节距	0.75 mm
端子位置	BOTTOM
处于峰值回流温度下的最长时间	20
宽度	7 mm

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3.3V CMOS STATIC RAM

1 MEG (64K x 16-BIT)

Integrated Device Technology, Inc.

PRELIMINARY

IDT71V016

FEATURES:

• 64K x 16 advanced high-speed CMOS Static RAM

• Commercial (0˚ to 70˚C) and Industrial (-40˚C to 85˚C)

• Equal access and cycle times

— Commercial and Industrial: 12/15/20ns

• One Chip Select plus one Output Enable pin

• Bidirectional data inputs and outputs directly

TTL-compatible

• Low power consumption via chip deselect

• Upper and Lower Byte Enable Pins

• Single 3.3V(±0.3V) power supply

• Available in 44-pin Plastic SOJ and 44-pin TSOP

package and 48-BALL Plastic FBGA

DESCRIPTION:

The IDT71V016 is a 1,048,576-bit high-speed Static RAM

organized as 64K x 16. It is fabricated using IDT’s high-

perfomance, high-reliability CMOS technology. This state-of-

the-art technology, combined with innovative circuit design

techniques, provides a cost-effective solution for high-speed

memory needs.

The IDT71V016 has an output enable pin which operates

as fast as 7ns, with address access times as fast as 12ns. All

bidirectional inputs and outputs of the IDT71V016 are TTL-

compatible and operation is from a single 3.3V supply. Fully

static asynchronous circuitry is used, requiring no clocks or

refresh for operation.

The IDT71V016 is packaged in a JEDEC standard 44-pin

Plastic SOJ and 44-pin TSOP Type II and 48-BALL 7 x 7 mm

Plastic FBGA .

FUNCTIONAL BLOCK DIAGRAM

Output

Enable

Buffer

A0 - A15

Address

Buffers

Row / Column

Decoders

I/O 15

Chip

Enable

Buffer

High

Byte

I/O

Buffer

I/O 8

Write

Enable

Buffer

64K x 16

Memory

Array

Sense

Amps

and

Write

Drivers

I/O 7

Low

Byte

I/O

Buffer

I/O 0

BHE

Byte

Enable

Buffers

BLE

The IDT logo is a registered trademark of Integrated Device Technology, Inc.

3211 drw 01

INDUSTRIAL AND COMMERCIAL TEMPERATURE RANGES

JULY 1998

DSC-3211/5

IDT71V016S12BF相似产品对比

	IDT71V016S12BF	IDT71V016S12PH	IDT71V016S12BFI	IDT71V016S20BF	IDT71V016S20BFI	IDT71V016S12Y	IDT71V016S12PHI	IDT71V016S12YI
描述	Standard SRAM, 64KX16, 12ns, CMOS, PBGA48, 7 X 7 MM, FBGA-48	Standard SRAM, 64KX16, 12ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44	Standard SRAM, 64KX16, 12ns, CMOS, PBGA48, 7 X 7 MM, FBGA-48	Standard SRAM, 64KX16, 20ns, CMOS, PBGA48, 7 X 7 MM, FBGA-48	Standard SRAM, 64KX16, 20ns, CMOS, PBGA48, 7 X 7 MM, FBGA-48	Standard SRAM, 64KX16, 12ns, CMOS, PDSO44, 0.400 INCH, SO-44	Standard SRAM, 64KX16, 12ns, CMOS, PDSO44, 0.400 INCH, TSOP2-44	Standard SRAM, 64KX16, 12ns, CMOS, PDSO44, 0.400 INCH, SO-44
是否Rohs认证	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合
厂商名称	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)
零件包装代码	BGA	TSOP2	BGA	BGA	BGA	SOIC	TSOP2	SOIC
包装说明	LFBGA,	0.400 INCH, TSOP2-44	LFBGA,	LFBGA,	LFBGA,	0.400 INCH, SO-44	TSOP2,	SOJ,
针数	48	44	48	48	48	44	44	44
Reach Compliance Code	compliant	not_compliant	compliant	compliant	compliant	not_compliant	compliant	compli
ECCN代码	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B	3A991.B.2.B
最长访问时间	12 ns	12 ns	12 ns	20 ns	20 ns	12 ns	12 ns	12 ns
JESD-30 代码	S-PBGA-B48	R-PDSO-G44	S-PBGA-B48	S-PBGA-B48	S-PBGA-B48	R-PDSO-J44	R-PDSO-G44	R-PDSO-J44
JESD-609代码	e0	e0	e0	e0	e0	e0	e0	e0
长度	7 mm	18.41 mm	7 mm	7 mm	7 mm	28.575 mm	18.41 mm	28.575 mm
内存密度	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bit	1048576 bi
内存集成电路类型	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM	STANDARD SRAM
内存宽度	16	16	16	16	16	16	16	16
功能数量	1	1	1	1	1	1	1	1
端子数量	48	44	48	48	48	44	44	44
字数	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words
字数代码	64000	64000	64000	64000	64000	64000	64000	64000
工作模式	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	70 °C	70 °C	85 °C	70 °C	85 °C	70 °C	85 °C	85 °C
组织	64KX16	64KX16	64KX16	64KX16	64KX16	64KX16	64KX16	64KX16
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	LFBGA	TSOP2	LFBGA	LFBGA	LFBGA	SOJ	TSOP2	SOJ
封装形状	SQUARE	RECTANGULAR	SQUARE	SQUARE	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	GRID ARRAY, LOW PROFILE, FINE PITCH	SMALL OUTLINE, THIN PROFILE	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	1.34 mm	1.2 mm	1.34 mm	1.34 mm	1.34 mm	3.683 mm	1.2 mm	3.683 mm
最大供电电压 (Vsup)	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
最小供电电压 (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
标称供电电压 (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL
端子面层	TIN LEAD	Tin/Lead (Sn85Pb15)	TIN LEAD	TIN LEAD	TIN LEAD	Tin/Lead (Sn85Pb15)	TIN LEAD	TIN LEAD
端子形式	BALL	GULL WING	BALL	BALL	BALL	J BEND	GULL WING	J BEND
端子节距	0.75 mm	0.8 mm	0.75 mm	0.75 mm	0.75 mm	1.27 mm	0.8 mm	1.27 mm
端子位置	BOTTOM	DUAL	BOTTOM	BOTTOM	BOTTOM	DUAL	DUAL	DUAL
宽度	7 mm	10.16 mm	7 mm	7 mm	7 mm	10.16 mm	10.16 mm	10.16 mm
是否无铅	含铅	-	含铅	含铅	含铅	-	含铅	含铅
湿度敏感等级	3	3	3	3	3	3	3	-
峰值回流温度（摄氏度）	225	-	225	225	225	-	225	225
处于峰值回流温度下的最长时间	20	-	20	20	20	-	20	30

IDT71V016S12BF

IDT71V016S12BF概述

IDT71V016S12BF规格参数

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IDT71V016S12BF相似产品对比

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