Flash Module, 6MX16, PBGA88, 8 X 10 MM, 0.80 MM PITCH, TFBGA-88
| 参数名称 | 属性值 |
| 厂商名称 | Numonyx ( Micron ) |
| 零件包装代码 | BGA |
| 包装说明 | 8 X 10 MM, 0.80 MM PITCH, TFBGA-88 |
| 针数 | 88 |
| Reach Compliance Code | unknown |
| ECCN代码 | 3A991.B.1.A |
| 其他特性 | SYNCHRONOUS BURST MODE OPERATION POSSIBLE |
| 启动块 | TOP |
| JESD-30 代码 | R-PBGA-B88 |
| 长度 | 10 mm |
| 内存密度 | 100663296 bit |
| 内存集成电路类型 | FLASH MODULE |
| 内存宽度 | 16 |
| 功能数量 | 1 |
| 端子数量 | 88 |
| 字数 | 6291456 words |
| 字数代码 | 6000000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 6MX16 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LFBGA |
| 封装形状 | RECTANGULAR |
| 封装形式 | GRID ARRAY, LOW PROFILE, FINE PITCH |
| 并行/串行 | PARALLEL |
| 编程电压 | 3.3 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.4 mm |
| 最大供电电压 (Vsup) | 2.2 V |
| 最小供电电压 (Vsup) | 1.7 V |
| 标称供电电压 (Vsup) | 1.8 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | BALL |
| 端子节距 | 0.8 mm |
| 端子位置 | BOTTOM |
| 类型 | NOR TYPE |
| 宽度 | 8 mm |
| M30W0R6500T0ZAQT | M30W0R6500T0ZAQE | M30W0R6500T0ZAQ | M30W0R6500T0ZAQF | |
|---|---|---|---|---|
| 描述 | Flash Module, 6MX16, PBGA88, 8 X 10 MM, 0.80 MM PITCH, TFBGA-88 | Flash Module, 6MX16, PBGA88, 8 X 10 MM, 0.80 MM PITCH, LEAD FREE, TFBGA-88 | Flash Module, 6MX16, PBGA88, 8 X 10 MM, 0.80 MM PITCH, TFBGA-88 | Flash Module, 6MX16, PBGA88, 8 X 10 MM, 0.80 MM PITCH, LEAD FREE, TFBGA-88 |
| 厂商名称 | Numonyx ( Micron ) | Numonyx ( Micron ) | Numonyx ( Micron ) | Numonyx ( Micron ) |
| 零件包装代码 | BGA | BGA | BGA | BGA |
| 包装说明 | 8 X 10 MM, 0.80 MM PITCH, TFBGA-88 | 8 X 10 MM, 0.80 MM PITCH, LEAD FREE, TFBGA-88 | 8 X 10 MM, 0.80 MM PITCH, TFBGA-88 | 8 X 10 MM, 0.80 MM PITCH, LEAD FREE, TFBGA-88 |
| 针数 | 88 | 88 | 88 | 88 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| ECCN代码 | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A |
| 其他特性 | SYNCHRONOUS BURST MODE OPERATION POSSIBLE | SYNCHRONOUS BURST MODE OPERATION POSSIBLE | SYNCHRONOUS BURST MODE OPERATION POSSIBLE | SYNCHRONOUS BURST MODE OPERATION POSSIBLE |
| 启动块 | TOP | TOP | TOP | TOP |
| JESD-30 代码 | R-PBGA-B88 | R-PBGA-B88 | R-PBGA-B88 | R-PBGA-B88 |
| 长度 | 10 mm | 10 mm | 10 mm | 10 mm |
| 内存密度 | 100663296 bit | 100663296 bit | 100663296 bit | 100663296 bit |
| 内存集成电路类型 | FLASH MODULE | FLASH MODULE | FLASH MODULE | FLASH MODULE |
| 内存宽度 | 16 | 16 | 16 | 16 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 88 | 88 | 88 | 88 |
| 字数 | 6291456 words | 6291456 words | 6291456 words | 6291456 words |
| 字数代码 | 6000000 | 6000000 | 6000000 | 6000000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 6MX16 | 6MX16 | 6MX16 | 6MX16 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LFBGA | LFBGA | LFBGA | LFBGA |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 编程电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.4 mm | 1.4 mm | 1.4 mm | 1.4 mm |
| 最大供电电压 (Vsup) | 2.2 V | 2.2 V | 2.2 V | 2.2 V |
| 最小供电电压 (Vsup) | 1.7 V | 1.7 V | 1.7 V | 1.7 V |
| 标称供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| 表面贴装 | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | BALL | BALL | BALL | BALL |
| 端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
| 端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 类型 | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE |
| 宽度 | 8 mm | 8 mm | 8 mm | 8 mm |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
