Flash Module, 6MX16, PBGA88, 8 X 10 MM, 0.80 MM PITCH, LEAD FREE, TFBGA-88
参数名称 | 属性值 |
厂商名称 | Numonyx ( Micron ) |
零件包装代码 | BGA |
包装说明 | 8 X 10 MM, 0.80 MM PITCH, LEAD FREE, TFBGA-88 |
针数 | 88 |
Reach Compliance Code | unknown |
ECCN代码 | 3A991.B.1.A |
其他特性 | SYNCHRONOUS BURST MODE OPERATION POSSIBLE |
启动块 | TOP |
JESD-30 代码 | R-PBGA-B88 |
JESD-609代码 | e1 |
长度 | 10 mm |
内存密度 | 100663296 bit |
内存集成电路类型 | FLASH MODULE |
内存宽度 | 16 |
功能数量 | 1 |
端子数量 | 88 |
字数 | 6291456 words |
字数代码 | 6000000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
组织 | 6MX16 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | LFBGA |
封装形状 | RECTANGULAR |
封装形式 | GRID ARRAY, LOW PROFILE, FINE PITCH |
并行/串行 | PARALLEL |
峰值回流温度(摄氏度) | 260 |
编程电压 | 3.3 V |
认证状态 | Not Qualified |
座面最大高度 | 1.4 mm |
最大供电电压 (Vsup) | 2.2 V |
最小供电电压 (Vsup) | 1.7 V |
标称供电电压 (Vsup) | 1.8 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | TIN SILVER COPPER |
端子形式 | BALL |
端子节距 | 0.8 mm |
端子位置 | BOTTOM |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
类型 | NOR TYPE |
宽度 | 8 mm |
M30W0R6500T0ZAQF | M30W0R6500T0ZAQE | M30W0R6500T0ZAQT | M30W0R6500T0ZAQ | |
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描述 | Flash Module, 6MX16, PBGA88, 8 X 10 MM, 0.80 MM PITCH, LEAD FREE, TFBGA-88 | Flash Module, 6MX16, PBGA88, 8 X 10 MM, 0.80 MM PITCH, LEAD FREE, TFBGA-88 | Flash Module, 6MX16, PBGA88, 8 X 10 MM, 0.80 MM PITCH, TFBGA-88 | Flash Module, 6MX16, PBGA88, 8 X 10 MM, 0.80 MM PITCH, TFBGA-88 |
厂商名称 | Numonyx ( Micron ) | Numonyx ( Micron ) | Numonyx ( Micron ) | Numonyx ( Micron ) |
零件包装代码 | BGA | BGA | BGA | BGA |
包装说明 | 8 X 10 MM, 0.80 MM PITCH, LEAD FREE, TFBGA-88 | 8 X 10 MM, 0.80 MM PITCH, LEAD FREE, TFBGA-88 | 8 X 10 MM, 0.80 MM PITCH, TFBGA-88 | 8 X 10 MM, 0.80 MM PITCH, TFBGA-88 |
针数 | 88 | 88 | 88 | 88 |
Reach Compliance Code | unknown | unknown | unknown | unknown |
ECCN代码 | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A |
其他特性 | SYNCHRONOUS BURST MODE OPERATION POSSIBLE | SYNCHRONOUS BURST MODE OPERATION POSSIBLE | SYNCHRONOUS BURST MODE OPERATION POSSIBLE | SYNCHRONOUS BURST MODE OPERATION POSSIBLE |
启动块 | TOP | TOP | TOP | TOP |
JESD-30 代码 | R-PBGA-B88 | R-PBGA-B88 | R-PBGA-B88 | R-PBGA-B88 |
长度 | 10 mm | 10 mm | 10 mm | 10 mm |
内存密度 | 100663296 bit | 100663296 bit | 100663296 bit | 100663296 bit |
内存集成电路类型 | FLASH MODULE | FLASH MODULE | FLASH MODULE | FLASH MODULE |
内存宽度 | 16 | 16 | 16 | 16 |
功能数量 | 1 | 1 | 1 | 1 |
端子数量 | 88 | 88 | 88 | 88 |
字数 | 6291456 words | 6291456 words | 6291456 words | 6291456 words |
字数代码 | 6000000 | 6000000 | 6000000 | 6000000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
组织 | 6MX16 | 6MX16 | 6MX16 | 6MX16 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | LFBGA | LFBGA | LFBGA | LFBGA |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
编程电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.4 mm | 1.4 mm | 1.4 mm | 1.4 mm |
最大供电电压 (Vsup) | 2.2 V | 2.2 V | 2.2 V | 2.2 V |
最小供电电压 (Vsup) | 1.7 V | 1.7 V | 1.7 V | 1.7 V |
标称供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
表面贴装 | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子形式 | BALL | BALL | BALL | BALL |
端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
类型 | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE |
宽度 | 8 mm | 8 mm | 8 mm | 8 mm |
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