Datasheet> 器件分类 > 半导体> 嵌入式处理器和控制器> MCIMX27LMJP4A

MCIMX27LMJP4A: 产品描述32-BIT, 400 MHz, MICROPROCESSOR, PBGA473; 产品类别半导体嵌入式处理器和控制器; 文件大小1MB，共153页; 制造商FREESCALE (NXP)

下载文档详细参数选型对比全文预览

MCIMX27LMJP4A在线购买

供应商	器件名称	价格	最低购买	库存
	MCIMX27LMJP4A	-	-	点击查看	点击购买

MCIMX27LMJP4A概述

32-BIT, 400 MHz, MICROPROCESSOR, PBGA473

32位, 400 MHz, 微处理器, PBGA473

MCIMX27LMJP4A规格参数

参数名称	属性值
功能数量	1
端子数量	473
最大工作温度	85 Cel
最小工作温度	-40 Cel
最大供电/工作电压	1.52 V
最小供电/工作电压	1.38 V
额定供电电压	1.45 V
外部数据总线宽度	16
线速度	400 MHz
加工封装描述	19 × 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, 塑料, MAPBGA-473
无铅	Yes
欧盟RoHS规范	Yes
中国RoHS规范	Yes
状态	ACTIVE
包装形状	SQUARE
包装尺寸	GRID 阵列, 低 PROFILE, FINE PITCH
表面贴装	Yes
端子形式	BALL
端子间距	0.8000 mm
端子涂层	锡银铜
端子位置	BOTTOM
包装材料	塑料/环氧树脂
温度等级	INDUSTRIAL
地址总线宽度	26
位数	32
边界扫描	Yes
最大FCLK时钟频率	26 MHz
集成缓存	Yes
低功耗模式	Yes
微处理器类型	微处理器

文档预览

下载PDF文档

全文
预览

Freescale Semiconductor

Data Sheet, Technical Data

Document Number: MCIMX27EC

Rev. 1.7, 05/2011

i.MX27 and i.MX27L

Data Sheet

Multimedia Applications

Processor

Introduction

Package Information

Plastic Package

Case 1816-01

(MAPBGA–404)

Case 1931-04

(MAPBGA-473)

Ordering Information

See

Table 1 on page 4

for ordering information.

The i.MX27 and i.MX27L (MCIMX27/MX27L)

Multimedia Applications Processors represents the next

step in low-power, high-performance application

processors. Unless otherwise specified, the material in

this data sheet is applicable to both the i.MX27 and

i.MX27L processors and referred to singularly

throughout this document as i.MX27.

The i.MX27L does not include the following features:

ATA-6 HDD Interface, Memory Stick Pro, VPU:

MPEG-4/ H.263/H.264 HW encoder/decoder, and

eMMA (PrP processing, CSC, deblock, dering).

Based on an ARM926EJ-S™ microprocessor core, the

i.MX27/27L processor provides the performance with

low-power consumption required by modern digital

devices such as the following:

• Feature-rich cellular phones

• Portable media players and mobile gaming

machines

• Personal digital assistants (PDAs) and wireless

PDAs

Contents

Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

1.2. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

1.3. Ordering Information . . . . . . . . . . . . . . . . . . . . . . 4

Functional Description and Application Information . . . . 4

2.1. ARM926 Microprocessor Core Platform . . . . . . . . 4

2.2. Module Inventory . . . . . . . . . . . . . . . . . . . . . . . . . 5

2.3. Module Descriptions . . . . . . . . . . . . . . . . . . . . . . . 9

Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

3.1. Power-Up Sequence . . . . . . . . . . . . . . . . . . . . . . 35

3.2. EMI Pins Multiplexing . . . . . . . . . . . . . . . . . . . . . 35

Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . 40

4.1. i.MX27/iMX27L Chip-Level Conditions . . . . . . . . 40

4.2. Module-Level Electrical Specifications . . . . . . . . 43

4.3. Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . 54

Package Information and Pinout . . . . . . . . . . . . . . . . 109

5.1. Full Package Outline Drawing (17 mm

× 17

mm) 109

5.2. Pin Assignments (17 mm

17 mm) . . . . . . . . . 110

5.3. Full Package Outline Drawing (19 mm

× 19

mm) 129

5.4. Pin Assignments (19 mm

19 mm) . . . . . . . . . 130

Product Documentation . . . . . . . . . . . . . . . . . . . . . . . 150

Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151

Introduction

•

Portable DVD players

Digital cameras

The i.MX27/MX27L processor features the advanced and power-efficient ARM926EJ-S core operating at

speeds up to 400 MHz, and is optimized for minimal power consumption using the most advanced

techniques for power saving (for example, DPTC, power gating, and clock gating). With 90 nm technology

and dual Vt, the i.MX27/MX27L device provides the optimal performance vs. leakage current balance.

The performance of the i.MX27/MX27L processors are both boosted by an on-chip cache system, and

features peripheral devices, such as an MPEG-4, H.263, an H.264 video codec (up to D1—720 x 486—@

30 FPS), LCD, eMMA_lt, and CMOS Sensor Interface controllers.

The i.MX27/MX27L processors supports connections to various types of external memories, such as

266-MHz DDR, NAND Flash, NOR Flash, SDRAM, and SRAM. The i.MX27/MX27L devices can be

connected to a variety of external devices using technology, such as high-speed USBOTG 2.0, the

Advanced Technology Attachment (ATA), Multimedia/Secure Data (MMC/SDIO), and CompactFlash.

NOTE

The i.MX27L does not support the ATA-6 HDD interface.

1.1

Features

The MX27/MX27L processors are targeted for video and voice over-IP (V2IP) and smart remote

controllers. It also provides low-power solutions for any high-performance and demanding multimedia and

graphics applications.

The systems include the following features:

• Multi-standard video codec (i.MX27 only)

— MPEG-4 part-II simple profile encoding/decoding

— H.264/AVC baseline profile encoding/decoding

— H.263 P3 encoding/decoding

— Multi-party call: one stream encoding and two streams decoding simultaneously

— Multi-format: encodes MPEG-4 bitstream, and decodes H.264 bitstream simultaneously

— On-the-fly video processing that reduces system memory load (for example, the

power-efficient viewfinder application with no involvement of either the memory system or the

ARM CPU)

• Advanced power management (i.MX27/27L)

— Dynamic process and temperature compensation

— Multiple clock and power domains

— Independent gating of power domains

• Multiple communication and expansion ports

i.MX27 and i.MX27L Data Sheet, Rev. 1.7

Freescale Semiconductor

Functional Description and Application Information

1.3

Ordering Information

Table 1. Ordering Information

Device

MCIMX27VOP4A

MCIMX27LVOP4A

MCIMX27MOP4A

MCIMX27LMOP4A

MCIMX27VJP4A

MCIMX27LVJP4A

MCIMX27MJP4A

MCIMX27LMJP4A

Temperature

–20° C to +85° C

–40° C to +85° C

–20° C to +85° C

–40° C to +85° C

Package

1816-01

1931-04

1816-01

1931-04

Table 1

provides ordering information for the MAPBGA, lead-free packages.

2.1

Functional Description and Application Information

ARM926 Microprocessor Core Platform

The ARM926 Platform consists of the ARM926EJ-S processor, ETM9, ETB9, a 6

3 Multi-Layer AHB

crossbar switch (MAX), and a “primary AHB” complex.

• The instruction bus (I-AHB) of the ARM926EJ-S processor is connected directly to MAX Master

Port 0.

• The data bus (D-AHB) of the ARM926EJ-S processor is connected directly to MAX Master Port 1.

Four alternate bus master interfaces are connected to MAX Master Ports 2–5. Three slave ports of the

MAX are AHB-Lite compliant buses. Slave Port 0 is designated as the “primary” AHB. The primary AHB

is internal to the platform and has five slaves connected to it: the AITC interrupt module, the MCTL

memory controller, and two AIPI peripheral interface gaskets. Slave Ports 1 and 2 of the MAX are referred

to as “secondary” AHBs. Each of the secondary AHB interfaces is only accessible off platform.

The ARM926EJ-S processor supports the 32-bit and 16-bit ARM Thumb instruction sets, enabling the

user to trade off between high performance and high-code density. The ARM926EJ-S processor includes

features for efficient execution of Java byte codes, providing Java performance similar to the just-in-time

(JIT) compiler—which is a type of Java compiler—but without the associated code overhead.

The ARM926EJ-S processor supports the ARM debug architecture and includes logic to assist in both

hardware and software debugging. The ARM926EJ-S processor has a Harvard cached architecture and

provides a complete high-performance processor subsystem, including the following:

• An ARM9EJ-S integer core

• A Memory Management Unit (MMU)

• Separate instruction and data AMBA AHB bus interfaces

• ETM and JTAG-based debug support

i.MX27 and i.MX27L Data Sheet, Rev. 1.7

Freescale Semiconductor

MCIMX27LMJP4A相似产品对比

	MCIMX27LMJP4A	I.MX27L_11	I.MX27	MCIMX27LVJP4A
描述	32-BIT, 400 MHz, MICROPROCESSOR, PBGA473	32-BIT, 400 MHz, MICROPROCESSOR, PBGA473	32-BIT, 400 MHz, MICROPROCESSOR, PBGA473	32-BIT, 400 MHz, MICROPROCESSOR, PBGA473
功能数量	1	1	1	1
端子数量	473	473	473	473
最大工作温度	85 Cel	85 Cel	85 Cel	85 Cel
最小工作温度	-40 Cel	-40 Cel	-40 Cel	-40 Cel
最大供电/工作电压	1.52 V	1.52 V	1.52 V	1.52 V
最小供电/工作电压	1.38 V	1.38 V	1.38 V	1.38 V
额定供电电压	1.45 V	1.45 V	1.45 V	1.45 V
外部数据总线宽度	16	16	16	16
线速度	400 MHz	400 MHz	400 MHz	400 MHz
加工封装描述	19 × 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, 塑料, MAPBGA-473	19 × 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, 塑料, MAPBGA-473	19 × 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, 塑料, MAPBGA-473	19 × 19 MM, 0.80 MM PITCH, ROHS COMPLIANT, 塑料, MAPBGA-473
无铅	Yes	Yes	Yes	Yes
欧盟RoHS规范	Yes	Yes	Yes	Yes
中国RoHS规范	Yes	Yes	Yes	Yes
状态	ACTIVE	ACTIVE	ACTIVE	ACTIVE
包装形状	SQUARE	SQUARE	SQUARE	SQUARE
包装尺寸	GRID 阵列, 低 PROFILE, FINE PITCH	GRID 阵列, 低 PROFILE, FINE PITCH	GRID 阵列, 低 PROFILE, FINE PITCH	GRID 阵列, 低 PROFILE, FINE PITCH
表面贴装	Yes	Yes	Yes	Yes
端子形式	BALL	BALL	BALL	BALL
端子间距	0.8000 mm	0.8000 mm	0.8000 mm	0.8000 mm
端子涂层	锡银铜	锡银铜	锡银铜	锡银铜
端子位置	BOTTOM	BOTTOM	BOTTOM	BOTTOM
包装材料	塑料/环氧树脂	塑料/环氧树脂	塑料/环氧树脂	塑料/环氧树脂
温度等级	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
地址总线宽度	26	26	26	26
位数	32	32	32	32
边界扫描	Yes	Yes	Yes	Yes
最大FCLK时钟频率	26 MHz	26 MHz	26 MHz	26 MHz
集成缓存	Yes	Yes	Yes	Yes
低功耗模式	Yes	Yes	Yes	Yes
微处理器类型	微处理器	微处理器	微处理器	微处理器

MCIMX27LMJP4A

MCIMX27LMJP4A在线购买

MCIMX27LMJP4A概述

MCIMX27LMJP4A规格参数

文档预览

MCIMX27LMJP4A相似产品对比

推荐资源