The RX610 Group is an MCU with the high-speed, high-performance RX CPU as its core.
参数名称 | 属性值 |
厂商名称 | Renesas(瑞萨电子) |
零件包装代码 | BGA |
包装说明 | FBGA, BGA176,15X15,32 |
针数 | 176 |
Reach Compliance Code | compli |
ECCN代码 | 3A001.A.3 |
Is Samacsys | N |
具有ADC | YES |
地址总线宽度 | |
位大小 | 64 |
CPU系列 | RX |
最大时钟频率 | 100 MHz |
DAC 通道 | YES |
DMA 通道 | YES |
外部数据总线宽度 | |
JESD-30 代码 | S-PBGA-B176 |
端子数量 | 176 |
最高工作温度 | 85 °C |
最低工作温度 | -20 °C |
PWM 通道 | YES |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | FBGA |
封装等效代码 | BGA176,15X15,32 |
封装形状 | SQUARE |
封装形式 | GRID ARRAY, FINE PITCH |
电源 | 3.3 V |
认证状态 | Not Qualified |
RAM(字节) | 131072 |
ROM(单词) | 1572864 |
ROM可编程性 | FLASH |
速度 | 100 MHz |
最大压摆率 | 100 mA |
最大供电电压 | 3.6 V |
最小供电电压 | 3 V |
标称供电电压 | 3.3 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | OTHER |
端子形式 | BALL |
端子节距 | 0.8 mm |
端子位置 | BOTTOM |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER |
Base Number Matches | 1 |
R5F56107WNBG | R5F56104WNBG | R5F56106WNBG | R5F56108WNBG | R5F56104VNFP | R5F56106VNFP | R5F56107VNFP | R5F56108VNFP | |
---|---|---|---|---|---|---|---|---|
描述 | The RX610 Group is an MCU with the high-speed, high-performance RX CPU as its core. | The RX610 Group is an MCU with the high-speed, high-performance RX CPU as its core. | The RX610 Group is an MCU with the high-speed, high-performance RX CPU as its core. | The RX610 Group is an MCU with the high-speed, high-performance RX CPU as its core. | The RX610 Group is an MCU with the high-speed, high-performance RX CPU as its core. | The RX610 Group is an MCU with the high-speed, high-performance RX CPU as its core. | The RX610 Group is an MCU with the high-speed, high-performance RX CPU as its core. | The RX610 Group is an MCU with the high-speed, high-performance RX CPU as its core. |
厂商名称 | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | - | Renesas(瑞萨电子) | - | Renesas(瑞萨电子) |
零件包装代码 | BGA | BGA | BGA | BGA | - | QFP | - | QFP |
包装说明 | FBGA, BGA176,15X15,32 | FBGA, BGA176,15X15,32 | FBGA, BGA176,15X15,32 | FBGA, BGA176,15X15,32 | - | 20 X 20 MM, 0.50 MM PITCH, PLASTIC, LQFP-144 | - | 20 X 20 MM, 0.50 MM PITCH, PLASTIC, LQFP-144 |
针数 | 176 | 176 | 176 | 176 | - | 144 | - | 144 |
Reach Compliance Code | compli | compliant | compliant | compliant | - | compli | - | unknow |
ECCN代码 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | - | 3A001.A.3 | - | 3A001.A.3 |
具有ADC | YES | YES | YES | YES | - | YES | - | YES |
位大小 | 64 | 64 | 64 | 64 | - | 64 | - | 64 |
CPU系列 | RX | RX | RX | RX | - | RX | - | RX |
最大时钟频率 | 100 MHz | 100 MHz | 100 MHz | 100 MHz | - | 100 MHz | - | 100 MHz |
DAC 通道 | YES | YES | YES | YES | - | YES | - | YES |
DMA 通道 | YES | YES | YES | YES | - | YES | - | YES |
JESD-30 代码 | S-PBGA-B176 | S-PBGA-B176 | S-PBGA-B176 | S-PBGA-B176 | - | S-PQFP-G144 | - | S-PQFP-G144 |
端子数量 | 176 | 176 | 176 | 176 | - | 144 | - | 144 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | - | 85 °C | - | 85 °C |
最低工作温度 | -20 °C | -20 °C | -20 °C | -20 °C | - | -20 °C | - | -20 °C |
PWM 通道 | YES | YES | YES | YES | - | YES | - | YES |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | - | PLASTIC/EPOXY |
封装代码 | FBGA | FBGA | FBGA | FBGA | - | LFQFP | - | LFQFP |
封装等效代码 | BGA176,15X15,32 | BGA176,15X15,32 | BGA176,15X15,32 | BGA176,15X15,32 | - | QFP144,.87SQ,20 | - | QFP144,.87SQ,20 |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | - | SQUARE | - | SQUARE |
封装形式 | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | - | FLATPACK, LOW PROFILE, FINE PITCH | - | FLATPACK, LOW PROFILE, FINE PITCH |
电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - | 3.3 V | - | 3.3 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | - | Not Qualified |
RAM(字节) | 131072 | 131072 | 131072 | 131072 | - | 131072 | - | 131072 |
ROM(单词) | 1572864 | 786432 | 1048576 | 2097152 | - | 1048576 | - | 2097152 |
ROM可编程性 | FLASH | FLASH | FLASH | FLASH | - | FLASH | - | FLASH |
速度 | 100 MHz | 100 MHz | 100 MHz | 100 MHz | - | 100 MHz | - | 100 MHz |
最大压摆率 | 100 mA | 100 mA | 100 mA | 100 mA | - | 100 mA | - | - |
最大供电电压 | 3.6 V | 3.6 V | 3.6 V | 3.6 V | - | 3.6 V | - | 3.6 V |
最小供电电压 | 3 V | 3 V | 3 V | 3 V | - | 3 V | - | 3 V |
标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | - | 3.3 V | - | 3.3 V |
表面贴装 | YES | YES | YES | YES | - | YES | - | YES |
技术 | CMOS | CMOS | CMOS | CMOS | - | CMOS | - | CMOS |
温度等级 | OTHER | OTHER | OTHER | OTHER | - | OTHER | - | OTHER |
端子形式 | BALL | BALL | BALL | BALL | - | GULL WING | - | GULL WING |
端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | - | 0.5 mm | - | 0.5 mm |
端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | - | QUAD | - | QUAD |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | - | MICROCONTROLLER | - | MICROCONTROLLER |
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