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R5F56107WNBG

产品描述The RX610 Group is an MCU with the high-speed, high-performance RX CPU as its core.
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小1MB,共86页
制造商Renesas(瑞萨电子)
官网地址https://www.renesas.com/
下载文档 详细参数 选型对比 全文预览

R5F56107WNBG概述

The RX610 Group is an MCU with the high-speed, high-performance RX CPU as its core.

R5F56107WNBG规格参数

参数名称属性值
厂商名称Renesas(瑞萨电子)
零件包装代码BGA
包装说明FBGA, BGA176,15X15,32
针数176
Reach Compliance Codecompli
ECCN代码3A001.A.3
Is SamacsysN
具有ADCYES
地址总线宽度
位大小64
CPU系列RX
最大时钟频率100 MHz
DAC 通道YES
DMA 通道YES
外部数据总线宽度
JESD-30 代码S-PBGA-B176
端子数量176
最高工作温度85 °C
最低工作温度-20 °C
PWM 通道YES
封装主体材料PLASTIC/EPOXY
封装代码FBGA
封装等效代码BGA176,15X15,32
封装形状SQUARE
封装形式GRID ARRAY, FINE PITCH
电源3.3 V
认证状态Not Qualified
RAM(字节)131072
ROM(单词)1572864
ROM可编程性FLASH
速度100 MHz
最大压摆率100 mA
最大供电电压3.6 V
最小供电电压3 V
标称供电电压3.3 V
表面贴装YES
技术CMOS
温度等级OTHER
端子形式BALL
端子节距0.8 mm
端子位置BOTTOM
uPs/uCs/外围集成电路类型MICROCONTROLLER
Base Number Matches1

R5F56107WNBG相似产品对比

R5F56107WNBG R5F56104WNBG R5F56106WNBG R5F56108WNBG R5F56104VNFP R5F56106VNFP R5F56107VNFP R5F56108VNFP
描述 The RX610 Group is an MCU with the high-speed, high-performance RX CPU as its core. The RX610 Group is an MCU with the high-speed, high-performance RX CPU as its core. The RX610 Group is an MCU with the high-speed, high-performance RX CPU as its core. The RX610 Group is an MCU with the high-speed, high-performance RX CPU as its core. The RX610 Group is an MCU with the high-speed, high-performance RX CPU as its core. The RX610 Group is an MCU with the high-speed, high-performance RX CPU as its core. The RX610 Group is an MCU with the high-speed, high-performance RX CPU as its core. The RX610 Group is an MCU with the high-speed, high-performance RX CPU as its core.
厂商名称 Renesas(瑞萨电子) Renesas(瑞萨电子) Renesas(瑞萨电子) Renesas(瑞萨电子) - Renesas(瑞萨电子) - Renesas(瑞萨电子)
零件包装代码 BGA BGA BGA BGA - QFP - QFP
包装说明 FBGA, BGA176,15X15,32 FBGA, BGA176,15X15,32 FBGA, BGA176,15X15,32 FBGA, BGA176,15X15,32 - 20 X 20 MM, 0.50 MM PITCH, PLASTIC, LQFP-144 - 20 X 20 MM, 0.50 MM PITCH, PLASTIC, LQFP-144
针数 176 176 176 176 - 144 - 144
Reach Compliance Code compli compliant compliant compliant - compli - unknow
ECCN代码 3A001.A.3 3A001.A.3 3A001.A.3 3A001.A.3 - 3A001.A.3 - 3A001.A.3
具有ADC YES YES YES YES - YES - YES
位大小 64 64 64 64 - 64 - 64
CPU系列 RX RX RX RX - RX - RX
最大时钟频率 100 MHz 100 MHz 100 MHz 100 MHz - 100 MHz - 100 MHz
DAC 通道 YES YES YES YES - YES - YES
DMA 通道 YES YES YES YES - YES - YES
JESD-30 代码 S-PBGA-B176 S-PBGA-B176 S-PBGA-B176 S-PBGA-B176 - S-PQFP-G144 - S-PQFP-G144
端子数量 176 176 176 176 - 144 - 144
最高工作温度 85 °C 85 °C 85 °C 85 °C - 85 °C - 85 °C
最低工作温度 -20 °C -20 °C -20 °C -20 °C - -20 °C - -20 °C
PWM 通道 YES YES YES YES - YES - YES
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY - PLASTIC/EPOXY
封装代码 FBGA FBGA FBGA FBGA - LFQFP - LFQFP
封装等效代码 BGA176,15X15,32 BGA176,15X15,32 BGA176,15X15,32 BGA176,15X15,32 - QFP144,.87SQ,20 - QFP144,.87SQ,20
封装形状 SQUARE SQUARE SQUARE SQUARE - SQUARE - SQUARE
封装形式 GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH GRID ARRAY, FINE PITCH - FLATPACK, LOW PROFILE, FINE PITCH - FLATPACK, LOW PROFILE, FINE PITCH
电源 3.3 V 3.3 V 3.3 V 3.3 V - 3.3 V - 3.3 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified - Not Qualified - Not Qualified
RAM(字节) 131072 131072 131072 131072 - 131072 - 131072
ROM(单词) 1572864 786432 1048576 2097152 - 1048576 - 2097152
ROM可编程性 FLASH FLASH FLASH FLASH - FLASH - FLASH
速度 100 MHz 100 MHz 100 MHz 100 MHz - 100 MHz - 100 MHz
最大压摆率 100 mA 100 mA 100 mA 100 mA - 100 mA - -
最大供电电压 3.6 V 3.6 V 3.6 V 3.6 V - 3.6 V - 3.6 V
最小供电电压 3 V 3 V 3 V 3 V - 3 V - 3 V
标称供电电压 3.3 V 3.3 V 3.3 V 3.3 V - 3.3 V - 3.3 V
表面贴装 YES YES YES YES - YES - YES
技术 CMOS CMOS CMOS CMOS - CMOS - CMOS
温度等级 OTHER OTHER OTHER OTHER - OTHER - OTHER
端子形式 BALL BALL BALL BALL - GULL WING - GULL WING
端子节距 0.8 mm 0.8 mm 0.8 mm 0.8 mm - 0.5 mm - 0.5 mm
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM - QUAD - QUAD
uPs/uCs/外围集成电路类型 MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER MICROCONTROLLER - MICROCONTROLLER - MICROCONTROLLER

 
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