Standard SRAM, 1KX1, 40ns, TTL, CDIP16
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) |
包装说明 | DIP, DIP16,.3 |
Reach Compliance Code | unknown |
最长访问时间 | 40 ns |
JESD-30 代码 | R-XDIP-T16 |
JESD-609代码 | e0 |
内存密度 | 1024 bit |
内存集成电路类型 | STANDARD SRAM |
内存宽度 | 1 |
端子数量 | 16 |
字数 | 1024 words |
字数代码 | 1000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 1KX1 |
输出特性 | 3-STATE |
封装主体材料 | CERAMIC |
封装代码 | DIP |
封装等效代码 | DIP16,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
并行/串行 | PARALLEL |
电源 | 5 V |
最大压摆率 | 0.17 mA |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | TTL |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
N82S11FB | S93L415F/883B | N93L415N | N93L415FB | S93L415F/883C | N82S11FA | S82S11F/883C | S82S11F/883B | |
---|---|---|---|---|---|---|---|---|
描述 | Standard SRAM, 1KX1, 40ns, TTL, CDIP16 | Standard SRAM, 1KX1, 70ns, TTL, CDIP16 | Standard SRAM, 1KX1, 60ns, TTL, PDIP16 | Standard SRAM, 1KX1, 60ns, TTL, CDIP16 | Standard SRAM, 1KX1, 70ns, TTL, CDIP16 | Standard SRAM, 1KX1, 40ns, TTL, CDIP16 | Standard SRAM, 1KX1, 60ns, TTL, CDIP16 | Standard SRAM, 1KX1, 60ns, TTL, CDIP16 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
包装说明 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
最长访问时间 | 40 ns | 70 ns | 60 ns | 60 ns | 70 ns | 40 ns | 60 ns | 60 ns |
JESD-30 代码 | R-XDIP-T16 | R-XDIP-T16 | R-PDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-XDIP-T16 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
内存密度 | 1024 bit | 1024 bit | 1024 bit | 1024 bit | 1024 bit | 1024 bit | 1024 bit | 1024 bit |
内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
内存宽度 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
字数 | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words |
字数代码 | 1000 | 1000 | 1000 | 1000 | 1000 | 1000 | 1000 | 1000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 125 °C | 70 °C | 70 °C | 125 °C | 70 °C | 125 °C | 125 °C |
组织 | 1KX1 | 1KX1 | 1KX1 | 1KX1 | 1KX1 | 1KX1 | 1KX1 | 1KX1 |
输出特性 | 3-STATE | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | OPEN-COLLECTOR | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | CERAMIC | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
封装代码 | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
封装等效代码 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
最大压摆率 | 0.17 mA | 0.075 mA | 0.065 mA | 0.065 mA | 0.075 mA | 0.17 mA | 0.17 mA | 0.17 mA |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO | NO | NO | NO | NO | NO |
技术 | TTL | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
温度等级 | COMMERCIAL | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | COMMERCIAL | MILITARY | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
认证状态 | - | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
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