IC DATACOM, PCM TRANSCEIVER, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16, Digital Transmission Interface
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | ADI(亚德诺半导体) |
零件包装代码 | DIP |
包装说明 | DIP, |
针数 | 16 |
Reach Compliance Code | compliant |
JESD-30 代码 | R-GDIP-T16 |
JESD-609代码 | e0 |
长度 | 19.05 mm |
功能数量 | 1 |
端子数量 | 16 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | CERAMIC, GLASS-SEALED |
封装代码 | DIP |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
峰值回流温度(摄氏度) | NOT SPECIFIED |
认证状态 | Not Qualified |
座面最大高度 | 5.08 mm |
标称供电电压 | 4.4 V |
表面贴装 | NO |
技术 | BIPOLAR |
电信集成电路类型 | PCM TRANSCEIVER |
温度等级 | INDUSTRIAL |
端子面层 | TIN LEAD |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 7.62 mm |
RPT-82FQ | RPT-83FQ | RPT-83FSR | RPT-83FS | RPT-82FSR | RPT-82FS | |
---|---|---|---|---|---|---|
描述 | IC DATACOM, PCM TRANSCEIVER, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16, Digital Transmission Interface | IC DATACOM, PCM TRANSCEIVER, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16, Digital Transmission Interface | IC DATACOM, PCM TRANSCEIVER, PDSO16, SO-16, Digital Transmission Interface | IC DATACOM, PCM TRANSCEIVER, PDSO16, SO-16, Digital Transmission Interface | IC DATACOM, PCM TRANSCEIVER, PDSO16, SO-16, Digital Transmission Interface | IC DATACOM, PCM TRANSCEIVER, PDSO16, SO-16, Digital Transmission Interface |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
零件包装代码 | DIP | DIP | SOIC | SOIC | SOIC | SOIC |
包装说明 | DIP, | HERMETIC SEALED, CERAMIC, DIP-16 | SO-16 | SOP, | SO-16 | SO-16 |
针数 | 16 | 16 | 16 | 16 | 16 | 16 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
JESD-30 代码 | R-GDIP-T16 | R-GDIP-T16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 | R-PDSO-G16 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
长度 | 19.05 mm | 19.05 mm | 9.9 mm | 9.9 mm | 9.9 mm | 9.9 mm |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 16 | 16 | 16 | 16 | 16 | 16 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | DIP | SOP | SOP | SOP | SOP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 5.08 mm | 5.08 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm |
标称供电电压 | 4.4 V | 4.4 V | 4.4 V | 4.4 V | 4.4 V | 4.4 V |
表面贴装 | NO | NO | YES | YES | YES | YES |
技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
电信集成电路类型 | PCM TRANSCEIVER | PCM TRANSCEIVER | PCM TRANSCEIVER | PCM TRANSCEIVER | PCM TRANSCEIVER | PCM TRANSCEIVER |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 7.62 mm | 7.62 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm |
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