IC DATACOM, PCM TRANSCEIVER, PDSO16, SO-16, Digital Transmission Interface
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | ADI(亚德诺半导体) |
| 零件包装代码 | SOIC |
| 包装说明 | SO-16 |
| 针数 | 16 |
| Reach Compliance Code | compliant |
| JESD-30 代码 | R-PDSO-G16 |
| JESD-609代码 | e0 |
| 长度 | 9.9 mm |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.75 mm |
| 标称供电电压 | 4.4 V |
| 表面贴装 | YES |
| 技术 | BIPOLAR |
| 电信集成电路类型 | PCM TRANSCEIVER |
| 温度等级 | INDUSTRIAL |
| 端子面层 | TIN LEAD |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 3.9 mm |
| RPT-82FSR | RPT-83FQ | RPT-83FSR | RPT-83FS | RPT-82FQ | RPT-82FS | |
|---|---|---|---|---|---|---|
| 描述 | IC DATACOM, PCM TRANSCEIVER, PDSO16, SO-16, Digital Transmission Interface | IC DATACOM, PCM TRANSCEIVER, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16, Digital Transmission Interface | IC DATACOM, PCM TRANSCEIVER, PDSO16, SO-16, Digital Transmission Interface | IC DATACOM, PCM TRANSCEIVER, PDSO16, SO-16, Digital Transmission Interface | IC DATACOM, PCM TRANSCEIVER, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16, Digital Transmission Interface | IC DATACOM, PCM TRANSCEIVER, PDSO16, SO-16, Digital Transmission Interface |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
| 零件包装代码 | SOIC | DIP | SOIC | SOIC | DIP | SOIC |
| 包装说明 | SO-16 | HERMETIC SEALED, CERAMIC, DIP-16 | SO-16 | SOP, | DIP, | SO-16 |
| 针数 | 16 | 16 | 16 | 16 | 16 | 16 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
| JESD-30 代码 | R-PDSO-G16 | R-GDIP-T16 | R-PDSO-G16 | R-PDSO-G16 | R-GDIP-T16 | R-PDSO-G16 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 9.9 mm | 19.05 mm | 9.9 mm | 9.9 mm | 19.05 mm | 9.9 mm |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
| 封装代码 | SOP | DIP | SOP | SOP | DIP | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.75 mm | 5.08 mm | 1.75 mm | 1.75 mm | 5.08 mm | 1.75 mm |
| 标称供电电压 | 4.4 V | 4.4 V | 4.4 V | 4.4 V | 4.4 V | 4.4 V |
| 表面贴装 | YES | NO | YES | YES | NO | YES |
| 技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| 电信集成电路类型 | PCM TRANSCEIVER | PCM TRANSCEIVER | PCM TRANSCEIVER | PCM TRANSCEIVER | PCM TRANSCEIVER | PCM TRANSCEIVER |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
| 端子形式 | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | GULL WING |
| 端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 3.9 mm | 7.62 mm | 3.9 mm | 3.9 mm | 7.62 mm | 3.9 mm |
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