Datasheet> 器件分类 > 嵌入式处理器和控制器> 微控制器和处理器> MK60N512VMC100R

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MK60N512VMC100R: 产品描述FLASH, 100 MHz, RISC MICROCONTROLLER, PBGA121, 8 X 8 MM, MAPBGA-121; 产品类别嵌入式处理器和控制器微控制器和处理器; 文件大小2MB，共72页; 制造商NXP(恩智浦); 官网地址https://www.nxp.com

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MK60N512VMC100R概述

FLASH, 100 MHz, RISC MICROCONTROLLER, PBGA121, 8 X 8 MM, MAPBGA-121

MK60N512VMC100R规格参数

参数名称	属性值
厂商名称	NXP(恩智浦)
零件包装代码	BGA
包装说明	BGA, BGA121,11X11,25
针数	121
Reach Compliance Code	unknown
ECCN代码	3A001.A.3
具有ADC	YES
地址总线宽度
位大小	32
CPU系列	CORTEX-M4
最大时钟频率	50 MHz
DAC 通道	YES
DMA 通道	YES
外部数据总线宽度
JESD-30 代码	S-PBGA-B121
I/O 线路数量	90
端子数量	121
最高工作温度	105 °C
最低工作温度	-40 °C
PWM 通道	YES
封装主体材料	PLASTIC/EPOXY
封装代码	BGA
封装等效代码	BGA121,11X11,25
封装形状	SQUARE
封装形式	GRID ARRAY
电源	1.8/3.3 V
认证状态	Not Qualified
RAM（字节）	131072
ROM（单词）	524288
ROM可编程性	FLASH
速度	100 MHz
最大供电电压	3.6 V
最小供电电压	1.71 V
标称供电电压	3.3 V
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子形式	BALL
端子节距	0.635 mm
端子位置	BOTTOM
uPs/uCs/外围集成电路类型	MICROCONTROLLER, RISC

文档解析

K60系列微控制器的安全性和完整性模块提供了一系列的功能，以确保设备在各种应用中的安全性和数据的完整性。以下是这些模块的一些关键优势：

硬件CRC模块：支持快速循环冗余校验（CRC），有助于检测数据传输或存储过程中的错误。
硬件随机数生成器：为需要加密或安全认证的应用提供高质量的随机数。
硬件加密支持：支持多种加密算法，如DES、3DES、AES、MD5、SHA-1和SHA-256，有助于保护敏感数据和实现安全通信。
128位唯一识别（ID）号：每个芯片都有一个独特的128位ID，可用于设备认证和防止克隆。
内存保护单元：具有多主保护功能，可以防止未经授权的访问和代码执行，保护程序和数据的完整性。
DMA控制器：支持多达64个请求源，可以安全高效地处理数据传输，减少CPU负载。
看门狗定时器：包括外部和软件看门狗定时器，用于系统监控，确保在检测到软件故障时能够重启系统。
低泄漏唤醒单元：在低功耗模式下，能够快速唤醒微控制器，以响应外部事件或中断。
安全数字主机控制器（SDHC）：支持安全的存储卡接口，适用于需要数据存储的应用。
I2S模块：支持高保真音频传输，适用于需要高质量音频处理的应用。

这些模块的集成提供了一个全面的安全解决方案，适用于需要高安全性和数据完整性的嵌入式系统，如工业控制、医疗设备、安全支付系统和智能卡等。通过这些特性，K60系列微控制器能够抵抗各种攻击，如数据篡改、未授权访问和各种形式的欺诈。

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Freescale Semiconductor

Data Sheet: Product Preview

Document Number: K60P121M100SF2

Rev. 4, 3/2011

Supports the following:

MK60N256VMC100,

MK60X256VMC100,

MK60N512VMC100

K60 Sub-Family Data Sheet

K60P121M100SF2

Features

• Operating Characteristics

– Voltage range: 1.71 to 3.6 V

– Flash write voltage range: 1.71 to 3.6 V

– Temperature range (ambient): -40 to 105°C

• Performance

– Up to 100 MHz ARM Cortex-M4 core with DSP

instructions delivering 1.25 Dhrystone MIPS per

MHz

• Memories and memory interfaces

– Up to 512 KB program flash memory on non-

FlexMemory devices

– Up to 256 KB program flash memory on

FlexMemory devices

– Up to 256 KB FlexNVM on FlexMemory devices

– 4 KB FlexRAM on FlexMemory devices

– Up to 128 KB RAM

– Serial programming interface (EzPort)

– FlexBus external bus interface

• Clocks

– 3 to 32 MHz crystal oscillator

– 32 kHz crystal oscillator

– Multi-purpose clock generator

• System peripherals

– 10 low-power modes to provide power optimization

based on application requirements

– Memory protection unit with multi-master

protection

– 16-channel DMA controller, supporting up to 64

request sources

– External watchdog monitor

– Software watchdog

– Low-leakage wakeup unit

• Security and integrity modules

– Hardware CRC module to support fast cyclic

redundancy checks

– Hardware random-number generator

– Hardware encryption supporting DES, 3DES, AES,

MD5, SHA-1, and SHA-256 algorithms

– 128-bit unique identification (ID) number per chip

• Human-machine interface

– Low-power hardware touch sensor interface (TSI)

– General-purpose input/output

• Analog modules

– Two 16-bit SAR ADCs

– Programmable gain amplifier (up to x64) integrated

into each ADC

– Two 12-bit DACs

– Three analog comparators (CMP) containing a 6-bit

DAC and programmable reference input

– Voltage reference

• Timers

– Programmable delay block

– Eight-channel motor control/general purpose/PWM

timer

– Two 2-channel quadrature decoder/general purpose

timers

– IEEE 1588 timers

– Periodic interrupt timers

– 16-bit low-power timer

– Carrier modulator transmitter

– Real-time clock

This document contains information on a product under development. Freescale

reserves the right to change or discontinue this product without notice.

Preliminary

Table of Contents

1 Ordering parts...........................................................................5

1.1 Determining valid orderable parts......................................5

2 Part identification......................................................................5

2.1 Description.........................................................................5

2.2 Format...............................................................................5

2.3 Fields.................................................................................5

2.4 Example............................................................................6

3 Terminology and guidelines......................................................6

3.1 Definition: Operating requirement......................................6

3.2 Definition: Operating behavior...........................................7

3.3 Definition: Attribute............................................................7

3.4 Definition: Rating...............................................................8

3.5 Result of exceeding a rating..............................................8

3.6 Relationship between ratings and operating

requirements......................................................................8

3.7 Guidelines for ratings and operating requirements............9

3.8 Definition: Typical value.....................................................9

3.9 Typical value conditions....................................................10

4 Ratings......................................................................................10

4.1 Thermal handling ratings...................................................11

4.2 Moisture handling ratings..................................................11

4.3 ESD handling ratings.........................................................11

4.4 Voltage and current operating ratings...............................11

5 General.....................................................................................12

5.1 Nonswitching electrical specifications...............................12

5.1.1

5.1.2

5.1.3

5.1.4

5.1.5

5.1.6

5.1.7

5.1.8

Voltage and current operating requirements......12

LVD and POR operating requirements...............13

Voltage and current operating behaviors............14

Power mode transition operating behaviors.......14

Power consumption operating behaviors............15

EMC radiated emissions operating behaviors....18

Designing with radiated emissions in mind.........19

Capacitance attributes........................................19

6.8.8

6.8.9

6.8.10

6.8.11

6.8.7

6 Peripheral operating requirements and behaviors....................21

6.1 Core modules....................................................................22

6.1.1

6.1.2

Debug trace timing specifications.......................22

JTAG electricals..................................................22

6.2 System modules................................................................26

6.3 Clock modules...................................................................26

6.3.1

6.3.2

6.3.3

MCG specifications.............................................26

Oscillator electrical specifications.......................28

32kHz Oscillator Electrical Characteristics.........30

6.4 Memories and memory interfaces.....................................31

6.4.1

6.4.2

6.4.3

Flash (FTFL) electrical specifications.................31

EzPort Switching Specifications.........................35

Flexbus Switching Specifications........................36

6.5 Security and integrity modules..........................................39

6.6 Analog...............................................................................39

6.6.1

6.6.2

6.6.3

6.6.4

ADC electrical specifications..............................39

CMP and 6-bit DAC electrical specifications......47

12-bit DAC electrical characteristics...................50

Voltage reference electrical specifications..........53

6.7 Timers................................................................................54

6.8 Communication interfaces.................................................54

6.8.1

6.8.2

6.8.3

6.8.4

6.8.5

6.8.6

Ethernet switching specifications........................55

USB electrical specifications...............................56

USB DCD electrical specifications......................56

USB VREG electrical specifications...................57

CAN switching specifications..............................57

DSPI switching specifications (low-speed

mode)..................................................................58

DSPI switching specifications (high-speed

mode)..................................................................59

I2C switching specifications................................61

UART switching specifications............................61

SDHC specifications...........................................61

I2S switching specifications................................62

5.2 Switching specifications.....................................................19

5.2.1

5.2.2

Device clock specifications.................................19

General switching specifications.........................20

6.9 Human-machine interfaces (HMI)......................................64

6.9.1

TSI electrical specifications................................64

5.3 Thermal specifications.......................................................21

5.3.1

5.3.2

Thermal operating requirements.........................21

Thermal attributes...............................................21

7 Dimensions...............................................................................65

7.1 Obtaining package dimensions.........................................65

8 Pinout........................................................................................65

K60 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011.

Freescale Semiconductor, Inc.

Preliminary

MK60N512VMC100R相似产品对比

	MK60N512VMC100R	MK60N256VMC100	MK60N256VMC100R	MK60N512VMC100	MK60X256VMC100R
描述	FLASH, 100 MHz, RISC MICROCONTROLLER, PBGA121, 8 X 8 MM, MAPBGA-121	FLASH, 100MHz, RISC MICROCONTROLLER, PBGA121, 8 X 8 MM, MAPBGA-121	FLASH, 100 MHz, RISC MICROCONTROLLER, PBGA121, 8 X 8 MM, MAPBGA-121	FLASH, 100MHz, RISC MICROCONTROLLER, PBGA121, 8 X 8 MM, MAPBGA-121	FLASH, 100 MHz, RISC MICROCONTROLLER, PBGA121, 8 X 8 MM, MAPBGA-121
零件包装代码	BGA	BGA	BGA	BGA	BGA
包装说明	BGA, BGA121,11X11,25	BGA, BGA121,11X11,25	BGA, BGA121,11X11,25	BGA, BGA121,11X11,25	BGA, BGA121,11X11,25
针数	121	121	121	121	121
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown
ECCN代码	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3
具有ADC	YES	YES	YES	YES	YES
位大小	32	32	32	32	32
CPU系列	CORTEX-M4	CORTEX-M4	CORTEX-M4	CORTEX-M4	CORTEX-M4
最大时钟频率	50 MHz	50 MHz	50 MHz	50 MHz	50 MHz
DAC 通道	YES	YES	YES	YES	YES
DMA 通道	YES	YES	YES	YES	YES
JESD-30 代码	S-PBGA-B121	S-PBGA-B121	S-PBGA-B121	S-PBGA-B121	S-PBGA-B121
I/O 线路数量	90	90	90	90	90
端子数量	121	121	121	121	121
最高工作温度	105 °C	105 °C	105 °C	105 °C	105 °C
最低工作温度	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
PWM 通道	YES	YES	YES	YES	YES
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	BGA	BGA	BGA	BGA	BGA
封装等效代码	BGA121,11X11,25	BGA121,11X11,25	BGA121,11X11,25	BGA121,11X11,25	BGA121,11X11,25
封装形状	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
封装形式	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
电源	1.8/3.3 V	1.8/3.3 V	1.8/3.3 V	1.8/3.3 V	1.8/3.3 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
RAM（字节）	131072	65536	65536	131072	65536
ROM（单词）	524288	262144	262144	524288	262144
ROM可编程性	FLASH	FLASH	FLASH	FLASH	FLASH
速度	100 MHz	100 MHz	100 MHz	100 MHz	100 MHz
最大供电电压	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
最小供电电压	1.71 V	1.71 V	1.71 V	1.71 V	1.71 V
标称供电电压	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
表面贴装	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
端子形式	BALL	BALL	BALL	BALL	BALL
端子节距	0.635 mm	0.635 mm	0.635 mm	0.635 mm	0.635 mm
端子位置	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
uPs/uCs/外围集成电路类型	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC
厂商名称	NXP(恩智浦)	-	-	NXP(恩智浦)	NXP(恩智浦)

MK60N512VMC100R

MK60N512VMC100R概述

MK60N512VMC100R规格参数

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MK60N512VMC100R相似产品对比

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