Datasheet> 器件分类 > 嵌入式处理器和控制器> 微控制器和处理器> MK60N256VMC100

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MK60N256VMC100: 产品描述FLASH, 100MHz, RISC MICROCONTROLLER, PBGA121, 8 X 8 MM, MAPBGA-121; 产品类别嵌入式处理器和控制器微控制器和处理器; 文件大小2MB，共72页; 制造商NXP(恩智浦); 官网地址https://www.nxp.com

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MK60N256VMC100概述

FLASH, 100MHz, RISC MICROCONTROLLER, PBGA121, 8 X 8 MM, MAPBGA-121

MK60N256VMC100规格参数

参数名称	属性值
零件包装代码	BGA
包装说明	BGA, BGA121,11X11,25
针数	121
Reach Compliance Code	unknown
ECCN代码	3A001.A.3
具有ADC	YES
地址总线宽度
位大小	32
CPU系列	CORTEX-M4
最大时钟频率	50 MHz
DAC 通道	YES
DMA 通道	YES
外部数据总线宽度
JESD-30 代码	S-PBGA-B121
I/O 线路数量	90
端子数量	121
最高工作温度	105 °C
最低工作温度	-40 °C
PWM 通道	YES
封装主体材料	PLASTIC/EPOXY
封装代码	BGA
封装等效代码	BGA121,11X11,25
封装形状	SQUARE
封装形式	GRID ARRAY
电源	1.8/3.3 V
认证状态	Not Qualified
RAM（字节）	65536
ROM（单词）	262144
ROM可编程性	FLASH
速度	100 MHz
最大供电电压	3.6 V
最小供电电压	1.71 V
标称供电电压	3.3 V
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子形式	BALL
端子节距	0.635 mm
端子位置	BOTTOM
uPs/uCs/外围集成电路类型	MICROCONTROLLER, RISC
Base Number Matches	1

文档解析

这份文档是关于K60系列微控制器的预览版数据手册（Data Sheet），由Freescale Semiconductor公司发布。以下是一些值得关注的技术信息：

处理器性能：K60系列微控制器搭载了高达100 MHz的ARM Cortex-M4核心，并具备DSP指令集，提供1.25 Dhrystone MIPS每MHz的性能。
内存和存储：支持非FlexMemory设备上达512 KB的程序闪存，FlexMemory设备上达256 KB的程序闪存和FlexNVM，以及高达128 KB的RAM。
时钟系统：包括3至32 MHz的晶振振荡器、32 kHz的晶振振荡器和多功能时钟发生器。
系统外设：具备10种低功耗模式、内存保护单元、16通道DMA控制器、外部看门狗监视器、软件看门狗和低泄漏唤醒单元。
安全性和完整性模块：包括硬件CRC模块、硬件随机数生成器和支持多种加密算法的硬件加密模块，以及每个芯片独有的128位ID号。
人机交互界面：低功耗硬件触摸传感器接口（TSI）和通用输入/输出（GPIO）。
模拟模块：包括两个16位SAR ADC、可编程增益放大器、两个12位DAC和三个模拟比较器。
定时器：可编程延迟块、多通道电机控制/通用/PWM定时器、IEEE 1588定时器、周期性中断定时器等。
通信接口：包括以太网控制器、USB OTG控制器、CAN模块、SPI模块、I2C模块、UART模块和SDHC控制器。
封装类型：文档提供了多种封装类型的信息，包括QFN、LQFP、MAPBGA等。
电源管理：详细介绍了不同电源模式下的电流消耗，包括运行模式、等待模式、停止模式和超低功耗模式。
电气特性：包括输入/输出电压、电流规格，以及各种外设的电气特性。
操作环境：包括工作电压范围、温度范围和湿度处理等级。
订购信息：提供了如何确定可订购部件的信息，包括部件编号的格式和例子。
修订历史：文档记录了自2010年以来的修订历史。
联系方式：提供了Freescale Semiconductor公司的联系方式和支持信息。

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Freescale Semiconductor

Data Sheet: Product Preview

Document Number: K60P121M100SF2

Rev. 4, 3/2011

Supports the following:

MK60N256VMC100,

MK60X256VMC100,

MK60N512VMC100

K60 Sub-Family Data Sheet

K60P121M100SF2

Features

• Operating Characteristics

– Voltage range: 1.71 to 3.6 V

– Flash write voltage range: 1.71 to 3.6 V

– Temperature range (ambient): -40 to 105°C

• Performance

– Up to 100 MHz ARM Cortex-M4 core with DSP

instructions delivering 1.25 Dhrystone MIPS per

MHz

• Memories and memory interfaces

– Up to 512 KB program flash memory on non-

FlexMemory devices

– Up to 256 KB program flash memory on

FlexMemory devices

– Up to 256 KB FlexNVM on FlexMemory devices

– 4 KB FlexRAM on FlexMemory devices

– Up to 128 KB RAM

– Serial programming interface (EzPort)

– FlexBus external bus interface

• Clocks

– 3 to 32 MHz crystal oscillator

– 32 kHz crystal oscillator

– Multi-purpose clock generator

• System peripherals

– 10 low-power modes to provide power optimization

based on application requirements

– Memory protection unit with multi-master

protection

– 16-channel DMA controller, supporting up to 64

request sources

– External watchdog monitor

– Software watchdog

– Low-leakage wakeup unit

• Security and integrity modules

– Hardware CRC module to support fast cyclic

redundancy checks

– Hardware random-number generator

– Hardware encryption supporting DES, 3DES, AES,

MD5, SHA-1, and SHA-256 algorithms

– 128-bit unique identification (ID) number per chip

• Human-machine interface

– Low-power hardware touch sensor interface (TSI)

– General-purpose input/output

• Analog modules

– Two 16-bit SAR ADCs

– Programmable gain amplifier (up to x64) integrated

into each ADC

– Two 12-bit DACs

– Three analog comparators (CMP) containing a 6-bit

DAC and programmable reference input

– Voltage reference

• Timers

– Programmable delay block

– Eight-channel motor control/general purpose/PWM

timer

– Two 2-channel quadrature decoder/general purpose

timers

– IEEE 1588 timers

– Periodic interrupt timers

– 16-bit low-power timer

– Carrier modulator transmitter

– Real-time clock

This document contains information on a product under development. Freescale

reserves the right to change or discontinue this product without notice.

Preliminary

Table of Contents

1 Ordering parts...........................................................................5

1.1 Determining valid orderable parts......................................5

2 Part identification......................................................................5

2.1 Description.........................................................................5

2.2 Format...............................................................................5

2.3 Fields.................................................................................5

2.4 Example............................................................................6

3 Terminology and guidelines......................................................6

3.1 Definition: Operating requirement......................................6

3.2 Definition: Operating behavior...........................................7

3.3 Definition: Attribute............................................................7

3.4 Definition: Rating...............................................................8

3.5 Result of exceeding a rating..............................................8

3.6 Relationship between ratings and operating

requirements......................................................................8

3.7 Guidelines for ratings and operating requirements............9

3.8 Definition: Typical value.....................................................9

3.9 Typical value conditions....................................................10

4 Ratings......................................................................................10

4.1 Thermal handling ratings...................................................11

4.2 Moisture handling ratings..................................................11

4.3 ESD handling ratings.........................................................11

4.4 Voltage and current operating ratings...............................11

5 General.....................................................................................12

5.1 Nonswitching electrical specifications...............................12

5.1.1

5.1.2

5.1.3

5.1.4

5.1.5

5.1.6

5.1.7

5.1.8

Voltage and current operating requirements......12

LVD and POR operating requirements...............13

Voltage and current operating behaviors............14

Power mode transition operating behaviors.......14

Power consumption operating behaviors............15

EMC radiated emissions operating behaviors....18

Designing with radiated emissions in mind.........19

Capacitance attributes........................................19

6.8.8

6.8.9

6.8.10

6.8.11

6.8.7

6 Peripheral operating requirements and behaviors....................21

6.1 Core modules....................................................................22

6.1.1

6.1.2

Debug trace timing specifications.......................22

JTAG electricals..................................................22

6.2 System modules................................................................26

6.3 Clock modules...................................................................26

6.3.1

6.3.2

6.3.3

MCG specifications.............................................26

Oscillator electrical specifications.......................28

32kHz Oscillator Electrical Characteristics.........30

6.4 Memories and memory interfaces.....................................31

6.4.1

6.4.2

6.4.3

Flash (FTFL) electrical specifications.................31

EzPort Switching Specifications.........................35

Flexbus Switching Specifications........................36

6.5 Security and integrity modules..........................................39

6.6 Analog...............................................................................39

6.6.1

6.6.2

6.6.3

6.6.4

ADC electrical specifications..............................39

CMP and 6-bit DAC electrical specifications......47

12-bit DAC electrical characteristics...................50

Voltage reference electrical specifications..........53

6.7 Timers................................................................................54

6.8 Communication interfaces.................................................54

6.8.1

6.8.2

6.8.3

6.8.4

6.8.5

6.8.6

Ethernet switching specifications........................55

USB electrical specifications...............................56

USB DCD electrical specifications......................56

USB VREG electrical specifications...................57

CAN switching specifications..............................57

DSPI switching specifications (low-speed

mode)..................................................................58

DSPI switching specifications (high-speed

mode)..................................................................59

I2C switching specifications................................61

UART switching specifications............................61

SDHC specifications...........................................61

I2S switching specifications................................62

5.2 Switching specifications.....................................................19

5.2.1

5.2.2

Device clock specifications.................................19

General switching specifications.........................20

6.9 Human-machine interfaces (HMI)......................................64

6.9.1

TSI electrical specifications................................64

5.3 Thermal specifications.......................................................21

5.3.1

5.3.2

Thermal operating requirements.........................21

Thermal attributes...............................................21

7 Dimensions...............................................................................65

7.1 Obtaining package dimensions.........................................65

8 Pinout........................................................................................65

K60 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011.

Freescale Semiconductor, Inc.

Preliminary

MK60N256VMC100相似产品对比

	MK60N256VMC100	MK60N256VMC100R	MK60N512VMC100	MK60N512VMC100R	MK60X256VMC100R
描述	FLASH, 100MHz, RISC MICROCONTROLLER, PBGA121, 8 X 8 MM, MAPBGA-121	FLASH, 100 MHz, RISC MICROCONTROLLER, PBGA121, 8 X 8 MM, MAPBGA-121	FLASH, 100MHz, RISC MICROCONTROLLER, PBGA121, 8 X 8 MM, MAPBGA-121	FLASH, 100 MHz, RISC MICROCONTROLLER, PBGA121, 8 X 8 MM, MAPBGA-121	FLASH, 100 MHz, RISC MICROCONTROLLER, PBGA121, 8 X 8 MM, MAPBGA-121
零件包装代码	BGA	BGA	BGA	BGA	BGA
包装说明	BGA, BGA121,11X11,25	BGA, BGA121,11X11,25	BGA, BGA121,11X11,25	BGA, BGA121,11X11,25	BGA, BGA121,11X11,25
针数	121	121	121	121	121
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown
ECCN代码	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3
具有ADC	YES	YES	YES	YES	YES
位大小	32	32	32	32	32
CPU系列	CORTEX-M4	CORTEX-M4	CORTEX-M4	CORTEX-M4	CORTEX-M4
最大时钟频率	50 MHz	50 MHz	50 MHz	50 MHz	50 MHz
DAC 通道	YES	YES	YES	YES	YES
DMA 通道	YES	YES	YES	YES	YES
JESD-30 代码	S-PBGA-B121	S-PBGA-B121	S-PBGA-B121	S-PBGA-B121	S-PBGA-B121
I/O 线路数量	90	90	90	90	90
端子数量	121	121	121	121	121
最高工作温度	105 °C	105 °C	105 °C	105 °C	105 °C
最低工作温度	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
PWM 通道	YES	YES	YES	YES	YES
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	BGA	BGA	BGA	BGA	BGA
封装等效代码	BGA121,11X11,25	BGA121,11X11,25	BGA121,11X11,25	BGA121,11X11,25	BGA121,11X11,25
封装形状	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
封装形式	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
电源	1.8/3.3 V	1.8/3.3 V	1.8/3.3 V	1.8/3.3 V	1.8/3.3 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
RAM（字节）	65536	65536	131072	131072	65536
ROM（单词）	262144	262144	524288	524288	262144
ROM可编程性	FLASH	FLASH	FLASH	FLASH	FLASH
速度	100 MHz	100 MHz	100 MHz	100 MHz	100 MHz
最大供电电压	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
最小供电电压	1.71 V	1.71 V	1.71 V	1.71 V	1.71 V
标称供电电压	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
表面贴装	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
端子形式	BALL	BALL	BALL	BALL	BALL
端子节距	0.635 mm	0.635 mm	0.635 mm	0.635 mm	0.635 mm
端子位置	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
uPs/uCs/外围集成电路类型	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC
厂商名称	-	-	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)

MK60N256VMC100

MK60N256VMC100概述

MK60N256VMC100规格参数

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MK60N256VMC100相似产品对比

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