Buffer/Inverter Based MOSFET Driver, 1.5A, CMOS, CDIP8, 0.300 INCH, CERAMIC, DIP-8
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Maxim(美信半导体) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP8,.3 |
| 针数 | 8 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| 高边驱动器 | NO |
| 接口集成电路类型 | BUFFER OR INVERTER BASED MOSFET DRIVER |
| JESD-30 代码 | R-CDIP-T8 |
| JESD-609代码 | e0 |
| 湿度敏感等级 | 1 |
| 功能数量 | 2 |
| 端子数量 | 8 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 标称输出峰值电流 | 1.5 A |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP |
| 封装等效代码 | DIP8,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | 245 |
| 电源 | 4.5/18 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 | 18 V |
| 最小供电电压 | 4.5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 断开时间 | 0.06 µs |
| 接通时间 | 0.12 µs |
| 宽度 | 7.62 mm |
| TSC426EJA | TSC427CBA-T | TSC426EPA | TSC427C/D | TSC427EBA-T | TSC427EJA | TSC427EPA | TSC428C/D | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Buffer/Inverter Based MOSFET Driver, 1.5A, CMOS, CDIP8, 0.300 INCH, CERAMIC, DIP-8 | Buffer/Inverter Based MOSFET Driver, 1.5A, CMOS, PDSO8, 0.150 INCH, MS-012AA, SOIC-8 | Buffer/Inverter Based MOSFET Driver, 1.5A, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8 | Buffer/Inverter Based MOSFET Driver, 1.5A, CMOS, DIE-6 | Buffer/Inverter Based MOSFET Driver, 1.5A, CMOS, PDSO8, 0.150 INCH, MS-012AA, SOIC-8 | Buffer/Inverter Based MOSFET Driver, 1.5A, CMOS, CDIP8, 0.300 INCH, CERAMIC, DIP-8 | Buffer/Inverter Based MOSFET Driver, 1.5A, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8 | Buffer/Inverter Based MOSFET Driver, 1.5A, CMOS, DIE-6 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | DIP | SOIC | DIP | DIE | SOIC | DIP | DIP | DIE |
| 包装说明 | DIP, DIP8,.3 | SOP, SOP8,.25 | DIP, DIP8,.3 | DIE-6 | SOP, SOP8,.25 | 0.300 INCH, CERAMIC, DIP-8 | 0.300 INCH, PLASTIC, DIP-8 | DIE-6 |
| 针数 | 8 | 8 | 8 | 6 | 8 | 8 | 8 | 6 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 高边驱动器 | NO | NO | NO | NO | NO | NO | NO | NO |
| 接口集成电路类型 | BUFFER OR INVERTER BASED MOSFET DRIVER | BUFFER OR INVERTER BASED MOSFET DRIVER | BUFFER OR INVERTER BASED MOSFET DRIVER | BUFFER OR INVERTER BASED MOSFET DRIVER | BUFFER OR INVERTER BASED MOSFET DRIVER | BUFFER OR INVERTER BASED MOSFET DRIVER | BUFFER OR INVERTER BASED MOSFET DRIVER | BUFFER OR INVERTER BASED MOSFET DRIVER |
| JESD-30 代码 | R-CDIP-T8 | R-PDSO-G8 | R-PDIP-T8 | S-XUUC-N6 | R-PDSO-G8 | R-CDIP-T8 | R-PDIP-T8 | S-XUUC-N6 |
| 功能数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 8 | 8 | 8 | 6 | 8 | 8 | 8 | 6 |
| 最高工作温度 | 85 °C | 70 °C | 85 °C | 70 °C | 85 °C | 85 °C | 85 °C | 70 °C |
| 最低工作温度 | -40 °C | - | -40 °C | - | -40 °C | -40 °C | -40 °C | - |
| 标称输出峰值电流 | 1.5 A | 1.5 A | 1.5 A | 1.5 A | 1.5 A | 1.5 A | 1.5 A | 1.5 A |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | UNSPECIFIED |
| 封装代码 | DIP | SOP | DIP | DIE | SOP | DIP | DIP | DIE |
| 封装等效代码 | DIP8,.3 | SOP8,.25 | DIP8,.3 | DIE OR CHIP | SOP8,.25 | DIP8,.3 | DIP8,.3 | DIE OR CHIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | IN-LINE | SMALL OUTLINE | IN-LINE | UNCASED CHIP | SMALL OUTLINE | IN-LINE | IN-LINE | UNCASED CHIP |
| 峰值回流温度（摄氏度） | 245 | 245 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 4.5/18 V | 4.5/18 V | 4.5/18 V | 4.5/18 V | 4.5/18 V | 4.5/18 V | 4.5/18 V | 4.5/18 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 | 18 V | 18 V | 18 V | 18 V | 18 V | 18 V | 18 V | 18 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 表面贴装 | NO | YES | NO | YES | YES | NO | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL |
| 端子形式 | THROUGH-HOLE | GULL WING | THROUGH-HOLE | NO LEAD | GULL WING | THROUGH-HOLE | THROUGH-HOLE | NO LEAD |
| 端子位置 | DUAL | DUAL | DUAL | UPPER | DUAL | DUAL | DUAL | UPPER |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 断开时间 | 0.06 µs | 0.06 µs | 0.06 µs | 0.06 µs | 0.06 µs | 0.06 µs | 0.06 µs | 0.06 µs |
| 接通时间 | 0.12 µs | 0.12 µs | 0.12 µs | 0.12 µs | 0.12 µs | 0.12 µs | 0.12 µs | 0.12 µs |
| 厂商名称 | Maxim(美信半导体) | - | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) | Maxim(美信半导体) |
| JESD-609代码 | e0 | e0 | e0 | - | e0 | e0 | e0 | - |
| 座面最大高度 | 5.08 mm | 1.75 mm | 4.572 mm | - | 1.75 mm | 5.08 mm | 4.572 mm | - |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| 端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | - | 1.27 mm | 2.54 mm | 2.54 mm | - |
| 宽度 | 7.62 mm | 3.9 mm | 7.62 mm | - | 3.9 mm | 7.62 mm | 7.62 mm | - |
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