LVC/LCX/Z SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, CQCC20, CERAMIC, LCC-20
| 参数名称 | 属性值 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | QLCC |
| 包装说明 | QCCN, |
| 针数 | 20 |
| Reach Compliance Code | unknown |
| 系列 | LVC/LCX/Z |
| JESD-30 代码 | S-CQCC-N20 |
| 长度 | 8.89 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | D FLIP-FLOP |
| 位数 | 1 |
| 功能数量 | 2 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出极性 | COMPLEMENTARY |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 传播延迟（tpd） | 6 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.03 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 2 V |
| 标称供电电压 (Vsup) | 2.7 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 触发器类型 | POSITIVE EDGE |
| 宽度 | 8.89 mm |
| 最小 fmax | 100 MHz |
| SN54LVC74AFK | SN74LVC74ADB | SN54LVC74AJ | SN54LVC74AW | |
|---|---|---|---|---|
| 描述 | LVC/LCX/Z SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, CQCC20, CERAMIC, LCC-20 | D Flip-Flop | LVC/LCX/Z SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, CDIP14, CERAMIC, DIP-14 | LVC/LCX/Z SERIES, DUAL POSITIVE EDGE TRIGGERED D FLIP-FLOP, COMPLEMENTARY OUTPUT, CDFP14, CERAMIC, DFP-14 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 包装说明 | QCCN, | SSOP, SSOP14,.3 | CERAMIC, DIP-14 | CERAMIC, DFP-14 |
| Reach Compliance Code | unknown | compliant | unknown | unknown |
| 系列 | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z |
| JESD-30 代码 | S-CQCC-N20 | R-PDSO-G14 | R-GDIP-T14 | R-GDFP-F14 |
| 长度 | 8.89 mm | 6.2 mm | 19.56 mm | 9.21 mm |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
| 位数 | 1 | 1 | 1 | 1 |
| 功能数量 | 2 | 2 | 2 | 2 |
| 端子数量 | 20 | 14 | 14 | 14 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -40 °C | -55 °C | -55 °C |
| 输出极性 | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | QCCN | SSOP | DIP | DFP |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | SMALL OUTLINE, SHRINK PITCH | IN-LINE | FLATPACK |
| 传播延迟（tpd） | 6 ns | 7.1 ns | 6 ns | 6 ns |
| 座面最大高度 | 2.03 mm | 2 mm | 5.08 mm | 2.03 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 2 V | 1.65 V | 2 V | 2 V |
| 标称供电电压 (Vsup) | 2.7 V | 1.8 V | 2.7 V | 2.7 V |
| 表面贴装 | YES | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | AUTOMOTIVE | MILITARY | MILITARY |
| 端子形式 | NO LEAD | GULL WING | THROUGH-HOLE | FLAT |
| 端子节距 | 1.27 mm | 0.65 mm | 2.54 mm | 1.27 mm |
| 端子位置 | QUAD | DUAL | DUAL | DUAL |
| 触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| 宽度 | 8.89 mm | 5.3 mm | 7.62 mm | 6.29 mm |
| 最小 fmax | 100 MHz | 150 MHz | 100 MHz | 100 MHz |
| 零件包装代码 | QLCC | - | DIP | DFP |
| 针数 | 20 | - | 14 | 14 |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified |
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