16-Bit Ultra-Low-Power Microcontroller,16kB EPROM, 512B RAM, 14 bit ADC, 84 segment LCD 68-JLCC
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | LCC |
| 包装说明 | QCCJ, LDCC68,1.0SQ |
| 针数 | 68 |
| Reach Compliance Code | not_compliant |
| 具有ADC | YES |
| 地址总线宽度 | |
| 位大小 | 16 |
| 最大时钟频率 | 3.3 MHz |
| DAC 通道 | NO |
| DMA 通道 | NO |
| 外部数据总线宽度 | |
| JESD-30 代码 | S-CQCC-J68 |
| I/O 线路数量 | 14 |
| 端子数量 | 68 |
| PWM 通道 | NO |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCJ |
| 封装等效代码 | LDCC68,1.0SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 3/5 V |
| 认证状态 | Not Qualified |
| RAM（字节） | 512 |
| ROM（单词） | 16384 |
| ROM可编程性 | UVPROM |
| 速度 | 3.3 MHz |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 2.7 V |
| 标称供电电压 | 3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC |
| PMS430E325FZ | MSP430C323IFN | MSP430C323IPG | PMS430E325FZR | MSP430C325IPM | MSP430C323IPM | MSP430C325IPG | MSP430C325IFN | |
|---|---|---|---|---|---|---|---|---|
| 描述 | 16-Bit Ultra-Low-Power Microcontroller,16kB EPROM, 512B RAM, 14 bit ADC, 84 segment LCD 68-JLCC | 16-BIT, OTPROM, 3.3MHz, RISC MICROCONTROLLER, PQCC68, PLASTIC, LCC-68 | 16-BIT, OTPROM, 3.3MHz, RISC MICROCONTROLLER, PQFP64, QFP-64 | UVPROM, RISC MICROCONTROLLER, CQCC68, CERAMIC, LCC-68 | 16-BIT, OTPROM, 3.3MHz, RISC MICROCONTROLLER, PQFP64, QFP-64 | 16-BIT, OTPROM, 3.3MHz, RISC MICROCONTROLLER, PQFP64, QFP-64 | 16-BIT, OTPROM, 3.3MHz, RISC MICROCONTROLLER, PQFP64, QFP-64 | 16-BIT, OTPROM, 3.3MHz, RISC MICROCONTROLLER, PQCC68, PLASTIC, LCC-68 |
| 厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 零件包装代码 | LCC | LCC | QFP | LCC | QFP | QFP | QFP | LCC |
| 包装说明 | QCCJ, LDCC68,1.0SQ | PLASTIC, LCC-68 | QFP-64 | QCCJ, | LFQFP, QFP64,.47SQ,20 | QFP-64 | QFP, QFP64,.7X.95,40 | QCCJ, LDCC68,1.0SQ |
| 针数 | 68 | 68 | 64 | 68 | 64 | 64 | 64 | 68 |
| Reach Compliance Code | not_compliant | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 具有ADC | YES | YES | YES | YES | YES | YES | YES | YES |
| 最大时钟频率 | 3.3 MHz | 0.032 MHz | 0.032 MHz | 3.3 MHz | 0.032 MHz | 0.032 MHz | 0.032 MHz | 0.032 MHz |
| DAC 通道 | NO | NO | NO | NO | NO | NO | NO | NO |
| DMA 通道 | NO | NO | NO | NO | NO | NO | NO | NO |
| JESD-30 代码 | S-CQCC-J68 | S-PQCC-J68 | R-PQFP-G64 | S-CQCC-J68 | S-PQFP-G64 | S-PQFP-G64 | R-PQFP-G64 | S-PQCC-J68 |
| I/O 线路数量 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
| 端子数量 | 68 | 68 | 64 | 68 | 64 | 64 | 64 | 68 |
| PWM 通道 | NO | NO | NO | NO | NO | NO | NO | NO |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | QCCJ | QCCJ | QFP | QCCJ | LFQFP | LFQFP | QFP | QCCJ |
| 封装形状 | SQUARE | SQUARE | RECTANGULAR | SQUARE | SQUARE | SQUARE | RECTANGULAR | SQUARE |
| 封装形式 | CHIP CARRIER | CHIP CARRIER | FLATPACK | CHIP CARRIER | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK | CHIP CARRIER |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| ROM可编程性 | UVPROM | OTPROM | OTPROM | UVPROM | OTPROM | OTPROM | OTPROM | OTPROM |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 2.7 V | 2.5 V | 2.5 V | 2.7 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| 标称供电电压 | 3 V | 5 V | 5 V | 3 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 端子形式 | J BEND | J BEND | GULL WING | J BEND | GULL WING | GULL WING | GULL WING | J BEND |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC |
| 位大小 | 16 | 16 | 16 | - | 16 | 16 | 16 | 16 |
| 封装等效代码 | LDCC68,1.0SQ | LDCC68,1.0SQ | QFP64,.7X.95,40 | - | QFP64,.47SQ,20 | QFP64,.47SQ,20 | QFP64,.7X.95,40 | LDCC68,1.0SQ |
| 电源 | 3/5 V | 3/5 V | 3/5 V | - | 3/5 V | 3/5 V | 3/5 V | 3/5 V |
| RAM（字节） | 512 | 256 | 256 | - | 512 | 256 | 512 | 512 |
| ROM（单词） | 16384 | 8192 | 8192 | - | 16384 | 8192 | 16384 | 16384 |
| 速度 | 3.3 MHz | 3.3 MHz | 3.3 MHz | - | 3.3 MHz | 3.3 MHz | 3.3 MHz | 3.3 MHz |
| 端子节距 | 1.27 mm | 1.27 mm | 1 mm | - | 0.5 mm | 0.5 mm | 1 mm | 1.27 mm |
| 长度 | - | 24.2316 mm | 20 mm | - | 10 mm | 10 mm | 20 mm | 24.2316 mm |
| 最高工作温度 | - | 85 °C | 85 °C | - | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | - | -40 °C | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C |
| 座面最大高度 | - | 4.57 mm | 3.1 mm | - | 1.6 mm | 1.6 mm | 3.1 mm | 4.57 mm |
| 温度等级 | - | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 宽度 | - | 24.2316 mm | 14 mm | - | 10 mm | 10 mm | 14 mm | 24.2316 mm |
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