16-BIT, OTPROM, 3.3MHz, RISC MICROCONTROLLER, PQCC68, PLASTIC, LCC-68
参数名称 | 属性值 |
厂商名称 | Texas Instruments(德州仪器) |
零件包装代码 | LCC |
包装说明 | QCCJ, LDCC68,1.0SQ |
针数 | 68 |
Reach Compliance Code | unknown |
具有ADC | YES |
地址总线宽度 | |
位大小 | 16 |
最大时钟频率 | 0.032 MHz |
DAC 通道 | NO |
DMA 通道 | NO |
外部数据总线宽度 | |
JESD-30 代码 | S-PQCC-J68 |
长度 | 24.2316 mm |
I/O 线路数量 | 14 |
端子数量 | 68 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
PWM 通道 | NO |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | QCCJ |
封装等效代码 | LDCC68,1.0SQ |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER |
电源 | 3/5 V |
认证状态 | Not Qualified |
RAM(字节) | 512 |
ROM(单词) | 16384 |
ROM可编程性 | OTPROM |
座面最大高度 | 4.57 mm |
速度 | 3.3 MHz |
最大供电电压 | 5.5 V |
最小供电电压 | 2.5 V |
标称供电电压 | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子形式 | J BEND |
端子节距 | 1.27 mm |
端子位置 | QUAD |
宽度 | 24.2316 mm |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC |
MSP430C325IFN | MSP430C323IFN | MSP430C323IPG | PMS430E325FZ | PMS430E325FZR | MSP430C325IPM | MSP430C323IPM | MSP430C325IPG | |
---|---|---|---|---|---|---|---|---|
描述 | 16-BIT, OTPROM, 3.3MHz, RISC MICROCONTROLLER, PQCC68, PLASTIC, LCC-68 | 16-BIT, OTPROM, 3.3MHz, RISC MICROCONTROLLER, PQCC68, PLASTIC, LCC-68 | 16-BIT, OTPROM, 3.3MHz, RISC MICROCONTROLLER, PQFP64, QFP-64 | 16-Bit Ultra-Low-Power Microcontroller,16kB EPROM, 512B RAM, 14 bit ADC, 84 segment LCD 68-JLCC | UVPROM, RISC MICROCONTROLLER, CQCC68, CERAMIC, LCC-68 | 16-BIT, OTPROM, 3.3MHz, RISC MICROCONTROLLER, PQFP64, QFP-64 | 16-BIT, OTPROM, 3.3MHz, RISC MICROCONTROLLER, PQFP64, QFP-64 | 16-BIT, OTPROM, 3.3MHz, RISC MICROCONTROLLER, PQFP64, QFP-64 |
厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
零件包装代码 | LCC | LCC | QFP | LCC | LCC | QFP | QFP | QFP |
包装说明 | QCCJ, LDCC68,1.0SQ | PLASTIC, LCC-68 | QFP-64 | QCCJ, LDCC68,1.0SQ | QCCJ, | LFQFP, QFP64,.47SQ,20 | QFP-64 | QFP, QFP64,.7X.95,40 |
针数 | 68 | 68 | 64 | 68 | 68 | 64 | 64 | 64 |
Reach Compliance Code | unknown | unknown | unknown | not_compliant | unknown | unknown | unknown | unknown |
具有ADC | YES | YES | YES | YES | YES | YES | YES | YES |
最大时钟频率 | 0.032 MHz | 0.032 MHz | 0.032 MHz | 3.3 MHz | 3.3 MHz | 0.032 MHz | 0.032 MHz | 0.032 MHz |
DAC 通道 | NO | NO | NO | NO | NO | NO | NO | NO |
DMA 通道 | NO | NO | NO | NO | NO | NO | NO | NO |
JESD-30 代码 | S-PQCC-J68 | S-PQCC-J68 | R-PQFP-G64 | S-CQCC-J68 | S-CQCC-J68 | S-PQFP-G64 | S-PQFP-G64 | R-PQFP-G64 |
I/O 线路数量 | 14 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
端子数量 | 68 | 68 | 64 | 68 | 68 | 64 | 64 | 64 |
PWM 通道 | NO | NO | NO | NO | NO | NO | NO | NO |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | QCCJ | QCCJ | QFP | QCCJ | QCCJ | LFQFP | LFQFP | QFP |
封装形状 | SQUARE | SQUARE | RECTANGULAR | SQUARE | SQUARE | SQUARE | SQUARE | RECTANGULAR |
封装形式 | CHIP CARRIER | CHIP CARRIER | FLATPACK | CHIP CARRIER | CHIP CARRIER | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
ROM可编程性 | OTPROM | OTPROM | OTPROM | UVPROM | UVPROM | OTPROM | OTPROM | OTPROM |
最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 | 2.5 V | 2.5 V | 2.5 V | 2.7 V | 2.7 V | 2.5 V | 2.5 V | 2.5 V |
标称供电电压 | 5 V | 5 V | 5 V | 3 V | 3 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
端子形式 | J BEND | J BEND | GULL WING | J BEND | J BEND | GULL WING | GULL WING | GULL WING |
端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
uPs/uCs/外围集成电路类型 | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC |
位大小 | 16 | 16 | 16 | 16 | - | 16 | 16 | 16 |
长度 | 24.2316 mm | 24.2316 mm | 20 mm | - | - | 10 mm | 10 mm | 20 mm |
最高工作温度 | 85 °C | 85 °C | 85 °C | - | - | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | - | - | -40 °C | -40 °C | -40 °C |
封装等效代码 | LDCC68,1.0SQ | LDCC68,1.0SQ | QFP64,.7X.95,40 | LDCC68,1.0SQ | - | QFP64,.47SQ,20 | QFP64,.47SQ,20 | QFP64,.7X.95,40 |
电源 | 3/5 V | 3/5 V | 3/5 V | 3/5 V | - | 3/5 V | 3/5 V | 3/5 V |
RAM(字节) | 512 | 256 | 256 | 512 | - | 512 | 256 | 512 |
ROM(单词) | 16384 | 8192 | 8192 | 16384 | - | 16384 | 8192 | 16384 |
座面最大高度 | 4.57 mm | 4.57 mm | 3.1 mm | - | - | 1.6 mm | 1.6 mm | 3.1 mm |
速度 | 3.3 MHz | 3.3 MHz | 3.3 MHz | 3.3 MHz | - | 3.3 MHz | 3.3 MHz | 3.3 MHz |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子节距 | 1.27 mm | 1.27 mm | 1 mm | 1.27 mm | - | 0.5 mm | 0.5 mm | 1 mm |
宽度 | 24.2316 mm | 24.2316 mm | 14 mm | - | - | 10 mm | 10 mm | 14 mm |
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