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CY7C1305V25-167BZC

产品描述QDR SRAM, 1MX18, 2.5ns, CMOS, PBGA165, 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165
产品类别存储    存储   
文件大小609KB,共23页
制造商Cypress(赛普拉斯)
下载文档 详细参数 选型对比 全文预览

CY7C1305V25-167BZC概述

QDR SRAM, 1MX18, 2.5ns, CMOS, PBGA165, 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165

CY7C1305V25-167BZC规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称Cypress(赛普拉斯)
零件包装代码BGA
包装说明13 X 15 MM, 1.20 MM HEIGHT, FBGA-165
针数165
Reach Compliance Codenot_compliant
ECCN代码3A991.B.2.A
最长访问时间2.5 ns
其他特性PIPELINED ARCHITECTURE
最大时钟频率 (fCLK)167 MHz
I/O 类型SEPARATE
JESD-30 代码R-PBGA-B165
JESD-609代码e0
长度15 mm
内存密度18874368 bit
内存集成电路类型QDR SRAM
内存宽度18
功能数量1
端子数量165
字数1048576 words
字数代码1000000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织1MX18
输出特性3-STATE
封装主体材料PLASTIC/EPOXY
封装代码TBGA
封装等效代码BGA165,11X15,40
封装形状RECTANGULAR
封装形式GRID ARRAY, THIN PROFILE
并行/串行PARALLEL
峰值回流温度(摄氏度)NOT SPECIFIED
电源1.5/1.8,2.5 V
认证状态Not Qualified
座面最大高度1.2 mm
最大待机电流0.1 A
最小待机电流2.4 V
最大压摆率0.45 mA
最大供电电压 (Vsup)2.6 V
最小供电电压 (Vsup)2.4 V
标称供电电压 (Vsup)2.5 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Lead (Sn/Pb)
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度13 mm

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PRELIMINARY
CY7C1305V25
CY7C1307V25
18-Mb Burst of 4 Pipelined SRAM with QDR™ Architecture
Features
• Separate independent Read and Write data ports
— Supports concurrent transactions
• 167-MHz clock for high bandwidth
— 2.5 ns Clock-to-Valid access time
• 4-Word Burst for reducing the address bus frequency
• Double Data Rate (DDR) interfaces on both Read & Write
Ports (data transferred at 333 MHz) @167 MHz
• Two input clocks (K and K) for precise DDR timing
— SRAM uses rising edges only
• Two output clocks (C and C) accounts for clock skew
and flight time mismatching
• Single multiplexed address input bus latches address
inputs for both Read and Write ports
• Separate Port Selects for depth expansion
• Synchronous internally self-timed writes
• 2.5V core power supply with HSTL Inputs and Outputs
• 13 x 15 x 1.2 mm 1.0-mm pitch fBGA package, 165 ball
(11x15 matrix)
• Variable drive HSTL output buffers
• Expanded HSTL output voltage (1.4V–1.9V)
• JTAG Interface
Functional Description
The CY7C1305V25/CY7C1307V25 are 2.5V Synchronous
Pipelined SRAMs equipped with QDR architecture. QDR
architecture consists of two separate ports to access the
memory array. The Read port has dedicated Data Outputs to
support Read operations and the Write Port has dedicated
Data Inputs to support Write operations. QDR architecture has
separate data inputs and data outputs to completely eliminate
the need to “turn-around” the data bus required with common
I/O devices. Access to each port is accomplished through a
common address bus. Addresses for Read and Write
addresses are latched on alternate rising edges of the input
(K) clock. Accesses to the device’s Read and Write ports are
completely independent of one another. In order to maximize
data throughput, both Read and Write ports are equipped with
Double Data Rate (DDR) interfaces. Each address location is
associated with four 18-bit words (CY7C1305V25) and four
36-bit words (CY7C1307V25) that burst sequentially into or
out of the device. Since data can be transferred into and out
of the device on every rising edge of both input clocks (K/K and
C/C) memory bandwidth is maximized while simplifying
system design by eliminating bus “turn-arounds.”
Depth expansion is accomplished with Port Selects for each
port. Port selects allow each port to operate independently.
All synchronous inputs pass through input registers controlled
by the K or K input clocks. All data outputs pass through output
registers controlled by the C or C input clocks. Writes are
conducted with on-chip synchronous self-timed write circuitry.
Configurations
CY7C1305V25 – 1 Mb x 18
CY7C1307V25 – 512K x 36
Logic Block Diagram (CY7C1305V25)
D
[17:0]
18
Write Write
Reg
Reg
Write Write
Reg
Reg
Write Add. Decode
18
Read Add. Decode
A
[17:0]
Address
Register
Address
Register
256Kx18 Array
256Kx18 Array
256Kx18 Array
256Kx18 Array
18
A
(17:0)
K
K
CLK
Gen.
Control
Logic
RPS
C
C
Read Data Reg.
Vref
WPS
BWS
[0:1]
72
Control
Logic
36
36
Reg.
Reg.
18
Reg.
18
Q
[17:0]
Cypress Semiconductor Corporation
Document #: 38-05099 Rev. *B
3901 North First Street
San Jose
,
CA 95134
408-943-2600
Revised February 2, 2004

CY7C1305V25-167BZC相似产品对比

CY7C1305V25-167BZC CY7C1305V25-133BZC CY7C1305V25-1300BZC CY7C1307V25-167BZC CY7C1307V25-100BZC CY7C1307V25-133BZC
描述 QDR SRAM, 1MX18, 2.5ns, CMOS, PBGA165, 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165 QDR SRAM, 1MX18, 3ns, CMOS, PBGA165, 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165 QDR SRAM, 1MX18, 3ns, CMOS, PBGA165, 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165 QDR SRAM, 512KX36, 2.5ns, CMOS, PBGA165, 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165 QDR SRAM, 512KX36, 3ns, CMOS, PBGA165, 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165 QDR SRAM, 512KX36, 3ns, CMOS, PBGA165, 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 不符合
厂商名称 Cypress(赛普拉斯) Cypress(赛普拉斯) Cypress(赛普拉斯) Cypress(赛普拉斯) Cypress(赛普拉斯) Cypress(赛普拉斯)
零件包装代码 BGA BGA BGA BGA BGA BGA
包装说明 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165 13 X 15 MM, 1.20 MM HEIGHT, FBGA-165
针数 165 165 165 165 165 165
Reach Compliance Code not_compliant not_compliant compliant compliant compliant compliant
ECCN代码 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A 3A991.B.2.A
最长访问时间 2.5 ns 3 ns - 2.5 ns - 3 ns
其他特性 PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE - PIPELINED ARCHITECTURE - PIPELINED ARCHITECTURE
最大时钟频率 (fCLK) 167 MHz 133 MHz - 167 MHz - 133 MHz
I/O 类型 SEPARATE SEPARATE - SEPARATE - SEPARATE
JESD-30 代码 R-PBGA-B165 R-PBGA-B165 - R-PBGA-B165 - R-PBGA-B165
JESD-609代码 e0 e0 - e0 - e0
长度 15 mm 15 mm - 15 mm - 15 mm
内存密度 18874368 bit 18874368 bit - 18874368 bit - 18874368 bit
内存集成电路类型 QDR SRAM QDR SRAM - QDR SRAM - QDR SRAM
内存宽度 18 18 - 36 - 36
功能数量 1 1 - 1 - 1
端子数量 165 165 - 165 - 165
字数 1048576 words 1048576 words - 524288 words - 524288 words
字数代码 1000000 1000000 - 512000 - 512000
工作模式 SYNCHRONOUS SYNCHRONOUS - SYNCHRONOUS - SYNCHRONOUS
最高工作温度 70 °C 70 °C - 70 °C - 70 °C
组织 1MX18 1MX18 - 512KX36 - 512KX36
输出特性 3-STATE 3-STATE - 3-STATE - 3-STATE
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY - PLASTIC/EPOXY
封装代码 TBGA TBGA - TBGA - TBGA
封装等效代码 BGA165,11X15,40 BGA165,11X15,40 - BGA165,11X15,40 - BGA165,11X15,40
封装形状 RECTANGULAR RECTANGULAR - RECTANGULAR - RECTANGULAR
封装形式 GRID ARRAY, THIN PROFILE GRID ARRAY, THIN PROFILE - GRID ARRAY, THIN PROFILE - GRID ARRAY, THIN PROFILE
并行/串行 PARALLEL PARALLEL - PARALLEL - PARALLEL
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED - 220 - 220
电源 1.5/1.8,2.5 V 1.5/1.8,2.5 V - 1.5/1.8,2.5 V - 1.5/1.8,2.5 V
认证状态 Not Qualified Not Qualified - Not Qualified - Not Qualified
座面最大高度 1.2 mm 1.2 mm - 1.2 mm - 1.2 mm
最大待机电流 0.1 A 0.08 A - 0.1 A - 0.08 A
最小待机电流 2.4 V 2.4 V - 2.4 V - 2.4 V
最大压摆率 0.45 mA 0.35 mA - 0.45 mA - 0.35 mA
最大供电电压 (Vsup) 2.6 V 2.6 V - 2.6 V - 2.6 V
最小供电电压 (Vsup) 2.4 V 2.4 V - 2.4 V - 2.4 V
标称供电电压 (Vsup) 2.5 V 2.5 V - 2.5 V - 2.5 V
表面贴装 YES YES - YES - YES
技术 CMOS CMOS - CMOS - CMOS
温度等级 COMMERCIAL COMMERCIAL - COMMERCIAL - COMMERCIAL
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb) - Tin/Lead (Sn/Pb)
端子形式 BALL BALL - BALL - BALL
端子节距 1 mm 1 mm - 1 mm - 1 mm
端子位置 BOTTOM BOTTOM - BOTTOM - BOTTOM
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED - NOT SPECIFIED
宽度 13 mm 13 mm - 13 mm - 13 mm
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