D Flip-Flop, 4-Func, Positive Edge Triggered, TTL, PQCC20
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 包装说明 | QCCJ, LDCC20,.4SQ |
| Reach Compliance Code | unknow |
| JESD-30 代码 | S-PQCC-J20 |
| JESD-609代码 | e0 |
| 逻辑集成电路类型 | D FLIP-FLOP |
| 功能数量 | 4 |
| 端子数量 | 20 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | QCCJ |
| 封装等效代码 | LDCC20,.4SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 认证状态 | Not Qualified |
| 表面贴装 | YES |
| 技术 | TTL |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 触发器类型 | POSITIVE EDGE |
| Base Number Matches | 1 |
| AM25S18JC | AM25S18DCTB | AM25S18DMB | AM25S18PCTB | AM25S18PCT | AM25S18/BFA | AM25S18/B2A | AM25S18/BEA | |
|---|---|---|---|---|---|---|---|---|
| 描述 | D Flip-Flop, 4-Func, Positive Edge Triggered, TTL, PQCC20 | D Flip-Flop, 4-Func, Positive Edge Triggered, TTL, CDIP16 | D Flip-Flop, 4-Func, Positive Edge Triggered, TTL, CDIP16 | D Flip-Flop, 4-Func, Positive Edge Triggered, TTL, PDIP16 | D Flip-Flop, 4-Func, Positive Edge Triggered, TTL, PDIP16 | D Flip-Flop, 4-Func, Positive Edge Triggered, TTL, CDFP16 | D Flip-Flop, 4-Func, Positive Edge Triggered, TTL, CQCC20 | D Flip-Flop, 4-Func, Positive Edge Triggered, TTL, CDIP16 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | QCCJ, LDCC20,.4SQ | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 | DFP, FL16,.3 | QCCN, LCC20,.35SQ | DIP, DIP16,.3 |
| Reach Compliance Code | unknow | unknow | unknow | unknow | unknow | unknown | unknow | unknow |
| JESD-30 代码 | S-PQCC-J20 | R-XDIP-T16 | - | R-PDIP-T16 | R-PDIP-T16 | R-XDFP-F16 | S-XQCC-N20 | R-XDIP-T16 |
| JESD-609代码 | e0 | e0 | - | e0 | e0 | e0 | e0 | e0 |
| 逻辑集成电路类型 | D FLIP-FLOP | D FLIP-FLOP | - | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
| 功能数量 | 4 | 4 | - | 4 | 4 | 4 | 4 | 4 |
| 端子数量 | 20 | 16 | - | 16 | 16 | 16 | 20 | 16 |
| 最高工作温度 | 70 °C | 70 °C | - | 70 °C | 70 °C | 125 °C | 125 °C | 125 °C |
| 输出特性 | 3-STATE | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC | - | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC |
| 封装代码 | QCCJ | DIP | - | DIP | DIP | DFP | QCCN | DIP |
| 封装等效代码 | LDCC20,.4SQ | DIP16,.3 | - | DIP16,.3 | DIP16,.3 | FL16,.3 | LCC20,.35SQ | DIP16,.3 |
| 封装形状 | SQUARE | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
| 封装形式 | CHIP CARRIER | IN-LINE | - | IN-LINE | IN-LINE | FLATPACK | CHIP CARRIER | IN-LINE |
| 认证状态 | Not Qualified | - | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | YES | NO | - | NO | NO | YES | YES | NO |
| 技术 | TTL | TTL | - | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | COMMERCIAL | COMMERCIAL | - | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | J BEND | THROUGH-HOLE | - | THROUGH-HOLE | THROUGH-HOLE | FLAT | NO LEAD | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 2.54 mm | - | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| 端子位置 | QUAD | DUAL | - | DUAL | DUAL | DUAL | QUAD | DUAL |
| 触发器类型 | POSITIVE EDGE | POSITIVE EDGE | - | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | - | - | - |
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