D Flip-Flop, 4-Func, Positive Edge Triggered, TTL, CDIP16
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
包装说明 | DIP, DIP16,.3 |
Reach Compliance Code | unknow |
JESD-30 代码 | R-XDIP-T16 |
JESD-609代码 | e0 |
逻辑集成电路类型 | D FLIP-FLOP |
功能数量 | 4 |
端子数量 | 16 |
最高工作温度 | 70 °C |
最低工作温度 | |
输出特性 | 3-STATE |
封装主体材料 | CERAMIC |
封装代码 | DIP |
封装等效代码 | DIP16,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
表面贴装 | NO |
技术 | TTL |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
触发器类型 | POSITIVE EDGE |
Base Number Matches | 1 |
AM25S18DCTB | AM25S18DMB | AM25S18JC | AM25S18PCTB | AM25S18PCT | AM25S18/BFA | AM25S18/B2A | AM25S18/BEA | |
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描述 | D Flip-Flop, 4-Func, Positive Edge Triggered, TTL, CDIP16 | D Flip-Flop, 4-Func, Positive Edge Triggered, TTL, CDIP16 | D Flip-Flop, 4-Func, Positive Edge Triggered, TTL, PQCC20 | D Flip-Flop, 4-Func, Positive Edge Triggered, TTL, PDIP16 | D Flip-Flop, 4-Func, Positive Edge Triggered, TTL, PDIP16 | D Flip-Flop, 4-Func, Positive Edge Triggered, TTL, CDFP16 | D Flip-Flop, 4-Func, Positive Edge Triggered, TTL, CQCC20 | D Flip-Flop, 4-Func, Positive Edge Triggered, TTL, CDIP16 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
包装说明 | DIP, DIP16,.3 | DIP, DIP16,.3 | QCCJ, LDCC20,.4SQ | DIP, DIP16,.3 | DIP, DIP16,.3 | DFP, FL16,.3 | QCCN, LCC20,.35SQ | DIP, DIP16,.3 |
Reach Compliance Code | unknow | unknow | unknow | unknow | unknow | unknown | unknow | unknow |
JESD-30 代码 | R-XDIP-T16 | - | S-PQCC-J20 | R-PDIP-T16 | R-PDIP-T16 | R-XDFP-F16 | S-XQCC-N20 | R-XDIP-T16 |
JESD-609代码 | e0 | - | e0 | e0 | e0 | e0 | e0 | e0 |
逻辑集成电路类型 | D FLIP-FLOP | - | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP |
功能数量 | 4 | - | 4 | 4 | 4 | 4 | 4 | 4 |
端子数量 | 16 | - | 20 | 16 | 16 | 16 | 20 | 16 |
最高工作温度 | 70 °C | - | 70 °C | 70 °C | 70 °C | 125 °C | 125 °C | 125 °C |
输出特性 | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
封装主体材料 | CERAMIC | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC |
封装代码 | DIP | - | QCCJ | DIP | DIP | DFP | QCCN | DIP |
封装等效代码 | DIP16,.3 | - | LDCC20,.4SQ | DIP16,.3 | DIP16,.3 | FL16,.3 | LCC20,.35SQ | DIP16,.3 |
封装形状 | RECTANGULAR | - | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR |
封装形式 | IN-LINE | - | CHIP CARRIER | IN-LINE | IN-LINE | FLATPACK | CHIP CARRIER | IN-LINE |
表面贴装 | NO | - | YES | NO | NO | YES | YES | NO |
技术 | TTL | - | TTL | TTL | TTL | TTL | TTL | TTL |
温度等级 | COMMERCIAL | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | - | J BEND | THROUGH-HOLE | THROUGH-HOLE | FLAT | NO LEAD | THROUGH-HOLE |
端子节距 | 2.54 mm | - | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm |
端子位置 | DUAL | - | QUAD | DUAL | DUAL | DUAL | QUAD | DUAL |
触发器类型 | POSITIVE EDGE | - | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | - | - | - |
认证状态 | - | - | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
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