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28C011TRTFI-12

产品描述EEPROM, 128KX8, 120ns, Parallel, CMOS, LDFP-32
产品类别存储    存储   
文件大小328KB,共19页
制造商Data Device Corporation
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28C011TRTFI-12概述

EEPROM, 128KX8, 120ns, Parallel, CMOS, LDFP-32

28C011TRTFI-12规格参数

参数名称属性值
是否Rohs认证不符合
包装说明LDFP-32
Reach Compliance Codecompli
ECCN代码3A001.A.2.C
最长访问时间120 ns
JESD-30 代码R-XDFP-F32
长度20.828 mm
内存密度1048576 bi
内存集成电路类型EEPROM
内存宽度8
功能数量1
端子数量32
字数131072 words
字数代码128000
工作模式ASYNCHRONOUS
最高工作温度125 °C
最低工作温度-55 °C
组织128KX8
封装主体材料UNSPECIFIED
封装代码DFP
封装形状RECTANGULAR
封装形式FLATPACK
并行/串行PARALLEL
编程电压5 V
认证状态Not Qualified
座面最大高度2.4384 mm
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级MILITARY
端子形式FLAT
端子节距1.27 mm
端子位置DUAL
宽度10.414 mm
最长写入周期时间 (tWC)10 ms
Base Number Matches1

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1 Megabit (128K x 8-Bit) EEPROM
V
CC
V
SS
RES
OE
CE
WE
RES
I/O Buffer and
Input Latch
Control Logic Timing
High Voltage
Generator
I/O0
I/O7
RDY/Busy
28C011T
28C011T
A0
A6
Address
Buffer and
Latch
A7
A16
Y Decoder
Y Gating
X Decoder
Memory Array
Data Latch
Memory
Logic Diagram
F
EATURES
:
• 128k x 8-bit EEPROM
• R
AD
-P
AK
® radiation-hardened against natural space radia-
tion
• Total dose hardness:
- > 100 krad (Si), depending upon space mission
• Excellent Single event effects @ 25
°
C
- SEL
TH
> 120 MeV cm
2
/mg (Device)
- SEU
TH
> 90 MeV cm
2
/mg(Memory Cells)
- SEU
TH
> 18 MeV cm
2
/mg (Write Mode)
- SET
TH
> 40 MeV cm
2
/mg (Read Mode)
• Package:
- 32-pin R
AD
-P
AK
® flat package
- 32-pin Rad-Tolerant flat package
- JEDEC-approved byte-wide pinout
• High speed:
- 120, 150, and 200 ns maximum access times available
• High endurance:
- 10,000 erase/write (in Page Mode),
- 10 year data retention
• Page write mode:
- 1 to 128 bytes
• Low power dissipation
- 20 mW/MHz active (typical)
- 110 µW standby (maximum)
D
ESCRIPTION
:
Maxwell Technologies’ 28C011T high-density 1 Megabit (128K
x 8-Bit) EEPROM microcircuit features a greater than 100
krad (Si) total dose tolerance, depending upon space mission.
The 28C011T is capable of in-system electrical byte and page
programmability. It has a 128-byte page programming function
to make its erase and write operations faster. It also features
data polling and a Ready/Busy signal to indicate the comple-
tion of erase and programming operations. In the 28C010T,
hardware data protection is provided with the RES pin, in addi-
tion to noise protection on the WE signal and write inhibit on
power on and off. Software data protection is implemented
using the JEDEC optional standard algorithm.
Maxwell Technologies' patented R
AD
-P
AK
® packaging technol-
ogy incorporates radiation shielding in the microcircuit pack-
age. It eliminates the need for box shielding while providing
the required radiation shielding for a lifetime in orbit or space
mission. In a GEO orbit, R
AD
-P
AK
® provides greater than 100
krad (Si) radiation dose tolerance. This product is available
with screening up to Maxwell’s self-defined Class S.
03.24.15 Rev 14
All data sheets are subject to change without notice
1
(858) 503-3300- Fax: (858) 503-3301 - www.maxwell.com
©2015 Maxwell Technologies
All rights reserved.

28C011TRTFI-12相似产品对比

28C011TRTFI-12 28C011TRPFS-20 28C011TRPFI-15 28C011TRT1FS-12 28C011TRT2FB-20 28C011TRT2FI-12 28C011TRT6RFB-12 28C011TRT6RFS-15 28C011TRT4FB-12
描述 EEPROM, 128KX8, 120ns, Parallel, CMOS, LDFP-32 EEPROM, 128KX8, 200ns, Parallel, CMOS, LDFP-32 EEPROM, 128KX8, 150ns, Parallel, CMOS, LDFP-32 EEPROM, 128KX8, 120ns, Parallel, CMOS, LDFP-32 EEPROM, 128KX8, 200ns, Parallel, CMOS, LDFP-32 EEPROM, 128KX8, 120ns, Parallel, CMOS, LDFP-32 EEPROM, EEPROM, EEPROM, 128KX8, 120ns, Parallel, CMOS, LDFP-32
Reach Compliance Code compli compli compli compli compli compli compli compli compli
是否Rohs认证 不符合 不符合 - 不符合 不符合 不符合 不符合 - 不符合
包装说明 LDFP-32 LDFP-32 LDFP-32 LDFP-32 LDFP-32 LDFP-32 - - LDFP-32
ECCN代码 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C 3A001.A.2.C - - 3A001.A.2.C
最长访问时间 120 ns 200 ns 150 ns 120 ns 200 ns 120 ns - - 120 ns
JESD-30 代码 R-XDFP-F32 R-XDFP-F32 R-XDFP-F32 R-XDFP-F32 R-XDFP-F32 R-XDFP-F32 - - R-XDFP-F32
长度 20.828 mm 20.828 mm 20.828 mm 20.828 mm 20.828 mm 20.828 mm - - 20.828 mm
内存密度 1048576 bi 1048576 bi 1048576 bi 1048576 bi 1048576 bi 1048576 bi - - 1048576 bi
内存集成电路类型 EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM - - EEPROM
内存宽度 8 8 8 8 8 8 - - 8
功能数量 1 1 1 1 1 1 - - 1
端子数量 32 32 32 32 32 32 - - 32
字数 131072 words 131072 words 131072 words 131072 words 131072 words 131072 words - - 131072 words
字数代码 128000 128000 128000 128000 128000 128000 - - 128000
工作模式 ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS ASYNCHRONOUS - - ASYNCHRONOUS
最高工作温度 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C - - 125 °C
最低工作温度 -55 °C -55 °C -55 °C -55 °C -55 °C -55 °C - - -55 °C
组织 128KX8 128KX8 128KX8 128KX8 128KX8 128KX8 - - 128KX8
封装主体材料 UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED - - UNSPECIFIED
封装代码 DFP DFP DFP DFP DFP DFP - - DFP
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR - - RECTANGULAR
封装形式 FLATPACK FLATPACK FLATPACK FLATPACK FLATPACK FLATPACK - - FLATPACK
并行/串行 PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL PARALLEL - - PARALLEL
编程电压 5 V 5 V 5 V 5 V 5 V 5 V - - 5 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified - - Not Qualified
座面最大高度 2.4384 mm 3.6322 mm 3.6322 mm 2.4384 mm 2.4384 mm 2.4384 mm - - 2.4384 mm
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V - - 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V 4.5 V - - 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V 5 V 5 V 5 V - - 5 V
表面贴装 YES YES YES YES YES YES - - YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS - - CMOS
温度等级 MILITARY MILITARY MILITARY MILITARY MILITARY MILITARY - - MILITARY
端子形式 FLAT FLAT FLAT FLAT FLAT FLAT - - FLAT
端子节距 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm - - 1.27 mm
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL - - DUAL
宽度 10.414 mm 10.414 mm 10.414 mm 10.414 mm 10.414 mm 10.414 mm - - 10.414 mm
最长写入周期时间 (tWC) 10 ms 10 ms 10 ms 10 ms 10 ms 10 ms - - 10 ms
Base Number Matches 1 1 1 1 1 1 - - -
总剂量 - 100k Rad(Si) V 100k Rad(Si) V 10k Rad(Si) V 25k Rad(Si) V 25k Rad(Si) V - - 40k Rad(Si) V

 
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