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JM38510R75101SCA: 产品描述AC SERIES, QUAD 2-INPUT NOR GATE, CDIP14, CERAMIC, DIP-14; 产品类别逻辑逻辑; 文件大小114KB，共6页; 制造商Texas Instruments(德州仪器); 官网地址http://www.ti.com.cn/

敬请期待详细参数选型对比

JM38510R75101SCA概述

AC SERIES, QUAD 2-INPUT NOR GATE, CDIP14, CERAMIC, DIP-14

JM38510R75101SCA规格参数

参数名称	属性值
厂商名称	Texas Instruments(德州仪器)
包装说明	DIP,
Reach Compliance Code	unknown
系列	AC
JESD-30 代码	R-GDIP-T14
长度	19.43 mm
逻辑集成电路类型	NOR GATE
功能数量	4
输入次数	2
端子数量	14
最高工作温度	125 °C
最低工作温度	-55 °C
封装主体材料	CERAMIC, GLASS-SEALED
封装代码	DIP
封装形状	RECTANGULAR
封装形式	IN-LINE
传播延迟（tpd）	9 ns
认证状态	Not Qualified
座面最大高度	5.08 mm
最大供电电压 (Vsup)	6 V
最小供电电压 (Vsup)	2 V
表面贴装	NO
技术	CMOS
温度等级	MILITARY
端子形式	THROUGH-HOLE
端子节距	2.54 mm
端子位置	DUAL
总剂量	100k Rad(Si) V
宽度	7.62 mm

JM38510R75101SCA相似产品对比

	JM38510R75101SCA	BZT52C6V2S	5962-87612012A	54AC02DM	54AC02MDS	54AC02MW8	5962-8761201CA	5962-8761201DA	54AC02LM
描述	AC SERIES, QUAD 2-INPUT NOR GATE, CDIP14, CERAMIC, DIP-14	Surface mount silicon zener diodes	AC SERIES, QUAD 2-INPUT NOR GATE, CQCC20, CERAMIC, LCC-20	AC SERIES, QUAD 2-INPUT NOR GATE, CDIP14, CERAMIC, DIP-14	AC SERIES, QUAD 2-INPUT NOR GATE, UUC14	AC SERIES, QUAD 2-INPUT NOR GATE, UUC14	AC SERIES, QUAD 2-INPUT NOR GATE, CDIP14, CERAMIC, DIP-14	AC SERIES, QUAD 2-INPUT NOR GATE, CDFP14, CERAMIC, DFP-14	AC SERIES, QUAD 2-INPUT NOR GATE, CQCC20, CERAMIC, LCC-20
包装说明	DIP,	-	QCCN, LCC20,.35SQ	DIP,	DIE,	DIE,	DIP, DIP14,.3	DFP, FL14,.3	QCCN,
Reach Compliance Code	unknown	-	unknown	unknown	unknown	unknown	unknown	unknown	unknown
系列	AC	-	AC	AC	AC	AC	AC	AC	AC
JESD-30 代码	R-GDIP-T14	-	S-CQCC-N20	R-GDIP-T14	X-XUUC-N14	X-XUUC-N14	R-GDIP-T14	R-GDFP-F14	S-CQCC-N20
长度	19.43 mm	-	8.89 mm	19.43 mm	-	-	19.43 mm	-	8.89 mm
逻辑集成电路类型	NOR GATE	-	NOR GATE	NOR GATE	NOR GATE	NOR GATE	NOR GATE	NOR GATE	NOR GATE
功能数量	4	-	4	4	4	4	4	4	4
输入次数	2	-	2	2	2	2	2	2	2
端子数量	14	-	20	14	14	14	14	14	20
最高工作温度	125 °C	-	125 °C	125 °C	-	-	125 °C	125 °C	125 °C
最低工作温度	-55 °C	-	-55 °C	-55 °C	-	-	-55 °C	-55 °C	-55 °C
封装主体材料	CERAMIC, GLASS-SEALED	-	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	UNSPECIFIED	UNSPECIFIED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED
封装代码	DIP	-	QCCN	DIP	DIE	DIE	DIP	DFP	QCCN
封装形状	RECTANGULAR	-	SQUARE	RECTANGULAR	UNSPECIFIED	UNSPECIFIED	RECTANGULAR	RECTANGULAR	SQUARE
封装形式	IN-LINE	-	CHIP CARRIER	IN-LINE	UNCASED CHIP	UNCASED CHIP	IN-LINE	FLATPACK	CHIP CARRIER
传播延迟（tpd）	9 ns	-	10.7 ns	9 ns	-	-	10.7 ns	10.7 ns	9 ns
认证状态	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	5.08 mm	-	1.905 mm	5.08 mm	-	-	5.08 mm	2.032 mm	1.905 mm
最大供电电压 (Vsup)	6 V	-	6 V	6 V	6 V	6 V	6 V	6 V	6 V
最小供电电压 (Vsup)	2 V	-	2 V	2 V	2 V	2 V	2 V	2 V	2 V
表面贴装	NO	-	YES	NO	YES	YES	NO	YES	YES
技术	CMOS	-	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	MILITARY	-	MILITARY	MILITARY	-	-	MILITARY	MILITARY	MILITARY
端子形式	THROUGH-HOLE	-	NO LEAD	THROUGH-HOLE	NO LEAD	NO LEAD	THROUGH-HOLE	FLAT	NO LEAD
端子节距	2.54 mm	-	1.27 mm	2.54 mm	-	-	2.54 mm	1.27 mm	1.27 mm
端子位置	DUAL	-	QUAD	DUAL	UPPER	UPPER	DUAL	DUAL	QUAD
宽度	7.62 mm	-	8.89 mm	7.62 mm	-	-	7.62 mm	6.2865 mm	8.89 mm
负载电容（CL）	-	-	50 pF	50 pF	-	-	50 pF	50 pF	50 pF
标称供电电压 (Vsup)	-	-	3 V	5 V	-	-	3 V	3 V	5 V
Base Number Matches	-	-	1	1	1	1	1	1	1

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