Audio Amplifier, 3W, 1 Channel(s), 1 Func, CMOS, PDSO8, GREEN, MO-187AA, MSOP-8
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | American Power Devices Inc |
| 零件包装代码 | TSSOP |
| 包装说明 | TSSOP, |
| 针数 | 8 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 商用集成电路类型 | AUDIO AMPLIFIER |
| JESD-30 代码 | S-PDSO-G8 |
| JESD-609代码 | e3 |
| 长度 | 3 mm |
| 信道数量 | 1 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 标称输出功率 | 3 W |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装形状 | SQUARE |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.1 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 2.4 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) |
| 端子形式 | GULL WING |
| 端子节距 | 0.65 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 40 |
| 宽度 | 3 mm |
| APA0715XI-TRG | APA0715QBI-TRG | APA0715QBI-TRL | APA0715XAI-TRG | APA0715XAI-TRL | APA0715XI-TRL | |
|---|---|---|---|---|---|---|
| 描述 | Audio Amplifier, 3W, 1 Channel(s), 1 Func, CMOS, PDSO8, GREEN, MO-187AA, MSOP-8 | Audio Amplifier, 3W, 1 Channel(s), 1 Func, CMOS, 3 X 3 MM, GREEN, TDFN-8 | Audio Amplifier, 3W, 1 Channel(s), 1 Func, CMOS, 3 X 3 MM, ROHS COMPLIANT, TDFN-8 | Audio Amplifier, 3W, 1 Channel(s), 1 Func, CMOS, PDSO8, GREEN, MO-187AA-T, MSOP-8 | Audio Amplifier, 3W, 1 Channel(s), 1 Func, CMOS, PDSO8, ROHS COMPLIANT, MO-187AA-T, MSOP-8 | Audio Amplifier, 3W, 1 Channel(s), 1 Func, CMOS, PDSO8, ROHS COMPLIANT, MO-187AA, MSOP-8 |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | American Power Devices Inc | American Power Devices Inc | American Power Devices Inc | American Power Devices Inc | American Power Devices Inc | American Power Devices Inc |
| 零件包装代码 | TSSOP | DFN | DFN | TSSOP | TSSOP | TSSOP |
| 包装说明 | TSSOP, | HVSON, | HVSON, | HTSSOP, | HTSSOP, | TSSOP, |
| 针数 | 8 | 8 | 8 | 8 | 8 | 8 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 商用集成电路类型 | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER | AUDIO AMPLIFIER |
| JESD-30 代码 | S-PDSO-G8 | S-XDSO-N8 | S-XDSO-N8 | S-PDSO-G8 | S-PDSO-G8 | S-PDSO-G8 |
| JESD-609代码 | e3 | e3 | e3 | e3 | e3 | e3 |
| 长度 | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm |
| 信道数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 标称输出功率 | 3 W | 3 W | 3 W | 3 W | 3 W | 3 W |
| 封装主体材料 | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | HVSON | HVSON | HTSSOP | HTSSOP | TSSOP |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.1 mm | 0.85 mm | 0.85 mm | 1.1 mm | 1.1 mm | 1.1 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2.4 V | 2.4 V | 2.4 V | 2.4 V | 2.4 V | 2.4 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | MATTE TIN | MATTE TIN | Matte Tin (Sn) |
| 端子形式 | GULL WING | NO LEAD | NO LEAD | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm | 0.65 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 40 | 40 | 40 | 40 | 40 | 40 |
| 宽度 | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm |
模拟与混合信号
DSP 与 ARM 处理器
嵌入式系统
模拟电子
电子竞赛
FPGA/CPLD
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