Datasheet> 器件分类 > 嵌入式处理器和控制器> 微控制器和处理器> MK60X256VLQ100

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MK60X256VLQ100: 产品描述FLASH, 100MHz, RISC MICROCONTROLLER, PQFP144, 20 X 20 MM, LQFP-144; 产品类别嵌入式处理器和控制器微控制器和处理器; 文件大小2MB，共76页; 制造商NXP(恩智浦); 官网地址https://www.nxp.com

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MK60X256VLQ100概述

FLASH, 100MHz, RISC MICROCONTROLLER, PQFP144, 20 X 20 MM, LQFP-144

MK60X256VLQ100规格参数

参数名称	属性值
零件包装代码	QFP
包装说明	20 X 20 MM, LQFP-144
针数	144
Reach Compliance Code	compli
ECCN代码	3A001.A.3
具有ADC	YES
地址总线宽度
位大小	32
最大时钟频率	50 MHz
DAC 通道	YES
DMA 通道	YES
外部数据总线宽度
JESD-30 代码	S-PQFP-G144
长度	20 mm
I/O 线路数量	94
端子数量	144
最高工作温度	105 °C
最低工作温度	-40 °C
PWM 通道	YES
封装主体材料	PLASTIC/EPOXY
封装代码	LFQFP
封装等效代码	QFP144,.87SQ,20
封装形状	SQUARE
封装形式	FLATPACK, LOW PROFILE, FINE PITCH
电源	1.8/3.3 V
认证状态	Not Qualified
RAM（字节）	65536
ROM（单词）	262144
ROM可编程性	FLASH
座面最大高度	1.6 mm
速度	100 MHz
最大供电电压	3.6 V
最小供电电压	1.71 V
标称供电电压	3.3 V
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子形式	GULL WING
端子节距	0.5 mm
端子位置	QUAD
宽度	20 mm
uPs/uCs/外围集成电路类型	MICROCONTROLLER, RISC
Base Number Matches	1

文档解析

K60子系列微控制器基于ARM Cortex-M4核心架构，提供高性能处理能力，最高运行频率达100MHz，支持1.25 Dhrystone MIPS每MHz的计算效率。该系列工作电压范围为1.71V至3.6V，闪存写入电压同样覆盖此范围，确保在严苛环境中稳定运行，环境温度适应能力为-40°C至105°C，适用于工业自动化和消费电子等领域。核心模块集成了DSP指令集，优化了数字信号处理任务，同时配备内存保护单元和多主保护机制，增强了系统可靠性。关键特性包括高达512KB的程序闪存、128KB RAM，以及FlexMemory选项，支持最大256KB FlexNVM和4KB FlexRAM，提供灵活的数据存储方案。时钟系统涵盖3MHz至32MHz晶体振荡器、32kHz低功耗振荡器及多用途时钟发生器，满足多样化时序需求。外设资源丰富，如16通道DMA控制器、低功耗唤醒单元和10种电源模式，显著优化能耗管理。模拟模块集成两个16位SAR ADC、可编程增益放大器（最高x64）、两个12位DAC和三个模拟比较器，支持高精度信号采集。该系列适用于需要高性能和低功耗的嵌入式系统，如电机控制、传感器网络和便携设备。通信接口包括以太网（带MII/RMII和IEEE 1588支持）、USB OTG控制器、双CAN模块、多路SPI/I2C/UART，以及SDHC和I2S，确保广泛连接性。安全特性如硬件加密（支持DES、3DES、AES等算法）、随机数生成器和128位唯一ID，为数据保护提供基础保障。

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Freescale Semiconductor

Data Sheet: Product Preview

Document Number: K60P144M100SF2

Rev. 4, 3/2011

Supports the following:

MK60N256VLQ100,

MK60X256VLQ100,

MK60N512VLQ100,

MK60N256VMD100,

MK60X256VMD100,

MK60N512VMD100

K60 Sub-Family Data Sheet

K60P144M100SF2

Features

• Operating Characteristics

– Voltage range: 1.71 to 3.6 V

– Flash write voltage range: 1.71 to 3.6 V

– Temperature range (ambient): -40 to 105°C

• Performance

– Up to 100 MHz ARM Cortex-M4 core with DSP

instructions delivering 1.25 Dhrystone MIPS per

MHz

• Memories and memory interfaces

– Up to 512 KB program flash memory on non-

FlexMemory devices

– Up to 256 KB program flash memory on

FlexMemory devices

– Up to 256 KB FlexNVM on FlexMemory devices

– 4 KB FlexRAM on FlexMemory devices

– Up to 128 KB RAM

– Serial programming interface (EzPort)

– FlexBus external bus interface

• Clocks

– 3 to 32 MHz crystal oscillator

– 32 kHz crystal oscillator

– Multi-purpose clock generator

• System peripherals

– 10 low-power modes to provide power optimization

based on application requirements

– Memory protection unit with multi-master

protection

– 16-channel DMA controller, supporting up to 64

request sources

– External watchdog monitor

– Software watchdog

– Low-leakage wakeup unit

• Security and integrity modules

– Hardware CRC module to support fast cyclic

redundancy checks

– Hardware random-number generator

– Hardware encryption supporting DES, 3DES, AES,

MD5, SHA-1, and SHA-256 algorithms

– 128-bit unique identification (ID) number per chip

• Human-machine interface

– Low-power hardware touch sensor interface (TSI)

– General-purpose input/output

• Analog modules

– Two 16-bit SAR ADCs

– Programmable gain amplifier (up to x64) integrated

into each ADC

– Two 12-bit DACs

– Three analog comparators (CMP) containing a 6-bit

DAC and programmable reference input

– Voltage reference

• Timers

– Programmable delay block

– Eight-channel motor control/general purpose/PWM

timer

– Two 2-channel quadrature decoder/general purpose

timers

– IEEE 1588 timers

– Periodic interrupt timers

– 16-bit low-power timer

– Carrier modulator transmitter

– Real-time clock

This document contains information on a product under development. Freescale

reserves the right to change or discontinue this product without notice.

Preliminary

Table of Contents

1 Ordering parts...........................................................................5

1.1 Determining valid orderable parts......................................5

2 Part identification......................................................................5

2.1 Description.........................................................................5

2.2 Format...............................................................................5

2.3 Fields.................................................................................5

2.4 Example............................................................................6

3 Terminology and guidelines......................................................6

3.1 Definition: Operating requirement......................................6

3.2 Definition: Operating behavior...........................................7

3.3 Definition: Attribute............................................................7

3.4 Definition: Rating...............................................................8

3.5 Result of exceeding a rating..............................................8

3.6 Relationship between ratings and operating

requirements......................................................................8

3.7 Guidelines for ratings and operating requirements............9

3.8 Definition: Typical value.....................................................9

3.9 Typical value conditions....................................................10

4 Ratings......................................................................................10

4.1 Thermal handling ratings...................................................11

4.2 Moisture handling ratings..................................................11

4.3 ESD handling ratings.........................................................11

4.4 Voltage and current operating ratings...............................11

5 General.....................................................................................12

5.1 Nonswitching electrical specifications...............................12

5.1.1

5.1.2

5.1.3

5.1.4

5.1.5

5.1.6

5.1.7

5.1.8

Voltage and current operating requirements......12

LVD and POR operating requirements...............13

Voltage and current operating behaviors............14

Power mode transition operating behaviors.......14

Power consumption operating behaviors............15

EMC radiated emissions operating behaviors....18

Designing with radiated emissions in mind.........19

Capacitance attributes........................................19

6.8.8

6.8.9

6.8.10

6.8.11

6.8.7

6 Peripheral operating requirements and behaviors....................21

6.1 Core modules....................................................................22

6.1.1

6.1.2

Debug trace timing specifications.......................22

JTAG electricals..................................................23

6.2 System modules................................................................26

6.3 Clock modules...................................................................26

6.3.1

6.3.2

6.3.3

MCG specifications.............................................26

Oscillator electrical specifications.......................28

32kHz Oscillator Electrical Characteristics.........30

6.4 Memories and memory interfaces.....................................31

6.4.1

6.4.2

6.4.3

Flash (FTFL) electrical specifications.................31

EzPort Switching Specifications.........................35

Flexbus Switching Specifications........................36

6.5 Security and integrity modules..........................................39

6.6 Analog...............................................................................39

6.6.1

6.6.2

6.6.3

6.6.4

ADC electrical specifications..............................39

CMP and 6-bit DAC electrical specifications......47

12-bit DAC electrical characteristics...................50

Voltage reference electrical specifications..........53

6.7 Timers................................................................................54

6.8 Communication interfaces.................................................54

6.8.1

6.8.2

6.8.3

6.8.4

6.8.5

6.8.6

Ethernet switching specifications........................55

USB electrical specifications...............................56

USB DCD electrical specifications......................56

USB VREG electrical specifications...................57

CAN switching specifications..............................57

DSPI switching specifications (low-speed

mode)..................................................................58

DSPI switching specifications (high-speed

mode)..................................................................59

I2C switching specifications................................61

UART switching specifications............................61

SDHC specifications...........................................61

I2S switching specifications................................62

5.2 Switching specifications.....................................................19

5.2.1

5.2.2

Device clock specifications.................................19

General switching specifications.........................20

6.9 Human-machine interfaces (HMI)......................................64

6.9.1

TSI electrical specifications................................64

5.3 Thermal specifications.......................................................21

5.3.1

5.3.2

Thermal operating requirements.........................21

Thermal attributes...............................................21

7 Dimensions...............................................................................65

7.1 Obtaining package dimensions.........................................65

8 Pinout........................................................................................65

K60 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011.

Freescale Semiconductor, Inc.

Preliminary

MK60X256VLQ100相似产品对比

	MK60X256VLQ100	MK60N512VLQ100R	MK60N256VLQ100	MK60N256VLQ100R	MK60N512VLQ100	MK60N256VMD100	MK60N256VMD100R
描述	FLASH, 100MHz, RISC MICROCONTROLLER, PQFP144, 20 X 20 MM, LQFP-144	FLASH, 100MHz, RISC MICROCONTROLLER, PQFP144, 20 X 20 MM, LQFP-144	FLASH, 100MHz, RISC MICROCONTROLLER, PQFP144, 20 X 20 MM, LQFP-144	FLASH, 100 MHz, RISC MICROCONTROLLER, PQFP144, 20 X 20 MM, LQFP-144	FLASH, 100MHz, RISC MICROCONTROLLER, PQFP144, 20 X 20 MM, LQFP-144	FLASH, 100MHz, RISC MICROCONTROLLER, PBGA144, 13 X 13 MM, MAPBGA-144	FLASH, 100MHz, RISC MICROCONTROLLER, PBGA144, 13 X 13 MM, MAPBGA-144
零件包装代码	QFP	QFP	QFP	QFP	QFP	BGA	BGA
包装说明	20 X 20 MM, LQFP-144	LFQFP, QFP144,.87SQ,20	LFQFP, QFP144,.87SQ,20	LFQFP, QFP144,.87SQ,20	20 X 20 MM, LQFP-144	LBGA, BGA144,12X12,40	LBGA, BGA144,12X12,40
针数	144	144	144	144	144	144	144
Reach Compliance Code	compli	unknown	unknown	unknown	compliant	unknown	unknown
ECCN代码	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3
具有ADC	YES	YES	YES	YES	YES	YES	YES
位大小	32	32	32	32	32	32	32
最大时钟频率	50 MHz	50 MHz	50 MHz	50 MHz	50 MHz	50 MHz	50 MHz
DAC 通道	YES	YES	YES	YES	YES	YES	YES
DMA 通道	YES	YES	YES	YES	YES	YES	YES
JESD-30 代码	S-PQFP-G144	S-PQFP-G144	S-PQFP-G144	S-PQFP-G144	S-PQFP-G144	S-PBGA-B144	S-PBGA-B144
长度	20 mm	20 mm	20 mm	20 mm	20 mm	13 mm	13 mm
I/O 线路数量	94	94	94	94	94	96	96
端子数量	144	144	144	144	144	144	144
最高工作温度	105 °C	105 °C	105 °C	105 °C	105 °C	105 °C	105 °C
最低工作温度	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
PWM 通道	YES	YES	YES	YES	YES	YES	YES
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	LFQFP	LFQFP	LFQFP	LFQFP	LFQFP	LBGA	LBGA
封装等效代码	QFP144,.87SQ,20	QFP144,.87SQ,20	QFP144,.87SQ,20	QFP144,.87SQ,20	QFP144,.87SQ,20	BGA144,12X12,40	BGA144,12X12,40
封装形状	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
封装形式	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE
电源	1.8/3.3 V	1.8/3.3 V	1.8/3.3 V	1.8/3.3 V	1.8/3.3 V	1.8/3.3 V	1.8/3.3 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
RAM（字节）	65536	131072	65536	65536	131072	65536	65536
ROM（单词）	262144	524288	262144	262144	524288	262144	262144
ROM可编程性	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
座面最大高度	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.7 mm	1.7 mm
速度	100 MHz	100 MHz	100 MHz	100 MHz	100 MHz	100 MHz	100 MHz
最大供电电压	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
最小供电电压	1.71 V	1.71 V	1.71 V	1.71 V	1.71 V	1.71 V	1.71 V
标称供电电压	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
表面贴装	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
端子形式	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	BALL	BALL
端子节距	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	1 mm	1 mm
端子位置	QUAD	QUAD	QUAD	QUAD	QUAD	BOTTOM	BOTTOM
宽度	20 mm	20 mm	20 mm	20 mm	20 mm	13 mm	13 mm
uPs/uCs/外围集成电路类型	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC
厂商名称	-	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)

MK60X256VLQ100

MK60X256VLQ100概述

MK60X256VLQ100规格参数

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MK60X256VLQ100相似产品对比

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