Datasheet> 器件分类 > 嵌入式处理器和控制器> 微控制器和处理器> MK60N512VLQ100R

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MK60N512VLQ100R: 产品描述FLASH, 100MHz, RISC MICROCONTROLLER, PQFP144, 20 X 20 MM, LQFP-144; 产品类别嵌入式处理器和控制器微控制器和处理器; 文件大小2MB，共76页; 制造商NXP(恩智浦); 官网地址https://www.nxp.com

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MK60N512VLQ100R概述

FLASH, 100MHz, RISC MICROCONTROLLER, PQFP144, 20 X 20 MM, LQFP-144

MK60N512VLQ100R规格参数

参数名称	属性值
厂商名称	NXP(恩智浦)
零件包装代码	QFP
包装说明	LFQFP, QFP144,.87SQ,20
针数	144
Reach Compliance Code	unknown
ECCN代码	3A001.A.3
Is Samacsys	N
具有ADC	YES
地址总线宽度
位大小	32
最大时钟频率	50 MHz
DAC 通道	YES
DMA 通道	YES
外部数据总线宽度
JESD-30 代码	S-PQFP-G144
长度	20 mm
I/O 线路数量	94
端子数量	144
最高工作温度	105 °C
最低工作温度	-40 °C
PWM 通道	YES
封装主体材料	PLASTIC/EPOXY
封装代码	LFQFP
封装等效代码	QFP144,.87SQ,20
封装形状	SQUARE
封装形式	FLATPACK, LOW PROFILE, FINE PITCH
电源	1.8/3.3 V
认证状态	Not Qualified
RAM（字节）	131072
ROM（单词）	524288
ROM可编程性	FLASH
座面最大高度	1.6 mm
速度	100 MHz
最大供电电压	3.6 V
最小供电电压	1.71 V
标称供电电压	3.3 V
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子形式	GULL WING
端子节距	0.5 mm
端子位置	QUAD
宽度	20 mm
uPs/uCs/外围集成电路类型	MICROCONTROLLER, RISC
Base Number Matches	1

文档解析

K60子系列微控制器采用ARM Cortex-M4核心，最高频率100MHz，结合1.25 Dhrystone MIPS每MHz的性能，在1.71V至3.6V宽电压范围内高效运行。温度适应性覆盖-40°C至105°C，闪存操作电压同步支持全范围，确保恶劣条件下的稳定性。内存架构是其核心优势，非FlexMemory设备提供最大512KB程序闪存，FlexMemory版本则支持256KB程序闪存加256KB FlexNVM和4KB FlexRAM，RAM容量高达128KB，满足复杂应用的数据处理需求。系统外设包括串行编程接口（EzPort）和FlexBus外部总线接口，优化了外部存储器扩展。时钟管理集成3-32MHz晶振、32kHz晶振及多用途时钟发生器，辅以低功耗模式如VLPS和VLLS，显著降低能耗。模拟功能突出，配备双16位SAR ADC，每通道集成可编程增益放大器，双12位DAC提供精准输出，三个模拟比较器含6位DAC参考，电压参考模块确保信号完整性。定时器系统涵盖可编程延迟块、八通道电机控制/PWM定时器、正交解码器和实时时钟，支持精密时序控制。该系列针对高可靠性应用设计，如汽车电子和工业控制。通信能力强大，集成以太网控制器（硬件IEEE 1588）、USB OTG、双CAN模块、多路串行接口（SPI、I2C、UART）及SDHC/I2S，实现多样化设备互联。安全模块如硬件CRC和加密引擎增强系统防护，128位唯一ID助力身份验证。

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Freescale Semiconductor

Data Sheet: Product Preview

Document Number: K60P144M100SF2

Rev. 4, 3/2011

Supports the following:

MK60N256VLQ100,

MK60X256VLQ100,

MK60N512VLQ100,

MK60N256VMD100,

MK60X256VMD100,

MK60N512VMD100

K60 Sub-Family Data Sheet

K60P144M100SF2

Features

• Operating Characteristics

– Voltage range: 1.71 to 3.6 V

– Flash write voltage range: 1.71 to 3.6 V

– Temperature range (ambient): -40 to 105°C

• Performance

– Up to 100 MHz ARM Cortex-M4 core with DSP

instructions delivering 1.25 Dhrystone MIPS per

MHz

• Memories and memory interfaces

– Up to 512 KB program flash memory on non-

FlexMemory devices

– Up to 256 KB program flash memory on

FlexMemory devices

– Up to 256 KB FlexNVM on FlexMemory devices

– 4 KB FlexRAM on FlexMemory devices

– Up to 128 KB RAM

– Serial programming interface (EzPort)

– FlexBus external bus interface

• Clocks

– 3 to 32 MHz crystal oscillator

– 32 kHz crystal oscillator

– Multi-purpose clock generator

• System peripherals

– 10 low-power modes to provide power optimization

based on application requirements

– Memory protection unit with multi-master

protection

– 16-channel DMA controller, supporting up to 64

request sources

– External watchdog monitor

– Software watchdog

– Low-leakage wakeup unit

• Security and integrity modules

– Hardware CRC module to support fast cyclic

redundancy checks

– Hardware random-number generator

– Hardware encryption supporting DES, 3DES, AES,

MD5, SHA-1, and SHA-256 algorithms

– 128-bit unique identification (ID) number per chip

• Human-machine interface

– Low-power hardware touch sensor interface (TSI)

– General-purpose input/output

• Analog modules

– Two 16-bit SAR ADCs

– Programmable gain amplifier (up to x64) integrated

into each ADC

– Two 12-bit DACs

– Three analog comparators (CMP) containing a 6-bit

DAC and programmable reference input

– Voltage reference

• Timers

– Programmable delay block

– Eight-channel motor control/general purpose/PWM

timer

– Two 2-channel quadrature decoder/general purpose

timers

– IEEE 1588 timers

– Periodic interrupt timers

– 16-bit low-power timer

– Carrier modulator transmitter

– Real-time clock

This document contains information on a product under development. Freescale

reserves the right to change or discontinue this product without notice.

Preliminary

Table of Contents

1 Ordering parts...........................................................................5

1.1 Determining valid orderable parts......................................5

2 Part identification......................................................................5

2.1 Description.........................................................................5

2.2 Format...............................................................................5

2.3 Fields.................................................................................5

2.4 Example............................................................................6

3 Terminology and guidelines......................................................6

3.1 Definition: Operating requirement......................................6

3.2 Definition: Operating behavior...........................................7

3.3 Definition: Attribute............................................................7

3.4 Definition: Rating...............................................................8

3.5 Result of exceeding a rating..............................................8

3.6 Relationship between ratings and operating

requirements......................................................................8

3.7 Guidelines for ratings and operating requirements............9

3.8 Definition: Typical value.....................................................9

3.9 Typical value conditions....................................................10

4 Ratings......................................................................................10

4.1 Thermal handling ratings...................................................11

4.2 Moisture handling ratings..................................................11

4.3 ESD handling ratings.........................................................11

4.4 Voltage and current operating ratings...............................11

5 General.....................................................................................12

5.1 Nonswitching electrical specifications...............................12

5.1.1

5.1.2

5.1.3

5.1.4

5.1.5

5.1.6

5.1.7

5.1.8

Voltage and current operating requirements......12

LVD and POR operating requirements...............13

Voltage and current operating behaviors............14

Power mode transition operating behaviors.......14

Power consumption operating behaviors............15

EMC radiated emissions operating behaviors....18

Designing with radiated emissions in mind.........19

Capacitance attributes........................................19

6.8.8

6.8.9

6.8.10

6.8.11

6.8.7

6 Peripheral operating requirements and behaviors....................21

6.1 Core modules....................................................................22

6.1.1

6.1.2

Debug trace timing specifications.......................22

JTAG electricals..................................................23

6.2 System modules................................................................26

6.3 Clock modules...................................................................26

6.3.1

6.3.2

6.3.3

MCG specifications.............................................26

Oscillator electrical specifications.......................28

32kHz Oscillator Electrical Characteristics.........30

6.4 Memories and memory interfaces.....................................31

6.4.1

6.4.2

6.4.3

Flash (FTFL) electrical specifications.................31

EzPort Switching Specifications.........................35

Flexbus Switching Specifications........................36

6.5 Security and integrity modules..........................................39

6.6 Analog...............................................................................39

6.6.1

6.6.2

6.6.3

6.6.4

ADC electrical specifications..............................39

CMP and 6-bit DAC electrical specifications......47

12-bit DAC electrical characteristics...................50

Voltage reference electrical specifications..........53

6.7 Timers................................................................................54

6.8 Communication interfaces.................................................54

6.8.1

6.8.2

6.8.3

6.8.4

6.8.5

6.8.6

Ethernet switching specifications........................55

USB electrical specifications...............................56

USB DCD electrical specifications......................56

USB VREG electrical specifications...................57

CAN switching specifications..............................57

DSPI switching specifications (low-speed

mode)..................................................................58

DSPI switching specifications (high-speed

mode)..................................................................59

I2C switching specifications................................61

UART switching specifications............................61

SDHC specifications...........................................61

I2S switching specifications................................62

5.2 Switching specifications.....................................................19

5.2.1

5.2.2

Device clock specifications.................................19

General switching specifications.........................20

6.9 Human-machine interfaces (HMI)......................................64

6.9.1

TSI electrical specifications................................64

5.3 Thermal specifications.......................................................21

5.3.1

5.3.2

Thermal operating requirements.........................21

Thermal attributes...............................................21

7 Dimensions...............................................................................65

7.1 Obtaining package dimensions.........................................65

8 Pinout........................................................................................65

K60 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011.

Freescale Semiconductor, Inc.

Preliminary

MK60N512VLQ100R相似产品对比

	MK60N512VLQ100R	MK60X256VLQ100	MK60N256VLQ100	MK60N256VLQ100R	MK60N512VLQ100	MK60N256VMD100	MK60N256VMD100R
描述	FLASH, 100MHz, RISC MICROCONTROLLER, PQFP144, 20 X 20 MM, LQFP-144	FLASH, 100MHz, RISC MICROCONTROLLER, PQFP144, 20 X 20 MM, LQFP-144	FLASH, 100MHz, RISC MICROCONTROLLER, PQFP144, 20 X 20 MM, LQFP-144	FLASH, 100 MHz, RISC MICROCONTROLLER, PQFP144, 20 X 20 MM, LQFP-144	FLASH, 100MHz, RISC MICROCONTROLLER, PQFP144, 20 X 20 MM, LQFP-144	FLASH, 100MHz, RISC MICROCONTROLLER, PBGA144, 13 X 13 MM, MAPBGA-144	FLASH, 100MHz, RISC MICROCONTROLLER, PBGA144, 13 X 13 MM, MAPBGA-144
零件包装代码	QFP	QFP	QFP	QFP	QFP	BGA	BGA
包装说明	LFQFP, QFP144,.87SQ,20	20 X 20 MM, LQFP-144	LFQFP, QFP144,.87SQ,20	LFQFP, QFP144,.87SQ,20	20 X 20 MM, LQFP-144	LBGA, BGA144,12X12,40	LBGA, BGA144,12X12,40
针数	144	144	144	144	144	144	144
Reach Compliance Code	unknown	compli	unknown	unknown	compliant	unknown	unknown
ECCN代码	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3
具有ADC	YES	YES	YES	YES	YES	YES	YES
位大小	32	32	32	32	32	32	32
最大时钟频率	50 MHz	50 MHz	50 MHz	50 MHz	50 MHz	50 MHz	50 MHz
DAC 通道	YES	YES	YES	YES	YES	YES	YES
DMA 通道	YES	YES	YES	YES	YES	YES	YES
JESD-30 代码	S-PQFP-G144	S-PQFP-G144	S-PQFP-G144	S-PQFP-G144	S-PQFP-G144	S-PBGA-B144	S-PBGA-B144
长度	20 mm	20 mm	20 mm	20 mm	20 mm	13 mm	13 mm
I/O 线路数量	94	94	94	94	94	96	96
端子数量	144	144	144	144	144	144	144
最高工作温度	105 °C	105 °C	105 °C	105 °C	105 °C	105 °C	105 °C
最低工作温度	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
PWM 通道	YES	YES	YES	YES	YES	YES	YES
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	LFQFP	LFQFP	LFQFP	LFQFP	LFQFP	LBGA	LBGA
封装等效代码	QFP144,.87SQ,20	QFP144,.87SQ,20	QFP144,.87SQ,20	QFP144,.87SQ,20	QFP144,.87SQ,20	BGA144,12X12,40	BGA144,12X12,40
封装形状	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
封装形式	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE
电源	1.8/3.3 V	1.8/3.3 V	1.8/3.3 V	1.8/3.3 V	1.8/3.3 V	1.8/3.3 V	1.8/3.3 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
RAM（字节）	131072	65536	65536	65536	131072	65536	65536
ROM（单词）	524288	262144	262144	262144	524288	262144	262144
ROM可编程性	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
座面最大高度	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.7 mm	1.7 mm
速度	100 MHz	100 MHz	100 MHz	100 MHz	100 MHz	100 MHz	100 MHz
最大供电电压	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
最小供电电压	1.71 V	1.71 V	1.71 V	1.71 V	1.71 V	1.71 V	1.71 V
标称供电电压	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
表面贴装	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
端子形式	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	BALL	BALL
端子节距	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	1 mm	1 mm
端子位置	QUAD	QUAD	QUAD	QUAD	QUAD	BOTTOM	BOTTOM
宽度	20 mm	20 mm	20 mm	20 mm	20 mm	13 mm	13 mm
uPs/uCs/外围集成电路类型	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC
厂商名称	NXP(恩智浦)	-	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)

MK60N512VLQ100R

MK60N512VLQ100R概述

MK60N512VLQ100R规格参数

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MK60N512VLQ100R相似产品对比

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