Datasheet> 器件分类 > 嵌入式处理器和控制器> 微控制器和处理器> MK60N256VLQ100R

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MK60N256VLQ100R: 产品描述FLASH, 100 MHz, RISC MICROCONTROLLER, PQFP144, 20 X 20 MM, LQFP-144; 产品类别嵌入式处理器和控制器微控制器和处理器; 文件大小2MB，共76页; 制造商NXP(恩智浦); 官网地址https://www.nxp.com

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MK60N256VLQ100R概述

FLASH, 100 MHz, RISC MICROCONTROLLER, PQFP144, 20 X 20 MM, LQFP-144

MK60N256VLQ100R规格参数

参数名称	属性值
厂商名称	NXP(恩智浦)
零件包装代码	QFP
包装说明	LFQFP, QFP144,.87SQ,20
针数	144
Reach Compliance Code	unknown
ECCN代码	3A001.A.3
具有ADC	YES
地址总线宽度
位大小	32
最大时钟频率	50 MHz
DAC 通道	YES
DMA 通道	YES
外部数据总线宽度
JESD-30 代码	S-PQFP-G144
长度	20 mm
I/O 线路数量	94
端子数量	144
最高工作温度	105 °C
最低工作温度	-40 °C
PWM 通道	YES
封装主体材料	PLASTIC/EPOXY
封装代码	LFQFP
封装等效代码	QFP144,.87SQ,20
封装形状	SQUARE
封装形式	FLATPACK, LOW PROFILE, FINE PITCH
电源	1.8/3.3 V
认证状态	Not Qualified
RAM（字节）	65536
ROM（单词）	262144
ROM可编程性	FLASH
座面最大高度	1.6 mm
速度	100 MHz
最大供电电压	3.6 V
最小供电电压	1.71 V
标称供电电压	3.3 V
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子形式	GULL WING
端子节距	0.5 mm
端子位置	QUAD
宽度	20 mm
uPs/uCs/外围集成电路类型	MICROCONTROLLER, RISC

文档解析

K60子系列微控制器搭载ARM Cortex-M4处理器，最高频率100MHz，每MHz提供1.25 Dhrystone MIPS性能。工作电压1.71V至3.6V，闪存操作电压一致，温度范围-40°C至105°C，适应严苛工业环境。内存配置灵活，最大支持512KB程序闪存、128KB RAM，FlexMemory选项扩展至256KB FlexNVM和4KB FlexRAM。时钟系统集成多源振荡器和时钟发生器，支持动态频率调整，配合16通道DMA控制器，提升数据传输效率。通信接口是其核心优势，以太网控制器支持MII/RMII接口及硬件IEEE 1588，USB OTG控制器集成片上收发器，双CAN模块满足车载网络需求。串行接口包括三个SPI、两个I2C和五个UART，SDHC主机控制器和I2S模块增强多媒体连接性。模拟部分配备双16位ADC、可编程增益放大器、双12位DAC和模拟比较器，提供精准信号处理。定时器如电机控制PWM、正交解码器和实时时钟，优化了运动控制和时序应用。该系列适用于网络设备和物联网节点，低功耗设计通过10种模式（如VLLS1消耗仅2μA@3.0V）延长电池寿命。安全模块整合硬件CRC、加密引擎（支持DES、3DES、AES等）和128位唯一ID，确保数据完整性。人机接口如TSI和GPIO，简化用户交互设计。

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Freescale Semiconductor

Data Sheet: Product Preview

Document Number: K60P144M100SF2

Rev. 4, 3/2011

Supports the following:

MK60N256VLQ100,

MK60X256VLQ100,

MK60N512VLQ100,

MK60N256VMD100,

MK60X256VMD100,

MK60N512VMD100

K60 Sub-Family Data Sheet

K60P144M100SF2

Features

• Operating Characteristics

– Voltage range: 1.71 to 3.6 V

– Flash write voltage range: 1.71 to 3.6 V

– Temperature range (ambient): -40 to 105°C

• Performance

– Up to 100 MHz ARM Cortex-M4 core with DSP

instructions delivering 1.25 Dhrystone MIPS per

MHz

• Memories and memory interfaces

– Up to 512 KB program flash memory on non-

FlexMemory devices

– Up to 256 KB program flash memory on

FlexMemory devices

– Up to 256 KB FlexNVM on FlexMemory devices

– 4 KB FlexRAM on FlexMemory devices

– Up to 128 KB RAM

– Serial programming interface (EzPort)

– FlexBus external bus interface

• Clocks

– 3 to 32 MHz crystal oscillator

– 32 kHz crystal oscillator

– Multi-purpose clock generator

• System peripherals

– 10 low-power modes to provide power optimization

based on application requirements

– Memory protection unit with multi-master

protection

– 16-channel DMA controller, supporting up to 64

request sources

– External watchdog monitor

– Software watchdog

– Low-leakage wakeup unit

• Security and integrity modules

– Hardware CRC module to support fast cyclic

redundancy checks

– Hardware random-number generator

– Hardware encryption supporting DES, 3DES, AES,

MD5, SHA-1, and SHA-256 algorithms

– 128-bit unique identification (ID) number per chip

• Human-machine interface

– Low-power hardware touch sensor interface (TSI)

– General-purpose input/output

• Analog modules

– Two 16-bit SAR ADCs

– Programmable gain amplifier (up to x64) integrated

into each ADC

– Two 12-bit DACs

– Three analog comparators (CMP) containing a 6-bit

DAC and programmable reference input

– Voltage reference

• Timers

– Programmable delay block

– Eight-channel motor control/general purpose/PWM

timer

– Two 2-channel quadrature decoder/general purpose

timers

– IEEE 1588 timers

– Periodic interrupt timers

– 16-bit low-power timer

– Carrier modulator transmitter

– Real-time clock

This document contains information on a product under development. Freescale

reserves the right to change or discontinue this product without notice.

Preliminary

Table of Contents

1 Ordering parts...........................................................................5

1.1 Determining valid orderable parts......................................5

2 Part identification......................................................................5

2.1 Description.........................................................................5

2.2 Format...............................................................................5

2.3 Fields.................................................................................5

2.4 Example............................................................................6

3 Terminology and guidelines......................................................6

3.1 Definition: Operating requirement......................................6

3.2 Definition: Operating behavior...........................................7

3.3 Definition: Attribute............................................................7

3.4 Definition: Rating...............................................................8

3.5 Result of exceeding a rating..............................................8

3.6 Relationship between ratings and operating

requirements......................................................................8

3.7 Guidelines for ratings and operating requirements............9

3.8 Definition: Typical value.....................................................9

3.9 Typical value conditions....................................................10

4 Ratings......................................................................................10

4.1 Thermal handling ratings...................................................11

4.2 Moisture handling ratings..................................................11

4.3 ESD handling ratings.........................................................11

4.4 Voltage and current operating ratings...............................11

5 General.....................................................................................12

5.1 Nonswitching electrical specifications...............................12

5.1.1

5.1.2

5.1.3

5.1.4

5.1.5

5.1.6

5.1.7

5.1.8

Voltage and current operating requirements......12

LVD and POR operating requirements...............13

Voltage and current operating behaviors............14

Power mode transition operating behaviors.......14

Power consumption operating behaviors............15

EMC radiated emissions operating behaviors....18

Designing with radiated emissions in mind.........19

Capacitance attributes........................................19

6.8.8

6.8.9

6.8.10

6.8.11

6.8.7

6 Peripheral operating requirements and behaviors....................21

6.1 Core modules....................................................................22

6.1.1

6.1.2

Debug trace timing specifications.......................22

JTAG electricals..................................................23

6.2 System modules................................................................26

6.3 Clock modules...................................................................26

6.3.1

6.3.2

6.3.3

MCG specifications.............................................26

Oscillator electrical specifications.......................28

32kHz Oscillator Electrical Characteristics.........30

6.4 Memories and memory interfaces.....................................31

6.4.1

6.4.2

6.4.3

Flash (FTFL) electrical specifications.................31

EzPort Switching Specifications.........................35

Flexbus Switching Specifications........................36

6.5 Security and integrity modules..........................................39

6.6 Analog...............................................................................39

6.6.1

6.6.2

6.6.3

6.6.4

ADC electrical specifications..............................39

CMP and 6-bit DAC electrical specifications......47

12-bit DAC electrical characteristics...................50

Voltage reference electrical specifications..........53

6.7 Timers................................................................................54

6.8 Communication interfaces.................................................54

6.8.1

6.8.2

6.8.3

6.8.4

6.8.5

6.8.6

Ethernet switching specifications........................55

USB electrical specifications...............................56

USB DCD electrical specifications......................56

USB VREG electrical specifications...................57

CAN switching specifications..............................57

DSPI switching specifications (low-speed

mode)..................................................................58

DSPI switching specifications (high-speed

mode)..................................................................59

I2C switching specifications................................61

UART switching specifications............................61

SDHC specifications...........................................61

I2S switching specifications................................62

5.2 Switching specifications.....................................................19

5.2.1

5.2.2

Device clock specifications.................................19

General switching specifications.........................20

6.9 Human-machine interfaces (HMI)......................................64

6.9.1

TSI electrical specifications................................64

5.3 Thermal specifications.......................................................21

5.3.1

5.3.2

Thermal operating requirements.........................21

Thermal attributes...............................................21

7 Dimensions...............................................................................65

7.1 Obtaining package dimensions.........................................65

8 Pinout........................................................................................65

K60 Sub-Family Data Sheet Data Sheet, Rev. 4, 3/2011.

Freescale Semiconductor, Inc.

Preliminary

MK60N256VLQ100R相似产品对比

	MK60N256VLQ100R	MK60X256VLQ100	MK60N512VLQ100R	MK60N256VLQ100	MK60N512VLQ100	MK60N256VMD100	MK60N256VMD100R
描述	FLASH, 100 MHz, RISC MICROCONTROLLER, PQFP144, 20 X 20 MM, LQFP-144	FLASH, 100MHz, RISC MICROCONTROLLER, PQFP144, 20 X 20 MM, LQFP-144	FLASH, 100MHz, RISC MICROCONTROLLER, PQFP144, 20 X 20 MM, LQFP-144	FLASH, 100MHz, RISC MICROCONTROLLER, PQFP144, 20 X 20 MM, LQFP-144	FLASH, 100MHz, RISC MICROCONTROLLER, PQFP144, 20 X 20 MM, LQFP-144	FLASH, 100MHz, RISC MICROCONTROLLER, PBGA144, 13 X 13 MM, MAPBGA-144	FLASH, 100MHz, RISC MICROCONTROLLER, PBGA144, 13 X 13 MM, MAPBGA-144
零件包装代码	QFP	QFP	QFP	QFP	QFP	BGA	BGA
包装说明	LFQFP, QFP144,.87SQ,20	20 X 20 MM, LQFP-144	LFQFP, QFP144,.87SQ,20	LFQFP, QFP144,.87SQ,20	20 X 20 MM, LQFP-144	LBGA, BGA144,12X12,40	LBGA, BGA144,12X12,40
针数	144	144	144	144	144	144	144
Reach Compliance Code	unknown	compli	unknown	unknown	compliant	unknown	unknown
ECCN代码	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3
具有ADC	YES	YES	YES	YES	YES	YES	YES
位大小	32	32	32	32	32	32	32
最大时钟频率	50 MHz	50 MHz	50 MHz	50 MHz	50 MHz	50 MHz	50 MHz
DAC 通道	YES	YES	YES	YES	YES	YES	YES
DMA 通道	YES	YES	YES	YES	YES	YES	YES
JESD-30 代码	S-PQFP-G144	S-PQFP-G144	S-PQFP-G144	S-PQFP-G144	S-PQFP-G144	S-PBGA-B144	S-PBGA-B144
长度	20 mm	20 mm	20 mm	20 mm	20 mm	13 mm	13 mm
I/O 线路数量	94	94	94	94	94	96	96
端子数量	144	144	144	144	144	144	144
最高工作温度	105 °C	105 °C	105 °C	105 °C	105 °C	105 °C	105 °C
最低工作温度	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
PWM 通道	YES	YES	YES	YES	YES	YES	YES
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	LFQFP	LFQFP	LFQFP	LFQFP	LFQFP	LBGA	LBGA
封装等效代码	QFP144,.87SQ,20	QFP144,.87SQ,20	QFP144,.87SQ,20	QFP144,.87SQ,20	QFP144,.87SQ,20	BGA144,12X12,40	BGA144,12X12,40
封装形状	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
封装形式	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	FLATPACK, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE
电源	1.8/3.3 V	1.8/3.3 V	1.8/3.3 V	1.8/3.3 V	1.8/3.3 V	1.8/3.3 V	1.8/3.3 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
RAM（字节）	65536	65536	131072	65536	131072	65536	65536
ROM（单词）	262144	262144	524288	262144	524288	262144	262144
ROM可编程性	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
座面最大高度	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.6 mm	1.7 mm	1.7 mm
速度	100 MHz	100 MHz	100 MHz	100 MHz	100 MHz	100 MHz	100 MHz
最大供电电压	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V
最小供电电压	1.71 V	1.71 V	1.71 V	1.71 V	1.71 V	1.71 V	1.71 V
标称供电电压	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V	3.3 V
表面贴装	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
端子形式	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	BALL	BALL
端子节距	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	1 mm	1 mm
端子位置	QUAD	QUAD	QUAD	QUAD	QUAD	BOTTOM	BOTTOM
宽度	20 mm	20 mm	20 mm	20 mm	20 mm	13 mm	13 mm
uPs/uCs/外围集成电路类型	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC
厂商名称	NXP(恩智浦)	-	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)

MK60N256VLQ100R

MK60N256VLQ100R概述

MK60N256VLQ100R规格参数

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MK60N256VLQ100R相似产品对比

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