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HY27SF082G2B-TCP: 产品描述Flash, 256MX8, 30ns, PDSO48, 12 X 20 MM, 1.20 MM HEIGHT, PLASTIC, TSOP1-48; 产品类别存储存储; 文件大小379KB，共51页; 制造商SK Hynix(海力士); 官网地址http://www.hynix.com/eng/; 标准

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HY27SF082G2B-TCP概述

Flash, 256MX8, 30ns, PDSO48, 12 X 20 MM, 1.20 MM HEIGHT, PLASTIC, TSOP1-48

HY27SF082G2B-TCP规格参数

参数名称	属性值
是否Rohs认证	符合
厂商名称	SK Hynix(海力士)
零件包装代码	TSOP1
包装说明	TSOP1, TSSOP56,.8,20
针数	48
Reach Compliance Code	compliant
ECCN代码	3A991.B.1.A
最长访问时间	30 ns
命令用户界面	YES
数据轮询	NO
JESD-30 代码	R-PDSO-G48
长度	18.4 mm
内存密度	2147483648 bit
内存集成电路类型	FLASH
内存宽度	8
功能数量	1
部门数/规模	2K
端子数量	48
字数	268435456 words
字数代码	256000000
工作模式	SYNCHRONOUS
最高工作温度	70 °C
最低工作温度
组织	256MX8
封装主体材料	PLASTIC/EPOXY
封装代码	TSOP1
封装等效代码	TSSOP56,.8,20
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE
页面大小	2K words
并行/串行	PARALLEL
电源	1.8 V
编程电压	1.8 V
认证状态	Not Qualified
就绪/忙碌	YES
座面最大高度	1.2 mm
部门规模	128K
最大待机电流	0.00005 A
最大压摆率	0.02 mA
最大供电电压 (Vsup)	1.95 V
最小供电电压 (Vsup)	1.7 V
标称供电电压 (Vsup)	1.8 V
表面贴装	YES
技术	CMOS
温度等级	COMMERCIAL
端子形式	GULL WING
端子节距	0.5 mm
端子位置	DUAL
切换位	NO
类型	SLC NAND TYPE
宽度	12 mm

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HY27SF(08/16)2G2B Series

2Gbit (256Mx8bit/128Mx16bit) NAND Flash

2Gb NAND FLASH

HY27SF(08/16)2G2B

This document is a general product description and is subject to change without notice. Hynix does not assume any responsibility for

use of circuits described. No patent licenses are implied.

Rev 0.3 / Feb. 2008

HY27SF(08/16)2G2B Series

2Gbit (256Mx8bit/128Mx16bit) NAND Flash

1.SUMMARY DESCRIPTION

Hynix NAND HY27SF(08/16)2G2B Series have 256Mx8bit with spare 8Mx8 bit capacity. The device is offered in 1.8V Vcc

Power Supply, and with x8 and x16 I/O interface Its NAND cell provides the most cost-effective solution for the solid state

mass storage market. The memory is divided into blocks that can be erased independently so it is possible to preserve

valid data while old data is erased.

The device contains 2048 blocks, composed by 64 pages. A program operation allows to write the 2112-byte page in typi-

cal 250us and an erase operation can be performed in typical 2.0ms on a 128K-byte block.

Data in the page can be read out at 45ns cycle time per byte(x8). The I/O pins serve as the ports for address and data

input/output as well as command input.

This interface allows a reduced pin count and easy migration towards different densities, without any rearrangement of

footprint. Commands, Data and Addresses are synchronously introduced using CE, WE, RE, ALE and CLE input pin. The

on-chip Program/Erase Controller automates all read, program and erase functions including pulse repetition, where

required, and internal verification and margining of data. The modify operations can be locked using the WP input. The

output pin R/B (open drain buffer) signals the status of the device during each operation. In a system with multiple mem-

ories the R/B pins can be connected all together to provide a global status signal.

The copy back function allows the optimization of defective blocks management. When a page program operation fails

the data can be directly programmed in another page inside the same array section without the time consuming serial

data insertion phase. Copy back operation automatically executes embedded error detection operation: 1 bit error

every 528byte (x8) or 1bit error out of every 264-word (x16) can be detected. Due to this feature, it is no more nor neces-

sary nor recommended to use external 2-bit ECC to detect copy back operation errors. Data read out after copy back read

(both for single and multiplane cases) is allowed.

Even the write-intensive systems can take advantage of the HY27SF(08/16)2G2B Series extended reliability of 100K pro-

gram/erase cycles by supporting ECC (Error Correcting Code) with real time mapping-out algorithm. The chip supports CE

don’t care function. This function allows the direct download of the code from the NAND Flash memory device by a micro-

controller, since the CE transitions do not stop the read operation.

This device includes also extra features like OTP/Unique ID area, Read ID2 extension, and Block Protection.

Especially Block Protection allows protection on Block 0 or OTP area of the device against Write/Erase operations on that

block.

The HY27SF(08/16)2G2B Series are available in 48-TSOP1 12 x 20 mm.

1.1 Product List

PART NUMBER

HY27SF(08/16)2G2B

ORGANIZATION

x8 / x16

Vcc RANGE

1.7V ~ 1.95V

PACKAGE

48-TSOP1

Rev 0.3 / Feb. 2008

HY27SF082G2B-TCP相似产品对比

	HY27SF082G2B-TCP	HY27SF162G2B-TPIP	HY27SF162G2B-TIP	HY27SF082G2B-TPIP	HY27SF162G2B-TCP	HY27SF082G2B-TIP	HY27SF162G2B-TPCP	HY27SF082G2B-TPCP
描述	Flash, 256MX8, 30ns, PDSO48, 12 X 20 MM, 1.20 MM HEIGHT, PLASTIC, TSOP1-48	Flash, 256MX8, 30ns, PDSO48, 12 X 20 MM, 1.20 MM HEIGHT, LEAD FREE, PLASTIC, TSOP1-48	Flash, 256MX8, 30ns, PDSO48, 12 X 20 MM, 1.20 MM HEIGHT, PLASTIC, TSOP1-48	Flash, 256MX8, 30ns, PDSO48, 12 X 20 MM, 1.20 MM HEIGHT, LEAD FREE, PLASTIC, TSOP1-48	Flash, 256MX8, 30ns, PDSO48, 12 X 20 MM, 1.20 MM HEIGHT, PLASTIC, TSOP1-48	Flash, 256MX8, 30ns, PDSO48, 12 X 20 MM, 1.20 MM HEIGHT, PLASTIC, TSOP1-48	Flash, 256MX8, 30ns, PDSO48, 12 X 20 MM, 1.20 MM HEIGHT, LEAD FREE, PLASTIC, TSOP1-48	Flash, 256MX8, 30ns, PDSO48, 12 X 20 MM, 1.20 MM HEIGHT, LEAD FREE, PLASTIC, TSOP1-48
是否Rohs认证	符合	符合	符合	符合	符合	符合	符合	符合
厂商名称	SK Hynix(海力士)	SK Hynix(海力士)	SK Hynix(海力士)	SK Hynix(海力士)	SK Hynix(海力士)	SK Hynix(海力士)	SK Hynix(海力士)	SK Hynix(海力士)
零件包装代码	TSOP1	TSOP1	TSOP1	TSOP1	TSOP1	TSOP1	TSOP1	TSOP1
包装说明	TSOP1, TSSOP56,.8,20	TSOP1, TSSOP48,.8,20	TSOP1, TSSOP48,.8,20	TSOP1, TSSOP56,.8,20	TSOP1, TSSOP48,.8,20	TSOP1, TSSOP56,.8,20	TSOP1, TSSOP48,.8,20	TSOP1, TSSOP56,.8,20
针数	48	48	48	48	48	48	48	48
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compliant
ECCN代码	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A
最长访问时间	30 ns	30 ns	30 ns	30 ns	30 ns	30 ns	30 ns	30 ns
命令用户界面	YES	YES	YES	YES	YES	YES	YES	YES
数据轮询	NO	NO	NO	NO	NO	NO	NO	NO
JESD-30 代码	R-PDSO-G48	R-PDSO-G48	R-PDSO-G48	R-PDSO-G48	R-PDSO-G48	R-PDSO-G48	R-PDSO-G48	R-PDSO-G48
长度	18.4 mm	18.4 mm	18.4 mm	18.4 mm	18.4 mm	18.4 mm	18.4 mm	18.4 mm
内存密度	2147483648 bit	2147483648 bit	2147483648 bit	2147483648 bit	2147483648 bit	2147483648 bit	2147483648 bit	2147483648 bit
内存集成电路类型	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
内存宽度	8	8	8	8	8	8	8	8
功能数量	1	1	1	1	1	1	1	1
部门数/规模	2K	2K	2K	2K	2K	2K	2K	2K
端子数量	48	48	48	48	48	48	48	48
字数	268435456 words	268435456 words	268435456 words	268435456 words	268435456 words	268435456 words	268435456 words	268435456 words
字数代码	256000000	256000000	256000000	256000000	256000000	256000000	256000000	256000000
工作模式	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
最高工作温度	70 °C	85 °C	85 °C	85 °C	70 °C	85 °C	70 °C	70 °C
组织	256MX8	256MX8	256MX8	256MX8	256MX8	256MX8	256MX8	256MX8
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	TSOP1	TSOP1	TSOP1	TSOP1	TSOP1	TSOP1	TSOP1	TSOP1
封装等效代码	TSSOP56,.8,20	TSSOP48,.8,20	TSSOP48,.8,20	TSSOP56,.8,20	TSSOP48,.8,20	TSSOP56,.8,20	TSSOP48,.8,20	TSSOP56,.8,20
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE
页面大小	2K words	1K words	1K words	2K words	1K words	2K words	1K words	2K words
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
电源	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
编程电压	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
就绪/忙碌	YES	YES	YES	YES	YES	YES	YES	YES
座面最大高度	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm
部门规模	128K	64K	64K	128K	64K	128K	64K	128K
最大待机电流	0.00005 A	0.00005 A	0.00005 A	0.00005 A	0.00005 A	0.00005 A	0.00005 A	0.00005 A
最大压摆率	0.02 mA	0.02 mA	0.02 mA	0.02 mA	0.02 mA	0.02 mA	0.02 mA	0.02 mA
最大供电电压 (Vsup)	1.95 V	1.95 V	1.95 V	1.95 V	1.95 V	1.95 V	1.95 V	1.95 V
最小供电电压 (Vsup)	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V
标称供电电压 (Vsup)	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL
端子形式	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
端子节距	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
切换位	NO	NO	NO	NO	NO	NO	NO	NO
类型	SLC NAND TYPE	NAND TYPE	NAND TYPE	SLC NAND TYPE	SLC NAND TYPE	SLC NAND TYPE	SLC NAND TYPE	SLC NAND TYPE
宽度	12 mm	12 mm	12 mm	12 mm	12 mm	12 mm	12 mm	12 mm

HY27SF082G2B-TCP

HY27SF082G2B-TCP概述

HY27SF082G2B-TCP规格参数

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HY27SF082G2B-TCP相似产品对比

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