EE PLD, 15ns, PLA-Type, CMOS, PDIP24
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Integrated Circuit Systems（IDT ） |
| Reach Compliance Code | unknown |
| 架构 | PLA-TYPE |
| JESD-30 代码 | R-PDIP-T24 |
| JESD-609代码 | e0 |
| 输入次数 | 22 |
| 输出次数 | 10 |
| 产品条款数 | 42 |
| 端子数量 | 24 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP24,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 5 V |
| 可编程逻辑类型 | EE PLD |
| 传播延迟 | 15 ns |
| 认证状态 | Not Qualified |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| PEEL273P-15 | PEEL273C-30 | PEEL273C-35 | PEEL273C-40 | PEEL273P-12 | PEEL273P-30 | PEEL273P-35 | PEEL273P-40 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | EE PLD, 15ns, PLA-Type, CMOS, PDIP24 | EE PLD, 30ns, PLA-Type, CMOS, CDIP24 | EE PLD, 35ns, PLA-Type, CMOS, CDIP24 | EE PLD, 40ns, PLA-Type, CMOS, CDIP24 | EE PLD, 12ns, PLA-Type, CMOS, PDIP24 | EE PLD, 30ns, PLA-Type, CMOS, PDIP24 | EE PLD, 35ns, PLA-Type, CMOS, PDIP24 | EE PLD, 40ns, PLA-Type, CMOS, PDIP24 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Integrated Circuit Systems（IDT ） | Integrated Circuit Systems（IDT ） | Integrated Circuit Systems（IDT ） | Integrated Circuit Systems（IDT ） | Integrated Circuit Systems（IDT ） | Integrated Circuit Systems（IDT ） | Integrated Circuit Systems（IDT ） | Integrated Circuit Systems（IDT ） |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 架构 | PLA-TYPE | PLA-TYPE | PLA-TYPE | PLA-TYPE | PLA-TYPE | PLA-TYPE | PLA-TYPE | PLA-TYPE |
| JESD-30 代码 | R-PDIP-T24 | R-XDIP-T24 | R-XDIP-T24 | R-XDIP-T24 | R-PDIP-T24 | R-PDIP-T24 | R-PDIP-T24 | R-PDIP-T24 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 输入次数 | 22 | 22 | 22 | 22 | 22 | 22 | 22 | 22 |
| 输出次数 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 |
| 产品条款数 | 42 | 42 | 42 | 42 | 42 | 42 | 42 | 42 |
| 端子数量 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC | CERAMIC | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
| 封装等效代码 | DIP24,.3 | DIP24,.3 | DIP24,.3 | DIP24,.3 | DIP24,.3 | DIP24,.3 | DIP24,.3 | DIP24,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 可编程逻辑类型 | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD |
| 传播延迟 | 15 ns | 30 ns | 35 ns | 40 ns | 12 ns | 30 ns | 35 ns | 40 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
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