Digital Signal Processors & Controllers - DSP, DSC Dig Media Proc
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | BGA |
| 包装说明 | FBGA, BGA529,23X23,32 |
| 针数 | 529 |
| Reach Compliance Code | unknow |
| ECCN代码 | 3A001.A.3 |
| 其他特性 | IT ALSO OPERATES AT 3.3 OR 1.8 V FOR I/O SUPPLY |
| 地址总线宽度 | 32 |
| 桶式移位器 | NO |
| 位大小 | 32 |
| 边界扫描 | YES |
| 最大时钟频率 | 1100 MHz |
| 外部数据总线宽度 | 32 |
| 格式 | FIXED POINT |
| 内部总线架构 | MULTIPLE |
| JESD-30 代码 | S-PBGA-B529 |
| JESD-609代码 | e1 |
| 长度 | 19 mm |
| 低功率模式 | YES |
| 湿度敏感等级 | 4 |
| 端子数量 | 529 |
| 最高工作温度 | 90 °C |
| 最低工作温度 | |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | FBGA |
| 封装等效代码 | BGA529,23X23,32 |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY, FINE PITCH |
| 峰值回流温度（摄氏度） | 245 |
| 电源 | 1.2,1.8,3.3 V |
| 认证状态 | Not Qualified |
| RAM（字数） | 8192 |
| 座面最大高度 | 3.3 mm |
| 最大供电电压 | 1.26 V |
| 最小供电电压 | 1.14 V |
| 标称供电电压 | 1.2 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | OTHER |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) |
| 端子形式 | BALL |
| 端子节距 | 0.8 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 19 mm |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER |
| TMS320DM647ZUT1 | TMS320DM648CUTD1 | TMS320DM648ZUTD1 | TMS320DM648CUT1 | TNETV2685FIDZUT11 | TNETV2685VIDZUT11 | TNETV2685ZUT11 | TNETV2685FIBZUT11 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Digital Signal Processors & Controllers - DSP, DSC Dig Media Proc | Digital Signal Processors & Controllers - DSP, DSC Dig Media Proc | Digital Signal Processors & Controllers - DSP, DSC Digital Media Proc | Digital Signal Processors & Controllers - DSP, DSC Dig Media Proc | Digital Media Processor 529-FCBGA 0 to 90 | Digital Media Processor 529-FCBGA 0 to 90 | Digital Media Processor 529-FCBGA 0 to 90 | Digital Media Processor 529-FCBGA 0 to 90 |
| Brand Name | Texas Instruments | - | - | - | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否Rohs认证 | 符合 | - | - | - | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | FBGA, BGA529,23X23,32 | - | - | - | FBGA, | FBGA, | FBGA, | FBGA, |
| Reach Compliance Code | unknow | - | - | - | not_compliant | not_compliant | not_compliant | not_compliant |
| 地址总线宽度 | 32 | - | - | - | 14 | 14 | 14 | 14 |
| 桶式移位器 | NO | - | - | - | NO | NO | NO | NO |
| 边界扫描 | YES | - | - | - | YES | YES | YES | YES |
| 外部数据总线宽度 | 32 | - | - | - | 32 | 32 | 32 | 32 |
| 格式 | FIXED POINT | - | - | - | FIXED POINT | FIXED POINT | FIXED POINT | FIXED POINT |
| 内部总线架构 | MULTIPLE | - | - | - | MULTIPLE | MULTIPLE | MULTIPLE | MULTIPLE |
| JESD-30 代码 | S-PBGA-B529 | - | - | - | S-PBGA-B520 | S-PBGA-B520 | S-PBGA-B520 | S-PBGA-B520 |
| JESD-609代码 | e1 | - | - | - | e1 | e1 | e1 | e1 |
| 长度 | 19 mm | - | - | - | 19 mm | 19 mm | 19 mm | 19 mm |
| 低功率模式 | YES | - | - | - | YES | YES | YES | YES |
| 湿度敏感等级 | 4 | - | - | - | 4 | 4 | 4 | 4 |
| 端子数量 | 529 | - | - | - | 520 | 520 | 520 | 520 |
| 最高工作温度 | 90 °C | - | - | - | 90 °C | 90 °C | 90 °C | 90 °C |
| 封装主体材料 | PLASTIC/EPOXY | - | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | FBGA | - | - | - | FBGA | FBGA | FBGA | FBGA |
| 封装形状 | SQUARE | - | - | - | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY, FINE PITCH | - | - | - | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH |
| 峰值回流温度（摄氏度） | 245 | - | - | - | 245 | 245 | 245 | 245 |
| 座面最大高度 | 3.3 mm | - | - | - | 3.3 mm | 3.3 mm | 3.3 mm | 3.3 mm |
| 最大供电电压 | 1.26 V | - | - | - | 1.26 V | 1.26 V | 1.26 V | 1.26 V |
| 最小供电电压 | 1.14 V | - | - | - | 1.14 V | 1.14 V | 1.14 V | 1.14 V |
| 标称供电电压 | 1.2 V | - | - | - | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| 表面贴装 | YES | - | - | - | YES | YES | YES | YES |
| 技术 | CMOS | - | - | - | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | OTHER | - | - | - | OTHER | OTHER | OTHER | OTHER |
| 端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) | - | - | - | TIN SILVER COPPER | TIN SILVER COPPER | TIN SILVER COPPER | TIN SILVER COPPER |
| 端子形式 | BALL | - | - | - | BALL | BALL | BALL | BALL |
| 端子节距 | 0.8 mm | - | - | - | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
| 端子位置 | BOTTOM | - | - | - | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | - | - | - | 30 | 30 | 30 | 30 |
| 宽度 | 19 mm | - | - | - | 19 mm | 19 mm | 19 mm | 19 mm |
| uPs/uCs/外围集成电路类型 | DIGITAL SIGNAL PROCESSOR, OTHER | - | - | - | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER | DIGITAL SIGNAL PROCESSOR, OTHER |
测试/测量
无线连接
工业自动化与控制
嵌入式系统
嵌入式系统
stm32/stm8
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
