Asynchronous Communications Element With Autoflow Control 24-BGA MICROSTAR JUNIOR -40 to 85
参数名称 | 属性值 |
Brand Name | Texas Instruments |
是否无铅 | 不含铅 |
是否Rohs认证 | 符合 |
厂商名称 | Texas Instruments(德州仪器) |
零件包装代码 | BGA |
包装说明 | VFBGA, BGA24,5X5,20 |
针数 | 24 |
Reach Compliance Code | compli |
ECCN代码 | EAR99 |
Factory Lead Time | 1 week |
其他特性 | ALSO OPERATES AT 2.5V/3.3V SUPPLY |
地址总线宽度 | 3 |
边界扫描 | NO |
最大时钟频率 | 24 MHz |
通信协议 | ASYNC, BIT |
最大数据传输速率 | 0.1875 MBps |
外部数据总线宽度 | 8 |
JESD-30 代码 | S-PBGA-B24 |
JESD-609代码 | e1 |
长度 | 3 mm |
低功率模式 | NO |
湿度敏感等级 | 1 |
串行 I/O 数 | 1 |
端子数量 | 24 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | VFBGA |
封装等效代码 | BGA24,5X5,20 |
封装形状 | SQUARE |
封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
峰值回流温度(摄氏度) | 260 |
电源 | 2.5/5 V |
认证状态 | Not Qualified |
座面最大高度 | 1 mm |
最大压摆率 | 8 mA |
最大供电电压 | 5.5 V |
最小供电电压 | 4.5 V |
标称供电电压 | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式 | BALL |
端子节距 | 0.5 mm |
端子位置 | BOTTOM |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 3 mm |
uPs/uCs/外围集成电路类型 | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
TL16C550DIZQSR | TL16C550DIPFBG4 | TL16C550DIPFBRG4 | TL16C550DRHBG4 | TL16C550DZQSR | |
---|---|---|---|---|---|
描述 | Asynchronous Communications Element With Autoflow Control 24-BGA MICROSTAR JUNIOR -40 to 85 | UART Interface IC Asynch Comm Element | Asynchronous Communications Element With Autoflow Control 48-TQFP -40 to 85 | Asynchronous Communications Element With Autoflow Control 32-VQFN 0 to 70 | UART Interface IC Asynch Comm Element |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 |
厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
零件包装代码 | BGA | QFP | QFP | QFN | BGA |
包装说明 | VFBGA, BGA24,5X5,20 | GREEN, PLASTIC, TQFP-48 | GREEN, PLASTIC, TQFP-48 | HVQCCN, LCC32,.2SQ,20 | VFBGA, BGA24,5X5,20 |
针数 | 24 | 48 | 48 | 32 | 24 |
Reach Compliance Code | compli | unknow | compli | compli | compli |
其他特性 | ALSO OPERATES AT 2.5V/3.3V SUPPLY | ALSO OPERATES AT 2.5V/3.3V SUPPLY | ALSO OPERATES AT 2.5V/3.3V SUPPLY | ALSO OPERATES AT 2.5V/3.3V SUPPLY | ALSO OPERATES AT 2.5V/3.3V SUPPLY |
地址总线宽度 | 3 | 3 | 3 | 3 | 3 |
边界扫描 | NO | NO | NO | NO | NO |
最大时钟频率 | 24 MHz | 24 MHz | 24 MHz | 24 MHz | 24 MHz |
通信协议 | ASYNC, BIT | ASYNC, BIT | ASYNC, BIT | ASYNC, BIT | ASYNC, BIT |
最大数据传输速率 | 0.1875 MBps | 0.1875 MBps | 0.1875 MBps | 0.1875 MBps | 0.1875 MBps |
外部数据总线宽度 | 8 | 8 | 8 | 8 | 8 |
JESD-30 代码 | S-PBGA-B24 | S-PQFP-G48 | S-PQFP-G48 | S-PQCC-N32 | S-PBGA-B24 |
JESD-609代码 | e1 | e4 | e4 | e4 | e1 |
长度 | 3 mm | 7 mm | 7 mm | 5 mm | 3 mm |
低功率模式 | NO | NO | NO | NO | NO |
湿度敏感等级 | 1 | 2 | 2 | 2 | 1 |
串行 I/O 数 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 24 | 48 | 48 | 32 | 24 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 70 °C | 70 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | - | - |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | VFBGA | TFQFP | TFQFP | HVQCCN | VFBGA |
封装等效代码 | BGA24,5X5,20 | TQFP48,.35SQ | TQFP48,.35SQ | LCC32,.2SQ,20 | BGA24,5X5,20 |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | FLATPACK, THIN PROFILE, FINE PITCH | FLATPACK, THIN PROFILE, FINE PITCH | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 | 260 |
电源 | 2.5/5 V | 2.5/5 V | 2.5/5 V | 2.5/5 V | 2.5/5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1 mm | 1.2 mm | 1.2 mm | 1 mm | 1 mm |
最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL |
端子面层 | Tin/Silver/Copper (Sn/Ag/Cu) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式 | BALL | GULL WING | GULL WING | NO LEAD | BALL |
端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
端子位置 | BOTTOM | QUAD | QUAD | QUAD | BOTTOM |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 3 mm | 7 mm | 7 mm | 5 mm | 3 mm |
uPs/uCs/外围集成电路类型 | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
Brand Name | Texas Instruments | - | Texas Instruments | Texas Instruments | Texas Instruments |
是否无铅 | 不含铅 | 不含铅 | - | - | 不含铅 |
Factory Lead Time | 1 week | - | - | 1 week | 1 week |
器件名 | 厂商 | 描述 |
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SC16C750IA44 | NXP(恩智浦) | IC 1 CHANNEL(S), 3M bps, SERIAL COMM CONTROLLER, PQCC44, PLASTIC, MS-018, SOT-187-2, LCC-44, Serial IO/Communication Controller |
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ST16C450IQ48-F | Exar | Serial I/O Controller, 1 Channel(s), 0.1875MBps, CMOS, PQFP48, GREEN, TQFP-48 |
XR16L2750CJ | Exar | Serial I/O Controller, 2 Channel(s), 0.78125MBps, CMOS, PQCC44, PLASTIC, LCC-44 |
XR16C850CM | Exar | Serial I/O Controller, 1 Channel(s), 0.28125MBps, CMOS, PQFP48, 7 X 7 MM, 1 MM HEIGHT, TQFP-48 |
INS8250AN | National Semiconductor(TI ) | IC 1 CHANNEL(S), 5.6K bps, SERIAL COMM CONTROLLER, PDIP40, PLASTIC, DIP-40, Serial IO/Communication Controller |
SC16C650BIA44 | NXP(恩智浦) | UART Interface IC 16CB 2.5V-5V 1CH UART 32B FIFO |
TL16C552AMPN | Texas Instruments(德州仪器) | 2 CHANNEL(S), 1Mbps, SERIAL COMM CONTROLLER, PQFP80, PLASTIC, QFP-80 |
TL16C552AHV | Texas Instruments(德州仪器) | 2 CHANNEL(S), 1Mbps, SERIAL COMM CONTROLLER, CQFP68, CERAMIC, QFP-68 |
XR16C2550IM | Exar | Serial I/O Controller, 2 Channel(s), 0.5MBps, CMOS, PQFP48, 7 X 7 MM, 1 MM HEIGHT, TQFP-48 |
TL16C552AMFK | Texas Instruments(德州仪器) | 2 CHANNEL(S), 1Mbps, SERIAL COMM CONTROLLER, CQCC68, CERAMIC, LLCC-68 |
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