|
TL16C550DIPFBG4 |
TL16C550DIPFBRG4 |
TL16C550DIZQSR |
TL16C550DRHBG4 |
TL16C550DZQSR |
描述 |
UART Interface IC Asynch Comm Element |
Asynchronous Communications Element With Autoflow Control 48-TQFP -40 to 85 |
Asynchronous Communications Element With Autoflow Control 24-BGA MICROSTAR JUNIOR -40 to 85 |
Asynchronous Communications Element With Autoflow Control 32-VQFN 0 to 70 |
UART Interface IC Asynch Comm Element |
是否Rohs认证 |
符合 |
符合 |
符合 |
符合 |
符合 |
厂商名称 |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
零件包装代码 |
QFP |
QFP |
BGA |
QFN |
BGA |
包装说明 |
GREEN, PLASTIC, TQFP-48 |
GREEN, PLASTIC, TQFP-48 |
VFBGA, BGA24,5X5,20 |
HVQCCN, LCC32,.2SQ,20 |
VFBGA, BGA24,5X5,20 |
针数 |
48 |
48 |
24 |
32 |
24 |
Reach Compliance Code |
unknow |
compli |
compli |
compli |
compli |
其他特性 |
ALSO OPERATES AT 2.5V/3.3V SUPPLY |
ALSO OPERATES AT 2.5V/3.3V SUPPLY |
ALSO OPERATES AT 2.5V/3.3V SUPPLY |
ALSO OPERATES AT 2.5V/3.3V SUPPLY |
ALSO OPERATES AT 2.5V/3.3V SUPPLY |
地址总线宽度 |
3 |
3 |
3 |
3 |
3 |
边界扫描 |
NO |
NO |
NO |
NO |
NO |
最大时钟频率 |
24 MHz |
24 MHz |
24 MHz |
24 MHz |
24 MHz |
通信协议 |
ASYNC, BIT |
ASYNC, BIT |
ASYNC, BIT |
ASYNC, BIT |
ASYNC, BIT |
最大数据传输速率 |
0.1875 MBps |
0.1875 MBps |
0.1875 MBps |
0.1875 MBps |
0.1875 MBps |
外部数据总线宽度 |
8 |
8 |
8 |
8 |
8 |
JESD-30 代码 |
S-PQFP-G48 |
S-PQFP-G48 |
S-PBGA-B24 |
S-PQCC-N32 |
S-PBGA-B24 |
JESD-609代码 |
e4 |
e4 |
e1 |
e4 |
e1 |
长度 |
7 mm |
7 mm |
3 mm |
5 mm |
3 mm |
低功率模式 |
NO |
NO |
NO |
NO |
NO |
湿度敏感等级 |
2 |
2 |
1 |
2 |
1 |
串行 I/O 数 |
1 |
1 |
1 |
1 |
1 |
端子数量 |
48 |
48 |
24 |
32 |
24 |
最高工作温度 |
85 °C |
85 °C |
85 °C |
70 °C |
70 °C |
最低工作温度 |
-40 °C |
-40 °C |
-40 °C |
- |
- |
封装主体材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
封装代码 |
TFQFP |
TFQFP |
VFBGA |
HVQCCN |
VFBGA |
封装等效代码 |
TQFP48,.35SQ |
TQFP48,.35SQ |
BGA24,5X5,20 |
LCC32,.2SQ,20 |
BGA24,5X5,20 |
封装形状 |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
封装形式 |
FLATPACK, THIN PROFILE, FINE PITCH |
FLATPACK, THIN PROFILE, FINE PITCH |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
峰值回流温度(摄氏度) |
260 |
260 |
260 |
260 |
260 |
电源 |
2.5/5 V |
2.5/5 V |
2.5/5 V |
2.5/5 V |
2.5/5 V |
认证状态 |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
座面最大高度 |
1.2 mm |
1.2 mm |
1 mm |
1 mm |
1 mm |
最大供电电压 |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
最小供电电压 |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
4.5 V |
标称供电电压 |
5 V |
5 V |
5 V |
5 V |
5 V |
表面贴装 |
YES |
YES |
YES |
YES |
YES |
技术 |
CMOS |
CMOS |
CMOS |
CMOS |
CMOS |
温度等级 |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
COMMERCIAL |
COMMERCIAL |
端子面层 |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Tin/Silver/Copper (Sn/Ag/Cu) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式 |
GULL WING |
GULL WING |
BALL |
NO LEAD |
BALL |
端子节距 |
0.5 mm |
0.5 mm |
0.5 mm |
0.5 mm |
0.5 mm |
端子位置 |
QUAD |
QUAD |
BOTTOM |
QUAD |
BOTTOM |
处于峰值回流温度下的最长时间 |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
宽度 |
7 mm |
7 mm |
3 mm |
5 mm |
3 mm |
uPs/uCs/外围集成电路类型 |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
是否无铅 |
不含铅 |
- |
不含铅 |
- |
不含铅 |
Brand Name |
- |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Factory Lead Time |
- |
- |
1 week |
1 week |
1 week |