2 CHANNEL(S), 1Mbps, SERIAL COMM CONTROLLER, PQFP80, PLASTIC, QFP-80
参数名称 | 属性值 |
厂商名称 | Texas Instruments(德州仪器) |
零件包装代码 | QFP |
包装说明 | PLASTIC, QFP-80 |
针数 | 80 |
Reach Compliance Code | unknown |
其他特性 | ENHANCED BIDIRECTIONAL PRINTER PORT |
地址总线宽度 | 3 |
边界扫描 | NO |
总线兼容性 | PC-AT |
最大时钟频率 | 16 MHz |
通信协议 | ASYNC, BIT |
最大数据传输速率 | 0.125 MBps |
外部数据总线宽度 | 8 |
JESD-30 代码 | S-PQFP-G80 |
长度 | 12 mm |
低功率模式 | NO |
串行 I/O 数 | 2 |
端子数量 | 80 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | LFQFP |
封装形状 | SQUARE |
封装形式 | FLATPACK, LOW PROFILE, FINE PITCH |
认证状态 | Not Qualified |
座面最大高度 | 1.6 mm |
最大供电电压 | 5.25 V |
最小供电电压 | 4.75 V |
标称供电电压 | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | MILITARY |
端子形式 | GULL WING |
端子节距 | 0.5 mm |
端子位置 | QUAD |
宽度 | 12 mm |
uPs/uCs/外围集成电路类型 | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
TL16C552AMPN | TL16C552AIHV | TL16C552AIFK | TL16C552AFK | TL16C552AMFK | |
---|---|---|---|---|---|
描述 | 2 CHANNEL(S), 1Mbps, SERIAL COMM CONTROLLER, PQFP80, PLASTIC, QFP-80 | 2 CHANNEL(S), 1Mbps, SERIAL COMM CONTROLLER, CQFP68, CERAMIC, QFP-68 | 2 CHANNEL(S), 1Mbps, SERIAL COMM CONTROLLER, CQCC68, CERAMIC, LLCC-68 | 2 CHANNEL(S), 1Mbps, SERIAL COMM CONTROLLER, CQCC68, CERAMIC, LLCC-68 | 2 CHANNEL(S), 1Mbps, SERIAL COMM CONTROLLER, CQCC68, CERAMIC, LLCC-68 |
厂商名称 | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
零件包装代码 | QFP | QFP | LCC | LCC | LCC |
包装说明 | PLASTIC, QFP-80 | CERAMIC, QFP-68 | CERAMIC, LLCC-68 | CERAMIC, LLCC-68 | CERAMIC, LLCC-68 |
针数 | 80 | 68 | 68 | 68 | 68 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
其他特性 | ENHANCED BIDIRECTIONAL PRINTER PORT | ENHANCED BIDIRECTIONAL PRINTER PORT | ENHANCED BIDIRECTIONAL PRINTER PORT | ENHANCED BIDIRECTIONAL PRINTER PORT | ENHANCED BIDIRECTIONAL PRINTER PORT |
地址总线宽度 | 3 | 3 | 3 | 3 | 3 |
边界扫描 | NO | NO | NO | NO | NO |
最大时钟频率 | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz |
通信协议 | ASYNC, BIT | ASYNC, BIT | ASYNC, BIT | ASYNC, BIT | ASYNC, BIT |
最大数据传输速率 | 0.125 MBps | 0.125 MBps | 0.125 MBps | 0.125 MBps | 0.125 MBps |
外部数据总线宽度 | 8 | 8 | 8 | 8 | 8 |
JESD-30 代码 | S-PQFP-G80 | S-GQFP-F68 | S-CQCC-N68 | S-CQCC-N68 | S-CQCC-N68 |
长度 | 12 mm | 12.51 mm | 24.13 mm | 24.13 mm | 24.13 mm |
低功率模式 | NO | NO | NO | NO | NO |
串行 I/O 数 | 2 | 2 | 2 | 2 | 2 |
端子数量 | 80 | 68 | 68 | 68 | 68 |
最高工作温度 | 125 °C | 85 °C | 85 °C | 70 °C | 125 °C |
最低工作温度 | -55 °C | -40 °C | -40 °C | - | -55 °C |
封装主体材料 | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
封装代码 | LFQFP | QFF | QCCN | QCCN | QCCN |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.6 mm | 3.86 mm | 2.03 mm | 2.03 mm | 2.03 mm |
最大供电电压 | 5.25 V | 5.25 V | 5.25 V | 5.25 V | 5.25 V |
最小供电电压 | 4.75 V | 4.75 V | 4.75 V | 4.75 V | 4.75 V |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | MILITARY |
端子形式 | GULL WING | FLAT | NO LEAD | NO LEAD | NO LEAD |
端子节距 | 0.5 mm | 0.635 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD |
宽度 | 12 mm | 12.51 mm | 24.13 mm | 24.13 mm | 24.13 mm |
uPs/uCs/外围集成电路类型 | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL | SERIAL IO/COMMUNICATION CONTROLLER, SERIAL |
总线兼容性 | PC-AT | - | - | PC-AT | PC-AT |
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