8-BIT, UVPROM, 5MHz, MICROCONTROLLER, CDIP64, WINDOWED, SHRINK, CERAMIC, DIP-64
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | DIP |
| 包装说明 | WSDIP, SDIP64,.75 |
| 针数 | 64 |
| Reach Compliance Code | not_compliant |
| 具有ADC | YES |
| 地址总线宽度 | 16 |
| 位大小 | 8 |
| CPU系列 | TMS370 |
| 最大时钟频率 | 20 MHz |
| DAC 通道 | NO |
| DMA 通道 | NO |
| 外部数据总线宽度 | 8 |
| JESD-30 代码 | R-CDIP-T64 |
| 长度 | 60.96 mm |
| I/O 线路数量 | 53 |
| 端子数量 | 64 |
| 最高工作温度 | 105 °C |
| 最低工作温度 | -40 °C |
| PWM 通道 | YES |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | WSDIP |
| 封装等效代码 | SDIP64,.75 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE, WINDOW, SHRINK PITCH |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| RAM（字节） | 1024 |
| ROM（单词） | 32768 |
| ROM可编程性 | UVPROM |
| 座面最大高度 | 6.15 mm |
| 速度 | 5 MHz |
| 最大压摆率 | 56 mA |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 1.778 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 15.24 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER |
| SE370C758BJNT | SE370C758AJNT | SE370C756AJNT | SE370C756AFZT | SE370C758AFZT | SE370C758BFZT | SE370C759AFZT | TMS370C758BNMT | TMS370C356ANMT | TMS370C356AFNT | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | 8-BIT, UVPROM, 5MHz, MICROCONTROLLER, CDIP64, WINDOWED, SHRINK, CERAMIC, DIP-64 | 8-BIT, UVPROM, 5MHz, MICROCONTROLLER, CDIP64, WINDOWED, SHRINK, CERAMIC, DIP-64 | 8-BIT, UVPROM, 5MHz, MICROCONTROLLER, CDIP64, WINDOWED, SHRINK, CERAMIC, DIP-64 | 8-Bit Microcontroller 68-JLCC | 8-Bit Microcontroller 68-JLCC | 8-Bit Microcontroller 68-JLCC | 8-Bit Microcontroller 68-JLCC | 8-BIT, OTPROM, 5MHz, MICROCONTROLLER, PDIP64, SHRINK, PLASTIC, DIP-64 | 8-BIT, MROM, 5MHz, MICROCONTROLLER, PDIP64, SHRINK, PLASTIC, DIP-64 | 8-Bit Microcontroller 68-PLCC |
| Brand Name | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | DIP | DIP | DIP | QFJ | QFJ | QFJ | QFJ | DIP | DIP | LCC |
| 包装说明 | WSDIP, SDIP64,.75 | SDIP, SDIP64,.75 | WSDIP, SDIP64,.75 | WQCCJ, LDCC68,1.0SQ | QCCJ, LDCC68,1.0SQ | WQCCJ, LDCC68,1.0SQ | WQCCJ, LDCC68,1.0SQ | SDIP, SDIP64,.75 | SHRINK, PLASTIC, DIP-64 | PLASTIC, LCC-68 |
| 针数 | 64 | 64 | 64 | 68 | 68 | 68 | 68 | 64 | 64 | 68 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| 具有ADC | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 地址总线宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 位大小 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| CPU系列 | TMS370 | TMS370 | TMS370 | TMS370 | TMS370 | TMS370 | TMS370 | TMS370 | TMS370 | TMS370 |
| 最大时钟频率 | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 20 MHz | 12 MHz | 20 MHz | 20 MHz | 20 MHz |
| DAC 通道 | NO | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| DMA 通道 | NO | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| 外部数据总线宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| JESD-30 代码 | R-CDIP-T64 | R-CDIP-T64 | R-CDIP-T64 | S-CQCC-J68 | S-CQCC-J68 | S-CQCC-J68 | S-CQCC-J68 | R-PDIP-T64 | R-PDIP-T64 | S-PQCC-J68 |
| I/O 线路数量 | 53 | 53 | 53 | 55 | 55 | 55 | 55 | 53 | 53 | 55 |
| 端子数量 | 64 | 64 | 64 | 68 | 68 | 68 | 68 | 64 | 64 | 68 |
| 最高工作温度 | 105 °C | 105 °C | 105 °C | 105 °C | 105 °C | 105 °C | 105 °C | 105 °C | 105 °C | 105 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| PWM 通道 | YES | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | WSDIP | SDIP | WSDIP | WQCCJ | QCCJ | WQCCJ | WQCCJ | SDIP | SDIP | QCCJ |
| 封装等效代码 | SDIP64,.75 | SDIP64,.75 | SDIP64,.75 | LDCC68,1.0SQ | LDCC68,1.0SQ | LDCC68,1.0SQ | LDCC68,1.0SQ | SDIP64,.75 | SDIP64,.75 | LDCC68,1.0SQ |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | IN-LINE, WINDOW, SHRINK PITCH | IN-LINE, WINDOW, SHRINK PITCH | IN-LINE, WINDOW, SHRINK PITCH | CHIP CARRIER, WINDOW | CHIP CARRIER, WINDOW | CHIP CARRIER, WINDOW | CHIP CARRIER, WINDOW | IN-LINE, SHRINK PITCH | IN-LINE, SHRINK PITCH | CHIP CARRIER |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM（字节） | 1024 | 1024 | 512 | 512 | 1024 | 1024 | 3584 | 1024 | 512 | 512 |
| ROM（单词） | 32768 | 32768 | 16384 | 16384 | 32768 | 32768 | 49152 | 32768 | 16384 | 16384 |
| ROM可编程性 | UVPROM | UVPROM | UVPROM | UVPROM | UVPROM | UVPROM | UVPROM | OTPROM | MROM | MROM |
| 座面最大高度 | 6.15 mm | 6.15 mm | 6.15 mm | 4.57 mm | 4.57 mm | 4.57 mm | 4.57 mm | 5.64 mm | 5.64 mm | 4.57 mm |
| 速度 | 5 MHz | 5 MHz | 5 MHz | 5 MHz | 5 MHz | 5 MHz | 3 MHz | 5 MHz | 5 MHz | 5 MHz |
| 最大压摆率 | 56 mA | 56 mA | 56 mA | 56 mA | 56 mA | 56 mA | 55 mA | 56 mA | 56 mA | 56 mA |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | NO | YES | YES | YES | YES | NO | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND | J BEND | J BEND | J BEND | THROUGH-HOLE | THROUGH-HOLE | J BEND |
| 端子节距 | 1.778 mm | 1.778 mm | 1.778 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.778 mm | 1.778 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | QUAD | QUAD | QUAD | QUAD | DUAL | DUAL | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 15.24 mm | 15.24 mm | 15.24 mm | 23.94 mm | 23.94 mm | 23.94 mm | 23.94 mm | 15.24 mm | 15.24 mm | 24.23 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER |
| 长度 | 60.96 mm | 60.96 mm | 60.96 mm | 23.94 mm | 23.94 mm | 23.94 mm | 23.94 mm | - | - | 24.23 mm |
| Base Number Matches | - | 1 | 1 | 1 | 1 | 1 | 1 | - | - | - |
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