Datasheet> 器件分类 > 存储> 存储> SN74ACT2235-20FN

SN74ACT2235-20FN: 产品描述1KX9 BI-DIRECTIONAL FIFO, 25ns, PQCC44, PLASTIC, LCC-44; 产品类别存储存储; 文件大小969KB，共18页; 制造商Rochester Electronics; 官网地址https://www.rocelec.com/

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SN74ACT2235-20FN在线购买

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SN74ACT2235-20FN概述

1KX9 BI-DIRECTIONAL FIFO, 25ns, PQCC44, PLASTIC, LCC-44

SN74ACT2235-20FN规格参数

参数名称	属性值
是否无铅	含铅
厂商名称	Rochester Electronics
零件包装代码	LCC
包装说明	PLASTIC, LCC-44
针数	44
Reach Compliance Code	unknown
最长访问时间	25 ns
其他特性	BYPASS-XCVR
周期时间	20 ns
JESD-30 代码	S-PQCC-J44
JESD-609代码	e4
长度	16.585 mm
内存密度	9216 bit
内存宽度	9
湿度敏感等级	3
功能数量	1
端子数量	44
字数	1024 words
字数代码	1000
工作模式	ASYNCHRONOUS
最高工作温度	70 °C
最低工作温度
组织	1KX9
可输出	YES
封装主体材料	PLASTIC/EPOXY
封装代码	QCCJ
封装形状	SQUARE
封装形式	CHIP CARRIER
并行/串行	PARALLEL
峰值回流温度（摄氏度）	260
认证状态	COMMERCIAL
座面最大高度	4.57 mm
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	4.5 V
标称供电电压 (Vsup)	5 V
表面贴装	YES
技术	CMOS
温度等级	COMMERCIAL
端子面层	NICKEL PALLADIUM GOLD
端子形式	J BEND
端子节距	1.27 mm
端子位置	QUAD
处于峰值回流温度下的最长时间	NOT SPECIFIED
宽度	16.585 mm

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SN74ACT2235-20FN相似产品对比

	SN74ACT2235-20FN	SN74ACT2235-60PAG	SN74ACT2235-30PAG	SN74ACT2235-40PAG	SN74ACT2235-40FN	SN74ACT2235-20PAG	SN74ACT2235-30FN	SN74ACT2235-30FNR
描述	1KX9 BI-DIRECTIONAL FIFO, 25ns, PQCC44, PLASTIC, LCC-44	1KX9 BI-DIRECTIONAL FIFO, 45ns, PQFP64, GREEN, PLASTIC, TQFP-64	1KX9 BI-DIRECTIONAL FIFO, 25ns, PQFP64, GREEN, PLASTIC, TQFP-64	1KX9 BI-DIRECTIONAL FIFO, 35ns, PQFP64, GREEN, PLASTIC, TQFP-64	1KX9 BI-DIRECTIONAL FIFO, 35ns, PQCC44, PLASTIC, LCC-44	1KX9 BI-DIRECTIONAL FIFO, 25ns, PQFP64, GREEN, PLASTIC, TQFP-64	1KX9 BI-DIRECTIONAL FIFO, 25ns, PQCC44, PLASTIC, LCC-44	1KX9 BI-DIRECTIONAL FIFO, 25ns, PQCC44, ROHS COMPLIANT, PLASTIC, LCC-44
是否无铅	含铅	不含铅	不含铅	不含铅	不含铅	不含铅	不含铅	含铅
厂商名称	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics
零件包装代码	LCC	QFP	QFP	QFP	LCC	QFP	LCC	LCC
包装说明	PLASTIC, LCC-44	GREEN, PLASTIC, TQFP-64	GREEN, PLASTIC, TQFP-64	GREEN, PLASTIC, TQFP-64	PLASTIC, LCC-44	GREEN, PLASTIC, TQFP-64	PLASTIC, LCC-44	ROHS COMPLIANT, PLASTIC, LCC-44
针数	44	64	64	64	44	64	44	44
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
最长访问时间	25 ns	45 ns	25 ns	35 ns	35 ns	25 ns	25 ns	25 ns
其他特性	BYPASS-XCVR	BYPASS-XCVR	BYPASS-XCVR	BYPASS-XCVR	BYPASS-XCVR	BYPASS-XCVR	BYPASS-XCVR	BYPASS-XCVR
周期时间	20 ns	60 ns	30 ns	40 ns	40 ns	20 ns	30 ns	30 ns
JESD-30 代码	S-PQCC-J44	S-PQFP-G64	S-PQFP-G64	S-PQFP-G64	S-PQCC-J44	S-PQFP-G64	S-PQCC-J44	S-PQCC-J44
JESD-609代码	e4	e4	e4	e4	e4	e4	e0	e4
长度	16.585 mm	10 mm	10 mm	10 mm	16.585 mm	10 mm	16.585 mm	16.585 mm
内存密度	9216 bit	9216 bit	9216 bit	9216 bit	9216 bit	9216 bit	9216 bit	9216 bit
内存宽度	9	9	9	9	9	9	9	9
湿度敏感等级	3	3	3	3	3	3	NOT SPECIFIED	3
功能数量	1	1	1	1	1	1	1	1
端子数量	44	64	64	64	44	64	44	44
字数	1024 words	1024 words	1024 words	1024 words	1024 words	1024 words	1024 words	1024 words
字数代码	1000	1000	1000	1000	1000	1000	1000	1000
工作模式	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
组织	1KX9	1KX9	1KX9	1KX9	1KX9	1KX9	1KX9	1KX9
可输出	YES	YES	YES	YES	YES	YES	YES	YES
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	QCCJ	TFQFP	TFQFP	TFQFP	QCCJ	TFQFP	QCCJ	QCCJ
封装形状	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
封装形式	CHIP CARRIER	FLATPACK, THIN PROFILE, FINE PITCH	FLATPACK, THIN PROFILE, FINE PITCH	FLATPACK, THIN PROFILE, FINE PITCH	CHIP CARRIER	FLATPACK, THIN PROFILE, FINE PITCH	CHIP CARRIER	CHIP CARRIER
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
峰值回流温度（摄氏度）	260	260	260	260	260	260	NOT SPECIFIED	260
认证状态	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
座面最大高度	4.57 mm	1.2 mm	1.2 mm	1.2 mm	4.57 mm	1.2 mm	4.57 mm	4.57 mm
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
端子面层	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	NICKEL PALLADIUM GOLD	TIN LEAD	NICKEL PALLADIUM GOLD
端子形式	J BEND	GULL WING	GULL WING	GULL WING	J BEND	GULL WING	J BEND	J BEND
端子节距	1.27 mm	0.5 mm	0.5 mm	0.5 mm	1.27 mm	0.5 mm	1.27 mm	1.27 mm
端子位置	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
处于峰值回流温度下的最长时间	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
宽度	16.585 mm	10 mm	10 mm	10 mm	16.585 mm	10 mm	16.585 mm	16.585 mm

SN74ACT2235-20FN

SN74ACT2235-20FN在线购买

SN74ACT2235-20FN概述

SN74ACT2235-20FN规格参数

文档预览

SN74ACT2235-20FN相似产品对比

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