DDR DRAM, 512MX72, CMOS, HALOGEN FREE, MO-269, RDIMM-240
参数名称 | 属性值 |
厂商名称 | Micron Technology |
零件包装代码 | DIMM |
包装说明 | HALOGEN FREE, MO-269, RDIMM-240 |
针数 | 240 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
访问模式 | FOUR BANK PAGE BURST |
其他特性 | AUTO/SELF REFRESH |
JESD-30 代码 | R-XDMA-N240 |
JESD-609代码 | e4 |
内存密度 | 38654705664 bit |
内存集成电路类型 | DDR DRAM |
内存宽度 | 72 |
功能数量 | 1 |
端口数量 | 1 |
端子数量 | 240 |
字数 | 536870912 words |
字数代码 | 512000000 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 512MX72 |
封装主体材料 | UNSPECIFIED |
封装代码 | DIMM |
封装形状 | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY |
认证状态 | Not Qualified |
自我刷新 | YES |
最大供电电压 (Vsup) | 1.45 V |
最小供电电压 (Vsup) | 1.283 V |
标称供电电压 (Vsup) | 1.35 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | GOLD |
端子形式 | NO LEAD |
端子位置 | DUAL |
MT36KSZF51272PDZ-80CXX | MT36KSZF51272PDZ-1G4F1 | MT36KSZF51272PDZ-1G0XX | MT36KSZF51272PDZ-80BXX | MT36KSZF51272PDZ-1G1F1 | MT36KSZF51272PDZ-80CF1 | MT36KSZF51272PDZ-80BF1 | |
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描述 | DDR DRAM, 512MX72, CMOS, HALOGEN FREE, MO-269, RDIMM-240 | DDR DRAM, 512MX72, CMOS, HALOGEN FREE, MO-269, RDIMM-240 | DDR DRAM, 512MX72, CMOS, HALOGEN FREE, MO-269, RDIMM-240 | DDR DRAM, 512MX72, CMOS, HALOGEN FREE, MO-269, RDIMM-240 | DDR DRAM, 512MX72, CMOS, HALOGEN FREE, MO-269, RDIMM-240 | DDR DRAM, 512MX72, CMOS, HALOGEN FREE, MO-269, RDIMM-240 | DDR DRAM, 512MX72, CMOS, HALOGEN FREE, MO-269, RDIMM-240 |
零件包装代码 | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM |
包装说明 | HALOGEN FREE, MO-269, RDIMM-240 | DIMM, | HALOGEN FREE, MO-269, RDIMM-240 | HALOGEN FREE, MO-269, RDIMM-240 | DIMM, | HALOGEN FREE, MO-269, RDIMM-240 | HALOGEN FREE, MO-269, RDIMM-240 |
针数 | 240 | 240 | 240 | 240 | 240 | 240 | 240 |
Reach Compliance Code | compliant | unknown | compliant | compliant | unknown | unknow | unknow |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
访问模式 | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST |
其他特性 | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
JESD-30 代码 | R-XDMA-N240 | R-XDMA-N240 | R-XDMA-N240 | R-XDMA-N240 | R-XDMA-N240 | R-XDMA-N240 | R-XDMA-N240 |
JESD-609代码 | e4 | e4 | e4 | e4 | e4 | e4 | e4 |
内存密度 | 38654705664 bit | 38654705664 bit | 38654705664 bit | 38654705664 bit | 38654705664 bit | 38654705664 bi | 38654705664 bi |
内存集成电路类型 | DDR DRAM | DDR DRAM | DDR DRAM | DDR DRAM | DDR DRAM | DDR DRAM | DDR DRAM |
内存宽度 | 72 | 72 | 72 | 72 | 72 | 72 | 72 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 240 | 240 | 240 | 240 | 240 | 240 | 240 |
字数 | 536870912 words | 536870912 words | 536870912 words | 536870912 words | 536870912 words | 536870912 words | 536870912 words |
字数代码 | 512000000 | 512000000 | 512000000 | 512000000 | 512000000 | 512000000 | 512000000 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 512MX72 | 512MX72 | 512MX72 | 512MX72 | 512MX72 | 512MX72 | 512MX72 |
封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
封装代码 | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
自我刷新 | YES | YES | YES | YES | YES | YES | YES |
最大供电电压 (Vsup) | 1.45 V | 1.45 V | 1.45 V | 1.45 V | 1.45 V | 1.45 V | 1.45 V |
最小供电电压 (Vsup) | 1.283 V | 1.283 V | 1.283 V | 1.283 V | 1.283 V | 1.283 V | 1.283 V |
标称供电电压 (Vsup) | 1.35 V | 1.35 V | 1.35 V | 1.35 V | 1.35 V | 1.35 V | 1.35 V |
表面贴装 | NO | NO | NO | NO | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | GOLD | GOLD | GOLD | GOLD | GOLD | GOLD | GOLD |
端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
厂商名称 | Micron Technology | - | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
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