256KX8 STANDARD SRAM, 45ns, PDSO32, 8 X 13.40 MM, LEAD FREE, STSOP-32
| 参数名称 | 属性值 |
| 厂商名称 | Rochester Electronics |
| 零件包装代码 | TSOP |
| 包装说明 | 8 X 13.40 MM, LEAD FREE, STSOP-32 |
| 针数 | 32 |
| Reach Compliance Code | unknown |
| 最长访问时间 | 45 ns |
| JESD-30 代码 | R-PDSO-G32 |
| 长度 | 11.8 mm |
| 内存密度 | 2097152 bit |
| 内存集成电路类型 | STANDARD SRAM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 32 |
| 字数 | 262144 words |
| 字数代码 | 256000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 256KX8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSSOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 并行/串行 | PARALLEL |
| 认证状态 | COMMERCIAL |
| 座面最大高度 | 1.2 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 2.2 V |
| 标称供电电压 (Vsup) | 3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | NOT SPECIFIED |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 宽度 | 8 mm |
| CY62138FV30LL-45ZAXA | CY62138FV30LL-45ZAXI | CY62138FV30LL-45ZXI | CY62138FV30LL-45SXI | CY62138FV30LL-45BVXI | CY62138FV30LL-45ZSXI | |
|---|---|---|---|---|---|---|
| 描述 | 256KX8 STANDARD SRAM, 45ns, PDSO32, 8 X 13.40 MM, LEAD FREE, STSOP-32 | 256KX8 STANDARD SRAM, 45ns, PDSO32, 8 X 13.40 MM, LEAD FREE, STSOP-32 | 256KX8 STANDARD SRAM, 45ns, PDSO32, 8 X 20 MM, LEAD FREE, TSOP1-32 | 256KX8 STANDARD SRAM, 45ns, PDSO32, 0.450 INCH, LEAD FREE, SOIC-32 | 256KX8 STANDARD SRAM, 45ns, PBGA36, 6 X 8 MM, 1 MM HEIGHT, LEAD FREE, VFBGA-36 | 256KX8 STANDARD SRAM, 45ns, PDSO32, LEAD FREE, TSOP2-32 |
| 厂商名称 | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
| 零件包装代码 | TSOP | TSOP | TSOP1 | SOIC | BGA | TSOP2 |
| 包装说明 | 8 X 13.40 MM, LEAD FREE, STSOP-32 | 8 X 13.40 MM, LEAD FREE, STSOP-32 | 8 X 20 MM, LEAD FREE, TSOP1-32 | 0.450 INCH, LEAD FREE, SOIC-32 | 6 X 8 MM, 1 MM HEIGHT, LEAD FREE, VFBGA-36 | LEAD FREE, TSOP2-32 |
| 针数 | 32 | 32 | 32 | 32 | 36 | 32 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| 最长访问时间 | 45 ns | 45 ns | 45 ns | 45 ns | 45 ns | 45 ns |
| JESD-30 代码 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PBGA-B36 | R-PDSO-G32 |
| 长度 | 11.8 mm | 11.8 mm | 18.4 mm | 20.4465 mm | 8 mm | 20.95 mm |
| 内存密度 | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit |
| 内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 32 | 32 | 32 | 32 | 36 | 32 |
| 字数 | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
| 字数代码 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 | 256KX8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSSOP | TSSOP | TSOP1 | SOP | VFBGA | TSOP2 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, THIN PROFILE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 座面最大高度 | 1.2 mm | 1.2 mm | 1.2 mm | 2.997 mm | 1 mm | 1.2 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 2.2 V | 2.2 V | 2.2 V | 2.2 V | 2.2 V | 2.2 V |
| 标称供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | NOT SPECIFIED | NOT SPECIFIED | MATTE TIN | NICKEL PALLADIUM GOLD | NOT SPECIFIED | NICKEL PALLADIUM GOLD |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | BALL | GULL WING |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 1.27 mm | 0.75 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | BOTTOM | DUAL |
| 宽度 | 8 mm | 8 mm | 8 mm | 11.303 mm | 6 mm | 10.16 mm |
| 是否无铅 | - | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | - | 符合 | 符合 | 符合 | 符合 | 符合 |
| 湿度敏感等级 | - | NOT SPECIFIED | 3 | 3 | NOT SPECIFIED | 3 |
| 峰值回流温度（摄氏度） | - | 260 | 260 | 260 | 260 | 260 |
| 处于峰值回流温度下的最长时间 | - | 20 | 20 | 20 | 20 | 20 |
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