Datasheet> 器件分类 > 逻辑> 逻辑> 74LVC1G58GF

文档预览

74LVC1G58GF: 产品描述Low-power configurable multiple function gate; 产品类别逻辑逻辑; 文件大小81KB，共18页; 制造商NXP(恩智浦); 官网地址https://www.nxp.com; 标准

下载文档详细参数选型对比全文预览

74LVC1G58GF概述

Low-power configurable multiple function gate

74LVC1G58GF规格参数

参数名称	属性值
Source Url Status Check Date	2013-06-14 00:00:00
是否无铅	不含铅
是否Rohs认证	符合
厂商名称	NXP(恩智浦)
零件包装代码	SON
包装说明	1 X 1 MM, 0.50 MM HEIGHT, PLASTIC, SOT-891, SON-6
针数	6
Reach Compliance Code	compli
系列	LVC/LCX/Z
JESD-30 代码	S-PDSO-N6
JESD-609代码	e3
长度	1 mm
负载电容（CL）	50 pF
逻辑集成电路类型	LOGIC CIRCUIT
最大I（ol）	0.024 A
湿度敏感等级	1
功能数量	1
端子数量	6
最高工作温度	125 °C
最低工作温度	-40 °C
封装主体材料	PLASTIC/EPOXY
封装代码	VSON
封装等效代码	SOLCC6,.04,14
封装形状	SQUARE
封装形式	SMALL OUTLINE, VERY THIN PROFILE
包装方法	TAPE AND REEL
峰值回流温度（摄氏度）	260
电源	3.3 V
Prop。Delay @ Nom-Su	7.9 ns
认证状态	Not Qualified
施密特触发器	YES
座面最大高度	0.5 mm
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	1.65 V
标称供电电压 (Vsup)	1.8 V
表面贴装	YES
技术	CMOS
温度等级	AUTOMOTIVE
端子面层	Tin (Sn)
端子形式	NO LEAD
端子节距	0.35 mm
端子位置	DUAL
处于峰值回流温度下的最长时间	30
宽度	1 mm

文档预览

下载PDF文档

全文
预览

74LVC1G58

Low-power conﬁgurable multiple function gate

Rev. 04 — 27 April 2009

Product data sheet

1. General description

The 74LVC1G58 provides conﬁgurable multiple functions. The output state is determined

by eight patterns of 3-bit input. The user can choose the logic functions AND, OR, NAND,

NOR, XOR, inverter and buffer. All inputs can be connected to V

or GND.

The three inputs (A, B and C) are capable of transforming slowly changing input signals

into sharply deﬁned, jitter-free output signals.

The gate switches at different points for positive and negative-going signals. The

difference between the positive voltage V

T+

and the negative voltage V

T−

is deﬁned as the

hysteresis voltage V

Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of this

device in a mixed 3.3 V and 5 V environment.

This device is fully speciﬁed for partial power-down applications using I

OFF

. The I

OFF

circuitry disables the output, preventing the damaging backﬂow current through the device

when it is powered down.

2. Features

Wide supply voltage range from 1.65 V to 5.5 V

5 V tolerant input/output for interfacing with 5 V logic

High noise immunity

Complies with JEDEC standard:

JESD8-7 (1.65 V to 1.95 V)

JESD8-5 (2.3 V to 2.7 V)

JESD8B/JESD36 (2.7 V to 3.6 V).

ESD protection:

HBM JESD22-A114E exceeds 2000 V

MM JESD22-A115-A exceeds 200 V.

±24

mA output drive (V

= 3.0 V)

CMOS low power consumption

Latch-up performance exceeds 250 mA

Direct interface with TTL levels

Multiple package options

Speciﬁed from

−40 °C

to +85

°C

and

−40 °C

to +125

°C.

74LVC1G58GF相似产品对比

	74LVC1G58GF	74LVC1G58	74LVC1G58GV	74LVC1G58GM	74LVC1G58GW	74LVC1G58_09
描述	Low-power configurable multiple function gate	Low-power configurable multiple function gate	Low-power configurable multiple function gate	Low-power configurable multiple function gate	Low-power configurable multiple function gate	Low-power configurable multiple function gate
是否Rohs认证	符合	-	符合	符合	符合	-
厂商名称	NXP(恩智浦)	-	NXP(恩智浦)	NXP(恩智浦)	NXP(恩智浦)	-
零件包装代码	SON	-	TSOP	SON	SOT-363	-
包装说明	1 X 1 MM, 0.50 MM HEIGHT, PLASTIC, SOT-891, SON-6	-	PLASTIC, SC-74, SOT-457, TSOP-6	1 X 1.45 MM, 0.50 MM HEIGHT, PLASTIC, MO-252, SOT-886, SON-6	PLASTIC, SOT-363, SC-88, 6 PIN	-
针数	6	-	6	6	6	-
Reach Compliance Code	compli	-	compli	compli	compli	-
系列	LVC/LCX/Z	-	LVC/LCX/Z	LVC/LCX/Z	LVC/LCX/Z	-
JESD-30 代码	S-PDSO-N6	-	R-PDSO-G6	R-PDSO-N6	R-PDSO-G6	-
JESD-609代码	e3	-	e3	e3	e3	-
长度	1 mm	-	2.9 mm	1.45 mm	2 mm	-
负载电容（CL）	50 pF	-	50 pF	50 pF	50 pF	-
逻辑集成电路类型	LOGIC CIRCUIT	-	LOGIC CIRCUIT	LOGIC CIRCUIT	LOGIC CIRCUIT	-
最大I（ol）	0.024 A	-	0.024 A	0.024 A	0.024 A	-
湿度敏感等级	1	-	1	1	1	-
功能数量	1	-	1	1	1	-
端子数量	6	-	6	6	6	-
最高工作温度	125 °C	-	125 °C	125 °C	125 °C	-
最低工作温度	-40 °C	-	-40 °C	-40 °C	-40 °C	-
封装主体材料	PLASTIC/EPOXY	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-
封装代码	VSON	-	TSSOP	VSON	TSSOP	-
封装等效代码	SOLCC6,.04,14	-	TSOP6,.11,37	SOLCC6,.04,20	TSSOP6,.08	-
封装形状	SQUARE	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	-
封装形式	SMALL OUTLINE, VERY THIN PROFILE	-	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, VERY THIN PROFILE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	-
包装方法	TAPE AND REEL	-	TAPE AND REEL	TAPE AND REEL	TAPE AND REEL	-
峰值回流温度（摄氏度）	260	-	260	260	260	-
电源	3.3 V	-	3.3 V	3.3 V	3.3 V	-
Prop。Delay @ Nom-Su	7.9 ns	-	7.9 ns	7.9 ns	7.9 ns	-
认证状态	Not Qualified	-	Not Qualified	Not Qualified	Not Qualified	-
施密特触发器	YES	-	YES	YES	YES	-
座面最大高度	0.5 mm	-	1.1 mm	0.5 mm	1.1 mm	-
最大供电电压 (Vsup)	5.5 V	-	5.5 V	5.5 V	5.5 V	-
最小供电电压 (Vsup)	1.65 V	-	1.65 V	1.65 V	1.65 V	-
标称供电电压 (Vsup)	1.8 V	-	1.8 V	1.8 V	1.8 V	-
表面贴装	YES	-	YES	YES	YES	-
技术	CMOS	-	CMOS	CMOS	CMOS	-
温度等级	AUTOMOTIVE	-	AUTOMOTIVE	AUTOMOTIVE	AUTOMOTIVE	-
端子面层	Tin (Sn)	-	Tin (Sn)	Tin (Sn)	Tin (Sn)	-
端子形式	NO LEAD	-	GULL WING	NO LEAD	GULL WING	-
端子节距	0.35 mm	-	0.95 mm	0.5 mm	0.65 mm	-
端子位置	DUAL	-	DUAL	DUAL	DUAL	-
处于峰值回流温度下的最长时间	30	-	30	30	30	-
宽度	1 mm	-	1.5 mm	1 mm	1.25 mm	-

74LVC1G58GF

74LVC1G58GF概述

74LVC1G58GF规格参数

文档预览

74LVC1G58GF相似产品对比

推荐资源