HC/UH SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, PDIP24
HC/UH系列, 其他解码器/驱动器, 反向输出, PDIP24
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | NXP(恩智浦) |
| 零件包装代码 | DIP |
| 包装说明 | 0.600 INCH, PLASTIC, MO-015, SOT101-1, SC-509-24, DIP-24 |
| 针数 | 24 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 其他特性 | 2 ENABLE INPUTS |
| 系列 | HC/UH |
| 输入调节 | STANDARD |
| JESD-30 代码 | R-PDIP-T24 |
| JESD-609代码 | e3 |
| 长度 | 31.7 mm |
| 负载电容(CL) | 50 pF |
| 逻辑集成电路类型 | OTHER DECODER/DRIVER |
| 最大I(ol) | 0.004 A |
| 功能数量 | 1 |
| 端子数量 | 24 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 输出极性 | INVERTED |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP24,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度(摄氏度) | NOT SPECIFIED |
| 电源 | 2/6 V |
| Prop。Delay @ Nom-Sup | 45 ns |
| 传播延迟(tpd) | 225 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.1 mm |
| 最大供电电压 (Vsup) | 6 V |
| 最小供电电压 (Vsup) | 2 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | Tin (Sn) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 15.24 mm |
| Base Number Matches | 1 |

| 74HC154N | 74HC154BQ | 74HC154 | 74HCT154BQ | 74HCT154PW | 74HCT154N | 74HCT154 | |
|---|---|---|---|---|---|---|---|
| 描述 | HC/UH SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, PDIP24 | 4-to-16 line decoder/demultiplexer | 4-to-16 line decoder/demultiplexer | 4-to-16 line decoder/demultiplexer | 4-to-16 line decoder/demultiplexer | 4-to-16 line decoder/demultiplexer | 4-to-16 line decoder/demultiplexer |
| 是否无铅 | 不含铅 | 不含铅 | - | 不含铅 | 不含铅 | 不含铅 | - |
| 是否Rohs认证 | 符合 | 符合 | - | 符合 | 符合 | 符合 | - |
| 厂商名称 | NXP(恩智浦) | - | - | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | - |
| 零件包装代码 | DIP | QFN | - | QFN | TSSOP | DIP | - |
| 包装说明 | 0.600 INCH, PLASTIC, MO-015, SOT101-1, SC-509-24, DIP-24 | 3.50 X 5.50 MM, 0.85 MM HEIGHT, PLASTIC, SOT-815-1, DHVQFN-24 | - | HVQCCN, LCC24/28,.14X.2,20 | TSSOP, TSSOP24,.25 | DIP, DIP24,.3 | - |
| 针数 | 24 | 24 | - | 24 | 24 | 24 | - |
| Reach Compliance Code | unknown | compli | - | compli | compli | unknow | - |
| ECCN代码 | EAR99 | EAR99 | - | EAR99 | EAR99 | EAR99 | - |
| 系列 | HC/UH | HC/UH | - | HCT | HCT | HCT | - |
| 输入调节 | STANDARD | STANDARD | - | STANDARD | STANDARD | STANDARD | - |
| JESD-30 代码 | R-PDIP-T24 | R-PQCC-N24 | - | R-PQCC-N24 | R-PDSO-G24 | R-PDIP-T24 | - |
| JESD-609代码 | e3 | e4 | - | e4 | e4 | e3 | - |
| 长度 | 31.7 mm | 5.5 mm | - | 5.5 mm | 7.8 mm | 31.7 mm | - |
| 负载电容(CL) | 50 pF | 50 pF | - | 50 pF | 50 pF | 50 pF | - |
| 逻辑集成电路类型 | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | - | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | OTHER DECODER/DRIVER | - |
| 最大I(ol) | 0.004 A | 0.004 A | - | 0.004 A | 0.004 A | 0.004 A | - |
| 功能数量 | 1 | 1 | - | 1 | 1 | 1 | - |
| 端子数量 | 24 | 24 | - | 24 | 24 | 24 | - |
| 最高工作温度 | 125 °C | 125 °C | - | 125 °C | 125 °C | 125 °C | - |
| 最低工作温度 | -40 °C | -40 °C | - | -40 °C | -40 °C | -40 °C | - |
| 输出极性 | INVERTED | INVERTED | - | INVERTED | INVERTED | INVERTED | - |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | DIP | HVQCCN | - | HVQCCN | TSSOP | DIP | - |
| 封装等效代码 | DIP24,.3 | LCC24/28,.14X.2,20 | - | LCC24/28,.14X.2,20 | TSSOP24,.25 | DIP24,.3 | - |
| 封装形状 | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | IN-LINE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | - | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | IN-LINE | - |
| 峰值回流温度(摄氏度) | NOT SPECIFIED | 260 | - | 260 | 260 | NOT SPECIFIED | - |
| 电源 | 2/6 V | 2/6 V | - | 5 V | 5 V | 5 V | - |
| 传播延迟(tpd) | 225 ns | 225 ns | - | 53 ns | 53 ns | 53 ns | - |
| 认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | - |
| 座面最大高度 | 5.1 mm | 1 mm | - | 1 mm | 1.1 mm | 5.1 mm | - |
| 最大供电电压 (Vsup) | 6 V | 6 V | - | 5.5 V | 5.5 V | 5.5 V | - |
| 最小供电电压 (Vsup) | 2 V | 2 V | - | 4.5 V | 4.5 V | 4.5 V | - |
| 标称供电电压 (Vsup) | 5 V | 5 V | - | 5 V | 5 V | 5 V | - |
| 表面贴装 | NO | YES | - | YES | YES | NO | - |
| 技术 | CMOS | CMOS | - | CMOS | CMOS | CMOS | - |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | - | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | - |
| 端子面层 | Tin (Sn) | NICKEL PALLADIUM GOLD | - | NICKEL PALLADIUM GOLD | NICKEL PALLADIUM GOLD | Tin (Sn) | - |
| 端子形式 | THROUGH-HOLE | NO LEAD | - | NO LEAD | GULL WING | THROUGH-HOLE | - |
| 端子节距 | 2.54 mm | 0.5 mm | - | 0.5 mm | 0.65 mm | 2.54 mm | - |
| 端子位置 | DUAL | QUAD | - | QUAD | DUAL | DUAL | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | 30 | - | 30 | 30 | NOT SPECIFIED | - |
| 宽度 | 15.24 mm | 3.5 mm | - | 3.5 mm | 4.4 mm | 15.24 mm | - |
| Base Number Matches | 1 | 1 | - | 1 | 1 | 1 | - |
| Prop。Delay @ Nom-Su | - | 45 ns | - | 53 ns | 53 ns | 53 ns | - |
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