DTMF Signaling Circuit, CDIP18, CERDIP-18
| 参数名称 | 属性值 |
| 厂商名称 | California Micro Devices |
| 零件包装代码 | DIP |
| 包装说明 | DIP, |
| 针数 | 18 |
| Reach Compliance Code | unknown |
| JESD-30 代码 | R-CDIP-T18 |
| 功能数量 | 1 |
| 端子数量 | 18 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 认证状态 | Not Qualified |
| 最大压摆率 | 5 mA |
| 标称供电电压 | 3 V |
| 表面贴装 | NO |
| 电信集成电路类型 | DTMF SIGNALING CIRCUIT |
| 温度等级 | COMMERCIAL |
| 端子形式 | THROUGH-HOLE |
| 端子位置 | DUAL |
| CM88L70D | CM88L70FI | CM88L70EI | CM88L70F | CM88L70TS | CM88L70TSI | CM88L70DI | CM88L70E | |
|---|---|---|---|---|---|---|---|---|
| 描述 | DTMF Signaling Circuit, CDIP18, CERDIP-18 | DTMF Signaling Circuit, PDIP18, EIAJ, PLASTIC, DIP-18 | DTMF Signaling Circuit, CMOS, PQCC20, PLASTIC, LCC-20 | DTMF Signaling Circuit, PDIP18, EIAJ, PLASTIC, DIP-18 | DTMF Signaling Circuit, CMOS, PDSO20, TSSOP-20 | DTMF Signaling Circuit, CMOS, PDSO20, TSSOP-20 | DTMF Signaling Circuit, CDIP18, CERDIP-18 | DTMF Signaling Circuit, PQCC20, PLASTIC, LCC-20 |
| 厂商名称 | California Micro Devices | California Micro Devices | California Micro Devices | California Micro Devices | California Micro Devices | California Micro Devices | California Micro Devices | California Micro Devices |
| 零件包装代码 | DIP | DIP | QLCC | DIP | TSSOP | TSSOP | DIP | QLCC |
| 包装说明 | DIP, | DIP, | QCCJ, LDCC20,.4SQ | DIP, | TSSOP, TSSOP20,.25 | TSSOP, TSSOP20,.25 | DIP, | QCCJ, |
| 针数 | 18 | 18 | 20 | 18 | 20 | 20 | 18 | 20 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-30 代码 | R-CDIP-T18 | R-PDIP-T18 | S-PQCC-J20 | R-PDIP-T18 | R-PDSO-G20 | R-PDSO-G20 | R-CDIP-T18 | S-PQCC-J20 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 18 | 18 | 20 | 18 | 20 | 20 | 18 | 20 |
| 最高工作温度 | 70 °C | 85 °C | 85 °C | 70 °C | 70 °C | 85 °C | 85 °C | 70 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | QCCJ | DIP | TSSOP | TSSOP | DIP | QCCJ |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | IN-LINE | IN-LINE | CHIP CARRIER | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | IN-LINE | CHIP CARRIER |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大压摆率 | 5 mA | 5 mA | 5 mA | 5 mA | 5 mA | 5 mA | 5 mA | 5 mA |
| 标称供电电压 | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V | 3 V |
| 表面贴装 | NO | NO | YES | NO | YES | YES | NO | YES |
| 电信集成电路类型 | DTMF SIGNALING CIRCUIT | DTMF SIGNALING CIRCUIT | DTMF SIGNALING CIRCUIT | DTMF SIGNALING CIRCUIT | DTMF SIGNALING CIRCUIT | DTMF SIGNALING CIRCUIT | DTMF SIGNALING CIRCUIT | DTMF SIGNALING CIRCUIT |
| 温度等级 | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | J BEND | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | J BEND |
| 端子位置 | DUAL | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL | QUAD |
| 长度 | - | 21.97 mm | 8.9662 mm | 21.97 mm | 6.5 mm | 6.5 mm | - | 8.9662 mm |
| 座面最大高度 | - | 4.57 mm | 4.57 mm | 4.57 mm | 1.2 mm | 1.2 mm | - | 4.57 mm |
| 端子节距 | - | 2.54 mm | 1.27 mm | 2.54 mm | 0.65 mm | 0.65 mm | - | 1.27 mm |
| 宽度 | - | 7.62 mm | 8.9662 mm | 7.62 mm | 4.4 mm | 4.4 mm | - | 8.9662 mm |
| Base Number Matches | - | 1 | 1 | 1 | 1 | 1 | - | - |
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