CM88L70TS概述

DTMF Signaling Circuit, CMOS, PDSO20, TSSOP-20

CM88L70TS规格参数

参数名称	属性值
厂商名称	California Micro Devices
零件包装代码	TSSOP
包装说明	TSSOP, TSSOP20,.25
针数	20
Reach Compliance Code	unknown
Is Samacsys	N
JESD-30 代码	R-PDSO-G20
长度	6.5 mm
功能数量	1
端子数量	20
最高工作温度	70 °C
最低工作温度
封装主体材料	PLASTIC/EPOXY
封装代码	TSSOP
封装等效代码	TSSOP20,.25
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
电源	3 V
认证状态	Not Qualified
座面最大高度	1.2 mm
最大压摆率	5 mA
标称供电电压	3 V
表面贴装	YES
技术	CMOS
电信集成电路类型	DTMF SIGNALING CIRCUIT
温度等级	COMMERCIAL
端子形式	GULL WING
端子节距	0.65 mm
端子位置	DUAL
宽度	4.4 mm
Base Number Matches	1

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CM88L70TS相似产品对比

	CM88L70TS	CM88L70FI	CM88L70EI	CM88L70F	CM88L70TSI	CM88L70D	CM88L70DI	CM88L70E
描述	DTMF Signaling Circuit, CMOS, PDSO20, TSSOP-20	DTMF Signaling Circuit, PDIP18, EIAJ, PLASTIC, DIP-18	DTMF Signaling Circuit, CMOS, PQCC20, PLASTIC, LCC-20	DTMF Signaling Circuit, PDIP18, EIAJ, PLASTIC, DIP-18	DTMF Signaling Circuit, CMOS, PDSO20, TSSOP-20	DTMF Signaling Circuit, CDIP18, CERDIP-18	DTMF Signaling Circuit, CDIP18, CERDIP-18	DTMF Signaling Circuit, PQCC20, PLASTIC, LCC-20
厂商名称	California Micro Devices	California Micro Devices	California Micro Devices	California Micro Devices	California Micro Devices	California Micro Devices	California Micro Devices	California Micro Devices
零件包装代码	TSSOP	DIP	QLCC	DIP	TSSOP	DIP	DIP	QLCC
包装说明	TSSOP, TSSOP20,.25	DIP,	QCCJ, LDCC20,.4SQ	DIP,	TSSOP, TSSOP20,.25	DIP,	DIP,	QCCJ,
针数	20	18	20	18	20	18	18	20
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
JESD-30 代码	R-PDSO-G20	R-PDIP-T18	S-PQCC-J20	R-PDIP-T18	R-PDSO-G20	R-CDIP-T18	R-CDIP-T18	S-PQCC-J20
功能数量	1	1	1	1	1	1	1	1
端子数量	20	18	20	18	20	18	18	20
最高工作温度	70 °C	85 °C	85 °C	70 °C	85 °C	70 °C	85 °C	70 °C
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	PLASTIC/EPOXY
封装代码	TSSOP	DIP	QCCJ	DIP	TSSOP	DIP	DIP	QCCJ
封装形状	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	SQUARE
封装形式	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	IN-LINE	CHIP CARRIER	IN-LINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	IN-LINE	IN-LINE	CHIP CARRIER
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
最大压摆率	5 mA	5 mA	5 mA	5 mA	5 mA	5 mA	5 mA	5 mA
标称供电电压	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
表面贴装	YES	NO	YES	NO	YES	NO	NO	YES
电信集成电路类型	DTMF SIGNALING CIRCUIT	DTMF SIGNALING CIRCUIT	DTMF SIGNALING CIRCUIT	DTMF SIGNALING CIRCUIT	DTMF SIGNALING CIRCUIT	DTMF SIGNALING CIRCUIT	DTMF SIGNALING CIRCUIT	DTMF SIGNALING CIRCUIT
温度等级	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL
端子形式	GULL WING	THROUGH-HOLE	J BEND	THROUGH-HOLE	GULL WING	THROUGH-HOLE	THROUGH-HOLE	J BEND
端子位置	DUAL	DUAL	QUAD	DUAL	DUAL	DUAL	DUAL	QUAD
长度	6.5 mm	21.97 mm	8.9662 mm	21.97 mm	6.5 mm	-	-	8.9662 mm
座面最大高度	1.2 mm	4.57 mm	4.57 mm	4.57 mm	1.2 mm	-	-	4.57 mm
端子节距	0.65 mm	2.54 mm	1.27 mm	2.54 mm	0.65 mm	-	-	1.27 mm
宽度	4.4 mm	7.62 mm	8.9662 mm	7.62 mm	4.4 mm	-	-	8.9662 mm
Base Number Matches	1	1	1	1	1	-	-	-

CM88L70TS

CM88L70TS概述

CM88L70TS规格参数

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CM88L70TS相似产品对比

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