Dual-Port SRAM, 512KX18, 15ns, CMOS, PQFP144, 20 X 20 MM, 1.40 MM HEIGHT, TQFP-144
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | QFP |
| 包装说明 | 20 X 20 MM, 1.40 MM HEIGHT, TQFP-144 |
| 针数 | 144 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | 3A991.B.2.A |
| 最长访问时间 | 15 ns |
| 其他特性 | FLOW-THROUGH OR PIPELINED ARCHITECTURE |
| 最大时钟频率 (fCLK) | 133 MHz |
| I/O 类型 | COMMON |
| JESD-30 代码 | S-PQFP-G144 |
| JESD-609代码 | e0 |
| 长度 | 20 mm |
| 内存密度 | 9437184 bit |
| 内存集成电路类型 | DUAL-PORT SRAM |
| 内存宽度 | 18 |
| 湿度敏感等级 | 4 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 144 |
| 字数 | 524288 words |
| 字数代码 | 512000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 512KX18 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LFQFP |
| 封装等效代码 | QFP144,.87SQ,20 |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK, LOW PROFILE, FINE PITCH |
| 并行/串行 | PARALLEL |
| 峰值回流温度(摄氏度) | 225 |
| 电源 | 2.5,2.5/3.3 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.6 mm |
| 最大待机电流 | 0.015 A |
| 最小待机电流 | 2.4 V |
| 最大压摆率 | 0.37 mA |
| 最大供电电压 (Vsup) | 2.6 V |
| 最小供电电压 (Vsup) | 2.4 V |
| 标称供电电压 (Vsup) | 2.5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 20 mm |

| IDT70T3339S133DD | IDT70T3399S166DDI | IDT70T3319S166DDI | IDT70T3339S133BFI | IDT70T3339S166BCI | IDT70T3399S166BCI | IDT70T3339S133DDI | IDT70T3319S166BCI | IDT70T3339S166DD | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Dual-Port SRAM, 512KX18, 15ns, CMOS, PQFP144, 20 X 20 MM, 1.40 MM HEIGHT, TQFP-144 | Dual-Port SRAM, 128KX18, 12ns, CMOS, PQFP144, 20 X 20 MM, 1.40 MM HEIGHT, TQFP-144 | Dual-Port SRAM, 256KX18, 12ns, CMOS, PQFP144, 20 X 20 MM, 1.40 MM HEIGHT, TQFP-144 | Dual-Port SRAM, 512KX18, 15ns, CMOS, PBGA208, 15 X 15 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, FPBGA-208 | Dual-Port SRAM, 512KX18, 12ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 | Dual-Port SRAM, 128KX18, 12ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 | Dual-Port SRAM, 512KX18, 15ns, CMOS, PQFP144, 20 X 20 MM, 1.40 MM HEIGHT, TQFP-144 | Dual-Port SRAM, 256KX18, 12ns, CMOS, PBGA256, 17 X 17 MM, 1.40 MM HEIGHT, 1 MM PITCH, BGA-256 | Dual-Port SRAM, 512KX18, 12ns, CMOS, PQFP144, 20 X 20 MM, 1.40 MM HEIGHT, TQFP-144 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | QFP | QFP | QFP | BGA | BGA | BGA | QFP | BGA | QFP |
| 包装说明 | 20 X 20 MM, 1.40 MM HEIGHT, TQFP-144 | 20 X 20 MM, 1.40 MM HEIGHT, TQFP-144 | 20 X 20 MM, 1.40 MM HEIGHT, TQFP-144 | TFBGA, BGA208,17X17,32 | LBGA, BGA256,16X16,40 | LBGA, BGA256,16X16,40 | 20 X 20 MM, 1.40 MM HEIGHT, TQFP-144 | LBGA, BGA256,16X16,40 | 20 X 20 MM, 1.40 MM HEIGHT, TQFP-144 |
| 针数 | 144 | 144 | 144 | 208 | 256 | 256 | 144 | 256 | 144 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| ECCN代码 | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
| 最长访问时间 | 15 ns | 12 ns | 12 ns | 15 ns | 12 ns | 12 ns | 15 ns | 12 ns | 12 ns |
| 其他特性 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | FLOW-THROUGH OR PIPELINED ARCHITECTURE | FLOW-THROUGH OR PIPELINED ARCHITECTURE | FLOW-THROUGH OR PIPELINED ARCHITECTURE | FLOW-THROUGH OR PIPELINED ARCHITECTURE | FLOW-THROUGH OR PIPELINED ARCHITECTURE | FLOW-THROUGH OR PIPELINED ARCHITECTURE | FLOW-THROUGH OR PIPELINED ARCHITECTURE | FLOW-THROUGH OR PIPELINED ARCHITECTURE |
| 最大时钟频率 (fCLK) | 133 MHz | 166 MHz | 166 MHz | 133 MHz | 166 MHz | 166 MHz | 133 MHz | 166 MHz | 166 MHz |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | S-PQFP-G144 | S-PQFP-G144 | S-PQFP-G144 | S-PBGA-B208 | S-PBGA-B256 | S-PBGA-B256 | S-PQFP-G144 | S-PBGA-B256 | S-PQFP-G144 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 20 mm | 20 mm | 20 mm | 15 mm | 17 mm | 17 mm | 20 mm | 17 mm | 20 mm |
| 内存密度 | 9437184 bit | 2359296 bit | 4718592 bit | 9437184 bit | 9437184 bit | 2359296 bit | 9437184 bit | 4718592 bit | 9437184 bit |
| 内存集成电路类型 | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM |
| 内存宽度 | 18 | 18 | 18 | 18 | 18 | 18 | 18 | 18 | 18 |
| 湿度敏感等级 | 4 | 4 | 4 | 3 | 3 | 3 | 4 | 3 | 4 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 144 | 144 | 144 | 208 | 256 | 256 | 144 | 256 | 144 |
| 字数 | 524288 words | 131072 words | 262144 words | 524288 words | 524288 words | 131072 words | 524288 words | 262144 words | 524288 words |
| 字数代码 | 512000 | 128000 | 256000 | 512000 | 512000 | 128000 | 512000 | 256000 | 512000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 70 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 70 °C |
| 最低工作温度 | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | - |
| 组织 | 512KX18 | 128KX18 | 256KX18 | 512KX18 | 512KX18 | 128KX18 | 512KX18 | 256KX18 | 512KX18 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LFQFP | LFQFP | LFQFP | TFBGA | LBGA | LBGA | LFQFP | LBGA | LFQFP |
| 封装等效代码 | QFP144,.87SQ,20 | QFP144,.87SQ,20 | QFP144,.87SQ,20 | BGA208,17X17,32 | BGA256,16X16,40 | BGA256,16X16,40 | QFP144,.87SQ,20 | BGA256,16X16,40 | QFP144,.87SQ,20 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | FLATPACK, LOW PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE | GRID ARRAY, LOW PROFILE | FLATPACK, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE | FLATPACK, LOW PROFILE, FINE PITCH |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度(摄氏度) | 225 | 225 | 225 | 225 | 225 | 225 | 225 | 225 | 225 |
| 电源 | 2.5,2.5/3.3 V | 2.5,2.5/3.3 V | 2.5,2.5/3.3 V | 2.5,2.5/3.3 V | 2.5,2.5/3.3 V | 2.5,2.5/3.3 V | 2.5,2.5/3.3 V | 2.5,2.5/3.3 V | 2.5,2.5/3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.6 mm | 1.6 mm | 1.6 mm | 1.2 mm | 1.5 mm | 1.5 mm | 1.6 mm | 1.5 mm | 1.6 mm |
| 最大待机电流 | 0.015 A | 0.02 A | 0.02 A | 0.02 A | 0.02 A | 0.02 A | 0.02 A | 0.02 A | 0.015 A |
| 最小待机电流 | 2.4 V | 2.4 V | 2.4 V | 2.4 V | 2.4 V | 2.4 V | 2.4 V | 2.4 V | 2.4 V |
| 最大压摆率 | 0.37 mA | 0.51 mA | 0.51 mA | 0.45 mA | 0.51 mA | 0.51 mA | 0.45 mA | 0.51 mA | 0.45 mA |
| 最大供电电压 (Vsup) | 2.6 V | 2.6 V | 2.6 V | 2.6 V | 2.6 V | 2.6 V | 2.6 V | 2.6 V | 2.6 V |
| 最小供电电压 (Vsup) | 2.4 V | 2.4 V | 2.4 V | 2.4 V | 2.4 V | 2.4 V | 2.4 V | 2.4 V | 2.4 V |
| 标称供电电压 (Vsup) | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn85Pb15) |
| 端子形式 | GULL WING | GULL WING | GULL WING | BALL | BALL | BALL | GULL WING | BALL | GULL WING |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.8 mm | 1 mm | 1 mm | 0.5 mm | 1 mm | 0.5 mm |
| 端子位置 | QUAD | QUAD | QUAD | BOTTOM | BOTTOM | BOTTOM | QUAD | BOTTOM | QUAD |
| 处于峰值回流温度下的最长时间 | 30 | 20 | 20 | 20 | 20 | 20 | 30 | 20 | 30 |
| 宽度 | 20 mm | 20 mm | 20 mm | 15 mm | 17 mm | 17 mm | 20 mm | 17 mm | 20 mm |
| 厂商名称 | IDT (Integrated Device Technology) | - | - | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| 是否无铅 | - | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | - | 含铅 | - |
| Base Number Matches | - | 1 | 1 | 1 | 1 | 1 | - | - | - |
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