IC 8-CH 8-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, CDIP20, 0.300 INCH, CERAMIC, DIP-20, Analog to Digital Converter
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | National Semiconductor（TI ） |
| 包装说明 | DIP, DIP20,.3 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| ADC0838CCJ | ADC0831BCJ | ADC0838BCJ | ADC0834CCJ | |
|---|---|---|---|---|
| 描述 | IC 8-CH 8-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, CDIP20, 0.300 INCH, CERAMIC, DIP-20, Analog to Digital Converter | IC 1-CH 8-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, CDIP8, 0.300 INCH, CERAMIC, DIP-8, Analog to Digital Converter | IC 8-CH 8-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, CDIP20, 0.300 INCH, CERAMIC, DIP-20, Analog to Digital Converter | IC 4-CH 8-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, CDIP14, 0.300 INCH, CERAMIC, DIP-14, Analog to Digital Converter |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | DIP, DIP20,.3 | 0.300 INCH, CERAMIC, DIP-8 | 0.300 INCH, CERAMIC, DIP-20 | DIP, DIP14,.3 |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
| 厂商名称 | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | - |
| 最大模拟输入电压 | - | 5 V | 5 V | 5 V |
| 最长转换时间 | - | 32 µs | 32 µs | 32 µs |
| 转换器类型 | - | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION |
| JESD-30 代码 | - | R-GDIP-T8 | R-GDIP-T20 | R-GDIP-T14 |
| JESD-609代码 | - | e0 | e0 | e0 |
| 最大线性误差 (EL) | - | 0.2% | 0.2% | 0.4% |
| 模拟输入通道数量 | - | 1 | 8 | 4 |
| 位数 | - | 8 | 8 | 8 |
| 功能数量 | - | 1 | 1 | 1 |
| 端子数量 | - | 8 | 20 | 14 |
| 最高工作温度 | - | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | - | -40 °C | -40 °C | -40 °C |
| 输出位码 | - | BINARY | BINARY | BINARY |
| 输出格式 | - | SERIAL | SERIAL | SERIAL |
| 封装主体材料 | - | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | - | DIP | DIP | DIP |
| 封装等效代码 | - | DIP8,.3 | DIP20,.3 | DIP14,.3 |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | IN-LINE | IN-LINE | IN-LINE |
| 峰值回流温度（摄氏度） | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | - | 5.08 mm | 5.08 mm | 5.08 mm |
| 最大压摆率 | - | 2.5 mA | 2.5 mA | 2.5 mA |
| 标称供电电压 | - | 5 V | 5 V | 5 V |
| 表面贴装 | - | NO | NO | NO |
| 技术 | - | BIPOLAR | BIPOLAR | CMOS |
| 温度等级 | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | - | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | - | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | - | 7.62 mm | 7.62 mm | 7.62 mm |
| Base Number Matches | - | 1 | 1 | 1 |
模拟电子
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