EE PLD, 15ns, PAL-Type, CMOS, PDIP24, 0.300 INCH, SKINNY, PLASTIC, DIP-24
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | AMD(超微) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP24,.3 |
| 针数 | 24 |
| Reach Compliance Code | unknown |
| 其他特性 | 10 MACROCELLS; REGISTER PRELOAD; SHARED INPUT/CLOCK; 1 EXTERNAL CLOCK |
| 架构 | PAL-TYPE |
| 最大时钟频率 | 50 MHz |
| JESD-30 代码 | R-PDIP-T24 |
| JESD-609代码 | e0 |
| 长度 | 30.734 mm |
| 专用输入次数 | 11 |
| I/O 线路数量 | 10 |
| 输入次数 | 22 |
| 输出次数 | 10 |
| 产品条款数 | 132 |
| 端子数量 | 24 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 11 DEDICATED INPUTS, 10 I/O |
| 输出函数 | MACROCELL |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP24,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 可编程逻辑类型 | EE PLD |
| 传播延迟 | 15 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| PALCE22V10Z-15PI | PALCE22V10Z-25PC | PALCE22V10Z-25SC | PALCE22V10Z-15JI | PALCE22V10Z-25JC | PALCE22V10Z-25JI | PALCE22V10Z-25SI | PALCE22V10Z-15SI | |
|---|---|---|---|---|---|---|---|---|
| 描述 | EE PLD, 15ns, PAL-Type, CMOS, PDIP24, 0.300 INCH, SKINNY, PLASTIC, DIP-24 | EE PLD, 25ns, PAL-Type, CMOS, PDIP24, 0.300 INCH, SKINNY, PLASTIC, DIP-24 | EE PLD, 25ns, PAL-Type, CMOS, PDSO24, PLASTIC, SOP-24 | EE PLD, 15ns, PAL-Type, CMOS, PQCC28, PLASTIC, LCC-28 | EE PLD, 25ns, PAL-Type, CMOS, PQCC28, PLASTIC, LCC-28 | EE PLD, 25ns, PAL-Type, CMOS, PQCC28, PLASTIC, LCC-28 | EE PLD, 25ns, PAL-Type, CMOS, PDSO24, PLASTIC, SOP-24 | EE PLD, 15ns, CMOS, PDSO24, PLASTIC, SOIC-24 |
| 厂商名称 | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) | AMD(超微) |
| 零件包装代码 | DIP | DIP | SOIC | QLCC | QLCC | QLCC | SOIC | SOIC |
| 包装说明 | DIP, DIP24,.3 | DIP, DIP24,.3 | SOP, SOP24,.4 | QCCJ, LDCC28,.5SQ | QCCJ, LDCC28,.5SQ | QCCJ, LDCC28,.5SQ | SOP, SOP24,.4 | SOP, |
| 针数 | 24 | 24 | 24 | 28 | 28 | 28 | 24 | 24 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 其他特性 | 10 MACROCELLS; REGISTER PRELOAD; SHARED INPUT/CLOCK; 1 EXTERNAL CLOCK | 10 MACROCELLS; REGISTER PRELOAD; SHARED INPUT/CLOCK; 1 EXTERNAL CLOCK | 10 MACROCELLS; REGISTER PRELOAD; SHARED INPUT/CLOCK; 1 EXTERNAL CLOCK | 10 MACROCELLS; REGISTER PRELOAD; SHARED INPUT/CLOCK; 1 EXTERNAL CLOCK | 10 MACROCELLS; REGISTER PRELOAD; SHARED INPUT/CLOCK; 1 EXTERNAL CLOCK | 10 MACROCELLS; REGISTER PRELOAD; SHARED INPUT/CLOCK; 1 EXTERNAL CLOCK | 10 MACROCELLS; REGISTER PRELOAD; SHARED INPUT/CLOCK; 1 EXTERNAL CLOCK | VARIABLE PRODUCT TERMS; 10 MACROCELLS; REGISTER PRELOAD; POWER-UP RESET |
| 最大时钟频率 | 50 MHz | 33.3 MHz | 33.3 MHz | 50 MHz | 33.3 MHz | 33.3 MHz | 33.3 MHz | 50 MHz |
| JESD-30 代码 | R-PDIP-T24 | R-PDIP-T24 | R-PDSO-G24 | S-PQCC-J28 | S-PQCC-J28 | S-PQCC-J28 | R-PDSO-G24 | R-PDSO-G24 |
| 长度 | 30.734 mm | 30.734 mm | 15.4 mm | 11.5062 mm | 11.5062 mm | 11.5062 mm | 15.4 mm | 15.4 mm |
| 专用输入次数 | 11 | 11 | 11 | 11 | 11 | 11 | 11 | 11 |
| I/O 线路数量 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 |
| 端子数量 | 24 | 24 | 24 | 28 | 28 | 28 | 24 | 24 |
| 最高工作温度 | 85 °C | 75 °C | 75 °C | 85 °C | 75 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | - | - | -40 °C | - | -40 °C | -40 °C | -40 °C |
| 组织 | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O |
| 输出函数 | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL | MACROCELL |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | SOP | QCCJ | QCCJ | QCCJ | SOP | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | SMALL OUTLINE | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | SMALL OUTLINE | SMALL OUTLINE |
| 可编程逻辑类型 | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD | EE PLD |
| 传播延迟 | 15 ns | 25 ns | 25 ns | 15 ns | 25 ns | 25 ns | 25 ns | 15 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | 5.08 mm | 3 mm | 4.57 mm | 4.57 mm | 4.57 mm | 3 mm | 3 mm |
| 最大供电电压 | 5.5 V | 5.25 V | 5.25 V | 5.5 V | 5.25 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4.5 V | 4.75 V | 4.75 V | 4.5 V | 4.75 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | INDUSTRIAL | COMMERCIAL EXTENDED | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | GULL WING | J BEND | J BEND | J BEND | GULL WING | GULL WING |
| 端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | QUAD | QUAD | QUAD | DUAL | DUAL |
| 宽度 | 7.62 mm | 7.62 mm | 7.5 mm | 11.5062 mm | 11.5062 mm | 11.5062 mm | 7.5 mm | 7.5 mm |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | - |
| 架构 | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | PAL-TYPE | - |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | - |
| 输入次数 | 22 | 22 | 22 | 22 | 22 | 22 | 22 | - |
| 输出次数 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | - |
| 产品条款数 | 132 | 132 | 132 | 132 | 132 | 132 | 132 | - |
| 封装等效代码 | DIP24,.3 | DIP24,.3 | SOP24,.4 | LDCC28,.5SQ | LDCC28,.5SQ | LDCC28,.5SQ | SOP24,.4 | - |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | - |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
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