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PEEL22CV10AZPI-25L

产品描述EE PLD, 25ns, CMOS, PDIP24, 0.300 INCH, LEAD FREE, PLASTIC, DIP-24
产品类别可编程逻辑器件    可编程逻辑   
文件大小476KB,共10页
制造商Integrated Circuit Systems(IDT )
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PEEL22CV10AZPI-25L概述

EE PLD, 25ns, CMOS, PDIP24, 0.300 INCH, LEAD FREE, PLASTIC, DIP-24

PEEL22CV10AZPI-25L规格参数

参数名称属性值
厂商名称Integrated Circuit Systems(IDT )
零件包装代码DIP
包装说明DIP,
针数24
Reach Compliance Codeunknown
最大时钟频率33.3 MHz
JESD-30 代码R-PDIP-T24
长度31.75 mm
专用输入次数11
I/O 线路数量10
端子数量24
最高工作温度85 °C
最低工作温度-40 °C
组织11 DEDICATED INPUTS, 10 I/O
输出函数MACROCELL
封装主体材料PLASTIC/EPOXY
封装代码DIP
封装形状RECTANGULAR
封装形式IN-LINE
可编程逻辑类型EE PLD
传播延迟25 ns
认证状态Not Qualified
最大供电电压5.5 V
最小供电电压4.5 V
标称供电电压5 V
表面贴装NO
技术CMOS
温度等级INDUSTRIAL
端子形式THROUGH-HOLE
端子节距2.54 mm
端子位置DUAL
宽度7.62 mm

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PEEL™ 22CV10AZ -25
CMOS Programmable Electrically Erasable Logic Device
Features
Ultra Low Power Operation
- V
CC
= 5 Volts ±10%
- Icc = 10 µA (typical) at standby
- Icc = 2 mA (typical) at 1 MHz
- t
PD
= 25ns.
CMOS Electrically Erasable Technology
- Superior factory testing
-
Reprogrammable in plastic package
-
Reduces retrofit and development costs
Development/Programmer Support
- Third party software and programmers
- Anachip PLACE Development Software
Architectural Flexibility
-
133 product terms x 44 input AND array
-
Up to 22 inputs and 10 I/O pins
-
12 possible macrocell configurations
-
Synchronous preset, asynchronous clear
-
Independent output enables
-
Programmable clock source and polarity
-
24-pin DIP/SOIC/TSSOP and 28-pin PLCC
Application Versatility
-
Replaces random logic
-
Pin and JEDEC compatible with 22V10
-
Ideal for power-sensitive systems
General Description
The PEEL™22CV10AZ is a Programmable Electrically Erasable
Logic (PEEL™) device that provides a low power alternative to
ordinary PLDs. The PEEL™22CV10AZ is available in 24-pin
DIP, SOIC, TSSOP and 28-pin PLCC packages (see Figure 19). A
“zero-power” (100µA max. I
CC
) standby mode makes the
PEEL™22CV10AZ ideal for power sensitive applications such as
handheld meters, portable communication equipment and lap- top
computers/ peripherals. EE-reprogrammability provides the
convenience of instant reprogramming for development and a
reusable production inventory minimizing the impact of pro-
gramming changes or errors. EE-reprogrammability also
improves factory testability, thus ensuring the highest quality
possible.
The PEEL™22CV10AZ is JEDEC file compatible with standard
22V10 PLDs. Eight additional configurations per macrocell (a
total of 12) are also available by using the “+” software/program-
ming option (i.e., 22CV10AZ+ & 22CV10AZ++). The additional
macrocell configurations allow more logic to be put into every
device, potentially reducing the design's component count and
lowering the power requirements even further.
Development
and
programming
support
for
the
PEEL™22CV10AZ is provided by popular third-party program-
mers and development software. Anachip also offers free Win-
PLACE development software.
Figure 19 Block Diagram
Figure 19 Pin Configuration
I/CLK
I
I
I
I
I
I
I
I
I
I
GND
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
VCC
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I
DIP
TSSOP
PLCC
SOIC
This datasheet contains new product information. Anachip Corp. reserves the rights to modify the product specification without notice. No liability is assumed as a result of the use of this product. No rights under any patent
accompany the sale of the product.
Rev. 1.0 Dec 16, 2004
1/10

PEEL22CV10AZPI-25L相似产品对比

PEEL22CV10AZPI-25L PEEL22CV10AZTI-25L PEEL22CV10AZT-25L PEEL22CV10AZSI-25L PEEL22CV10AZS-25L PEEL22CV10AZP-25L PEEL22CV10AZJI-25L PEEL22CV10AZJ-25L
描述 EE PLD, 25ns, CMOS, PDIP24, 0.300 INCH, LEAD FREE, PLASTIC, DIP-24 EE PLD, 25ns, CMOS, PDSO24, 0.170 INCH, LEAD FREE, TSSOP-24 EE PLD, 25ns, CMOS, PDSO24, 0.170 INCH, LEAD FREE, TSSOP-24 EE PLD, 25ns, CMOS, PDSO24, 0.300 INCH, LEAD FREE, SOIC-24 EE PLD, 25ns, CMOS, PDSO24, 0.300 INCH, LEAD FREE, SOIC-24 EE PLD, 25ns, CMOS, PDIP24, 0.300 INCH, LEAD FREE, PLASTIC, DIP-24 EE PLD, 25ns, CMOS, PQCC28, LEAD FREE, PLASTIC, LCC-28 EE PLD, 25ns, CMOS, PQCC28, LEAD FREE, PLASTIC, LCC-28
厂商名称 Integrated Circuit Systems(IDT ) Integrated Circuit Systems(IDT ) Integrated Circuit Systems(IDT ) Integrated Circuit Systems(IDT ) Integrated Circuit Systems(IDT ) Integrated Circuit Systems(IDT ) Integrated Circuit Systems(IDT ) Integrated Circuit Systems(IDT )
零件包装代码 DIP TSSOP TSSOP SOIC SOIC DIP QLCC QLCC
包装说明 DIP, TSSOP, TSSOP, SOP, SOP, DIP, QCCJ, QCCJ,
针数 24 24 24 24 24 24 28 28
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown
最大时钟频率 33.3 MHz 33.3 MHz 33.3 MHz 33.3 MHz 33.3 MHz 33.3 MHz 33.3 MHz 33.3 MHz
JESD-30 代码 R-PDIP-T24 R-PDSO-G24 R-PDSO-G24 R-PDSO-G24 R-PDSO-G24 R-PDIP-T24 S-PQCC-J28 S-PQCC-J28
长度 31.75 mm 7.8 mm 7.8 mm 15.4 mm 15.4 mm 31.75 mm 11.5062 mm 11.5062 mm
专用输入次数 11 11 11 11 11 11 11 11
I/O 线路数量 10 10 10 10 10 10 10 10
端子数量 24 24 24 24 24 24 28 28
最高工作温度 85 °C 85 °C 70 °C 85 °C 70 °C 70 °C 85 °C 70 °C
组织 11 DEDICATED INPUTS, 10 I/O 11 DEDICATED INPUTS, 10 I/O 11 DEDICATED INPUTS, 10 I/O 11 DEDICATED INPUTS, 10 I/O 11 DEDICATED INPUTS, 10 I/O 11 DEDICATED INPUTS, 10 I/O 11 DEDICATED INPUTS, 10 I/O 11 DEDICATED INPUTS, 10 I/O
输出函数 MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL MACROCELL
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 DIP TSSOP TSSOP SOP SOP DIP QCCJ QCCJ
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR SQUARE SQUARE
封装形式 IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE IN-LINE CHIP CARRIER CHIP CARRIER
可编程逻辑类型 EE PLD EE PLD EE PLD EE PLD EE PLD EE PLD EE PLD EE PLD
传播延迟 25 ns 25 ns 25 ns 25 ns 25 ns 25 ns 25 ns 25 ns
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
最大供电电压 5.5 V 5.5 V 5.25 V 5.5 V 5.25 V 5.25 V 5.5 V 5.25 V
最小供电电压 4.5 V 4.5 V 4.75 V 4.5 V 4.75 V 4.75 V 4.5 V 4.75 V
标称供电电压 5 V 5 V 5 V 5 V 5 V 5 V 5 V 5 V
表面贴装 NO YES YES YES YES NO YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 INDUSTRIAL INDUSTRIAL COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL
端子形式 THROUGH-HOLE GULL WING GULL WING GULL WING GULL WING THROUGH-HOLE J BEND J BEND
端子节距 2.54 mm 0.65 mm 0.65 mm 1.27 mm 1.27 mm 2.54 mm 1.27 mm 1.27 mm
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL QUAD QUAD
宽度 7.62 mm 4.4 mm 4.4 mm 7.5 mm 7.5 mm 7.62 mm 11.5062 mm 11.5062 mm
座面最大高度 - 1.1 mm 1.1 mm 2.64 mm 2.64 mm - 4.369 mm 4.369 mm
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