4000/14000/40000 SERIES, SYN POSITIVE EDGE TRIGGERED 4-BIT BIDIRECTIONAL BINARY COUNTER, CDIP16, CERAMIC, DIP-16
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | ST(意法半导体) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP16,.3 |
| 针数 | 16 |
| Reach Compliance Code | not_compliant |
| HCC4516BF | HCF4510BE | HCF4510BF | HCF4516BF | HCC4510BD | HCC4510BF | HCC4510BK | |
|---|---|---|---|---|---|---|---|
| 描述 | 4000/14000/40000 SERIES, SYN POSITIVE EDGE TRIGGERED 4-BIT BIDIRECTIONAL BINARY COUNTER, CDIP16, CERAMIC, DIP-16 | DECADE COUNTER | DECADE COUNTER | 4000/14000/40000 SERIES, SYN POSITIVE EDGE TRIGGERED 4-BIT BIDIRECTIONAL BINARY COUNTER, CDIP16, FRIT SEALED, CERAMIC, DIP-16 | DECADE COUNTER | 4000/14000/40000 SERIES, SYN POSITIVE EDGE TRIGGERED 4-BIT BIDIRECTIONAL DECADE COUNTER, CDIP16, CERAMIC, DIP-16 | DECADE COUNTER |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) | ST(意法半导体) |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| 包装说明 | DIP, DIP16,.3 | - | - | FRIT SEALED, CERAMIC, DIP-16 | DIP, DIP16,.3 | DIP, DIP16,.3 | - |
| 计数方向 | - | BIDIRECTIONAL | - | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL |
| JESD-30 代码 | - | R-PDIP-T16 | - | R-GDIP-T16 | R-XDIP-T16 | R-GDIP-T16 | R-XDFP-F16 |
| JESD-609代码 | - | e0 | e0 | e0 | e0 | e0 | e0 |
| 负载电容（CL） | - | 50 pF | - | - | 50 pF | 50 pF | 50 pF |
| 负载/预设输入 | - | YES | YES | YES | YES | YES | YES |
| 逻辑集成电路类型 | - | DECADE COUNTER | DECADE COUNTER | BINARY COUNTER | DECADE COUNTER | DECADE COUNTER | DECADE COUNTER |
| 最大频率@ Nom-Sup | - | 2000000 Hz | - | - | 2000000 Hz | 2000000 Hz | 2000000 Hz |
| 工作模式 | - | SYNCHRONOUS | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 功能数量 | - | 1 | - | 1 | 1 | 1 | 1 |
| 端子数量 | - | 16 | - | 16 | 16 | 16 | 16 |
| 最高工作温度 | - | 85 °C | - | 85 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | - | -40 °C | - | -40 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | - | PLASTIC/EPOXY | - | CERAMIC, GLASS-SEALED | CERAMIC | CERAMIC, GLASS-SEALED | CERAMIC |
| 封装代码 | - | DIP | - | DIP | DIP | DIP | DFP |
| 封装等效代码 | - | DIP16,.3 | - | - | DIP16,.3 | DIP16,.3 | FL16,.3 |
| 封装形状 | - | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | IN-LINE | - | IN-LINE | IN-LINE | IN-LINE | FLATPACK |
| 电源 | - | 5/15 V | - | - | 5/15 V | 5/15 V | 5/15 V |
| 认证状态 | - | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | - | NO | - | NO | NO | NO | YES |
| 技术 | - | CMOS | - | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | - | INDUSTRIAL | - | INDUSTRIAL | MILITARY | MILITARY | MILITARY |
| 端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | - | THROUGH-HOLE | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | FLAT |
| 端子节距 | - | 2.54 mm | - | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm |
| 端子位置 | - | DUAL | - | DUAL | DUAL | DUAL | DUAL |
PCB设计
电源技术
模拟与混合信号
微控制器 MCU
无线连接
微控制器 MCU
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
