AS5304 / AS5306
Integrated Hall ICs for
Linear and Off-Axis Rotary Motion Detection
PRELIMINARY DATA SHEET
1
General Description
2
•
•
•
•
Benefits
Complete system-on-chip
High reliability due to non-contact sensing
Suitable for the use in harsh environments
Robust against external magnetic stray fields
The AS5304/AS5306 are single-chip IC’s with integrated
Hall elements for measuring linear or rotary motion using
multi-pole magnetic strips or rings.
This allows the usage of the AS5304/AS5306 in
applications where the Sensor IC cannot be mounted at the
end of a rotating device (e.g. at hollow shafts). Instead, the
AS5304/AS5306 are mounted off-axis underneath a multi-
pole magnetized ring or strip and provides a quadrature
incremental output with 40 pulses per pole period at
speeds of up to 20 meters/sec (AS5304) or 12 meters/sec
(AS5306).
A single index pulse is generated once for every pole pair
at the Index output.
Using, for example, a 32pole-pair magnetic ring, the
AS5304/AS5306 can provide a resolution of 1280
pulses/rev, which is equivalent to 5120 positions/rev or
12.3bit. The maximum speed at this configuration is 9375
rpm.
The pole pair length is 4mm (2mm north pole / 2mm south
pole) for the AS5304, and 2.4mm (1.2mm north pole /
1.2mm south pole) for the AS5306. The chip accepts a
magnetic field strength down to 5mT (peak).
Both chips are available with
push-pull outputs
(AS530xA)
or with
open drain outputs (AS530xB).
The AS5304/AS5306 are available in a small 20-pin
TSSOP package and specified for an operating ambient
temperature of -40° to +125°C.
3
•
•
•
•
•
•
•
•
•
Key Features
High speed, up to 20m/s (AS5304)
12m/s (AS5306)
Magnetic pole pair length:
4mm (AS5304)
or
2.4mm (AS5306)
Resolution:
25µm (AS5304)
or
15µm (AS5306)
40 pulses / 160 positions per magnetic period.
1 index pulse per pole pair
Linear movement
magnetic strips
measurement
using
multi-pole
Circular off-axis movement measurement using multi-
pole magnetic rings
4.5 to 5.5V operating voltage
Magnetic field strength indicator, magnetic field alarm
for end-of-strip or missing magnet
4
Applications
The AS5304/AS5306 are ideal for high speed linear motion
and off-axis rotation measurement in applications such as
•
•
•
•
electrical motors
X-Y-stages
rotation knobs
industrial drives
Figure 1:
Revision 1.5
AS5304 (AS5306) with multi-pole ring magnet.
Figure 2:
AS5306 (AS5304) with magnetic multi-pole strip magnet
for linear motion measurement
Page 1 of 13
www.austriamicrosystems.com
AS5304/AS5306 Integrated Hall IC for linear and off-axis rotary motion detection
5
Functional Description
The AS5304/AS5306 require a multi-pole magnetic strip or ring with a pole length of 2mm (4mm pole pair length) on the
AS5304, and a pole length of 1.2mm (2.4mm pole pair length) on the AS5306. The magnetic field strength of the multi-pole
magnet should be in the range of 5 to 60mT at the chip surface.
The Hall elements on the AS5304/AS5306 are arranged in a linear array.
By moving the multi-pole magnet over the Hall array, a sinusoidal signal (SIN) is generated internally. With proper configuration
of the Hall elements, a second 90° phase shifted sinusoidal signal (COS) is obtained. Using an interpolation circuit, the length
of a pole pair is divided into 160 positions and further decoded into 40 quadrature pulses.
An Automatic Gain Control provides a large dynamic input range of the magnetic field.
An Analog output pin (AO) provides an analog voltage that changes with the strength of the magnetic field (see chapter 8).
Figure 3:
AS5304 / AS5306 block diagram
6
Sensor Placement in Package
TSSOP20 / 0.65mm pin pitch
Die C/L
1.02
0.2299±0.100
0.2341±0.100
3.200±0.235
Package
Outline
0.7701±0.150
3.0475±0.235
Figure 4:
Sensor in package
Die Tilt Tolerance ±1º
Revision 1.5
www.austriamicrosystems.com
Page 2 of 13
AS5304/AS5306 Integrated Hall IC for linear and off-axis rotary motion detection
6.1
Pin Description
Pin
Pin Name
Pin Type
Notes
1
2
3
4
5,12,13,
14,17,18,19
6
7
8
9,10,11
15
16
20
PIN Types:
VSS
A
VDDP
B
TEST
AO
VDD
Index
TEST
TEST_GND
VDDA Hall
ZPZmskdis
S
AIO
DO_OD
S
DO_OD
S
DO_OD
AIO
AO
S
DO_OD
AIO
S
S
DI
Supply ground
Incremental quadrature position output A. Short circuit current limitation
Peripheral supply pin, connect to VDD
Incremental quadrature position output B. Short Circuit Current Limitation
test pins, must be left open
AGC Analogue Output. (Used to detect low magnetic field strength)
Positive supply pin
Index output, active HIGH. Short Circuit Current Limitation
test pins, must be left open
test pin, must be connected to VSS
Hall Bias Supply Support (connected to VDD)
Test input, connect to VSS during operation
supply pin
AO
analogue output
analog input / output
DI
digital input
digital output push pull or open drain (programmable)
6.2
Package Drawings and Markings
20 Lead Thin Shrink Small Outline Package –
TSSOP20
Revision 1.5
www.austriamicrosystems.com
Page 3 of 13
AS5304/AS5306 Integrated Hall IC for linear and off-axis rotary motion detection
Dimensions
Symbol
A
A1
A2
b
c
D
E
E1
e
K
L
0°
0.45
4.30
mm
Min
-
0.05
0.80
0.19
0.09
6.40
Typ
-
-
1.00
-
-
6.50
6.40
4.40
0.65
-
0.60
8°
0.75
0°
0.018
4.50
0.169
Max
1.20
0.15
1.05
0.30
0.20
6.60
Min
-
0.002
0.031
0.007
0.004
0.252
inch
Typ
-
-
0.039
-
-
0.256
0.252
0.173
0.0256
-
0.024
8°
0.030
0.177
Max
0.047
0.006
0.041
0.012
0.008
0.260
Marking: AYWWIZZ
A: Pb-Free Identifier
Y: Last Digit of Manufacturing Year
WW: Manufacturing Week
I: Plant Identifier
ZZ: Traceability Code
JEDEC Package Outline Standard:
MO-153-AC
Thermal Resistance R
th(j-a)
:
89 K/W in still air, soldered on PCB.
IC's marked with a white dot or the letters "ES" denote
Engineering Samples
6.3
Electrical Connection
The supply pins VDD, VDDP and VDDA are connected to +5V. Pins VSS and TEST_GND are connected to the supply ground. A
100nF decoupling capacitor close to the device is recommended.
Figure 5:
Electrical connection of the AS5304/AS5306
Revision 1.5
www.austriamicrosystems.com
Page 4 of 13
AS5304/AS5306 Integrated Hall IC for linear and off-axis rotary motion detection
7
Incremental Quadrature AB Output
S
N
S
N
S
The digital output is compatible to optical incremental
encoder outputs. Direction of rotation is encoded into
two signals A and B that are phase-shifted by 90º.
Depending on the direction of rotation, A leads B
(CW) or B leads A (CCW).
7.1.1
Index Pulse
40
1
2
40
1
2
A
40
1
2
40
1
2
A single index pulse is generated once for every pole
pair. One pole pair is interpolated to 40 quadrature
pulses (160 steps), so one index pulse is generated
after every 40 quadrature pulses (see Figure 6)
The Index output is switched to Index = high, when a
magnet is placed over the Hall array as shown in
Figure 7, top graph: the north pole of the magnet is
placed over the left side of the IC (top view, pin#1 at
bottom left) and the south pole is placed over the
right side of the IC.
The index output will switch back to Index = low,
when the magnet is moved by one LSB from position
X=0 to X=X1, as shown in Figure 7, bottom graph.
One LSB is 25µm for AS5304 and 15µm for AS5306.
Note: Since the small step size of 1 LSB is hardly
recognizable in a correctly scaled graph it is shown as an
exaggerated step in the bottom graph of Figure 7.
B
Index
Detail:
A
B
Index
Step #
157 158 159
0
1
2
3
4
5
Figure 6:
Quadrature A / B and Index output
7.1.2
Magnetic Field Warning Indicator
The AS5304 can also provide a low magnetic field warning to indicate a missing magnet or when the end of the magnetic strip
has been reached. This condition is indicated by using a combination of A, B and Index, that does not occur in normal
operation:
A low magnetic field is indicated with:
Index = high
A=B=low
7.1.3
Vertical Distance between Magnet and IC
The recommended vertical distance between magnet and IC depends on the strength of the magnet and the length of the
magnetic pole.
Typically, the vertical distance between magnet and chip surface should not exceed ½ of the pole length.
That means for AS5304, having a pole length of 2.0mm, the maximum vertical gap should be 1.0mm,
For the AS5306, having a pole length of 1.2mm, the maximum vertical gap should be 0.6mm
These figures refer to the chip surface. Given a typical distance of 0.2mm between chip surface and IC package surface,
the recommended vertical distances between
magnet and IC surface
are therefore:
AS 5304:
≤
0.8mm
AS 5306:
≤
0.4mm
Revision 1.5
www.austriamicrosystems.com
Page 5 of 13
模拟电子
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
