SRAM Module, 1MX32, 35ns, CMOS, PSMA72, ANGLED, PLASTIC, SIMM-72
| 参数名称 | 属性值 |
| 厂商名称 | Cypress(赛普拉斯) |
| 零件包装代码 | SIMM |
| 包装说明 | SIMM, SSIM72 |
| 针数 | 72 |
| Reach Compliance Code | compliant |
| ECCN代码 | 3A991.B.2.A |
| 最长访问时间 | 35 ns |
| I/O 类型 | COMMON |
| JESD-30 代码 | R-PSMA-N72 |
| JESD-609代码 | e0 |
| 内存密度 | 33554432 bit |
| 内存集成电路类型 | SRAM MODULE |
| 内存宽度 | 32 |
| 功能数量 | 1 |
| 端子数量 | 72 |
| 字数 | 1048576 words |
| 字数代码 | 1000000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 1MX32 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SIMM |
| 封装等效代码 | SSIM72 |
| 封装形状 | RECTANGULAR |
| 封装形式 | MICROELECTRONIC ASSEMBLY |
| 并行/串行 | PARALLEL |
| 电源 | 3.3 V |
| 认证状态 | Not Qualified |
| 最大待机电流 | 0.27 A |
| 最小待机电流 | 3.14 V |
| 最大压摆率 | 1.1 mA |
| 最大供电电压 (Vsup) | 3.63 V |
| 最小供电电压 (Vsup) | 3.135 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | TIN LEAD |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | SINGLE |
| CYM1851V33P6-35C | 311771 | 311881 | CYM1851V33PN-35C | CYM1851V33P6-25C | CYM1851V33PZ-20C | CYM1851V33P8-25C | |
|---|---|---|---|---|---|---|---|
| 描述 | SRAM Module, 1MX32, 35ns, CMOS, PSMA72, ANGLED, PLASTIC, SIMM-72 | centerline 5.00 mm, direction of connection vertical 0° | eccentric lever, wire entry uncodeable side parallel to plug direction | SRAM Module, 1MX32, 35ns, CMOS, PSMA72, ANGLED, PLASTIC, SIMM-72 | SRAM Module, 1MX32, 25ns, CMOS, PSMA72, ANGLED, PLASTIC, SIMM-72 | SRAM Module, 1MX32, 20ns, CMOS, PZMA72, PLASTIC, ZIP-72 | SRAM Module, 1MX32, 25ns, CMOS, PSMA72, PLASTIC, SIMM-72 |
| 厂商名称 | Cypress(赛普拉斯) | - | - | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) | Cypress(赛普拉斯) |
| 零件包装代码 | SIMM | - | - | SIMM | SIMM | ZIP | SIMM |
| 包装说明 | SIMM, SSIM72 | - | - | SIMM, SSIM72 | SIMM, SSIM72 | PLASTIC, ZIP-72 | SIMM, SSIM72 |
| 针数 | 72 | - | - | 72 | 72 | 72 | 72 |
| Reach Compliance Code | compliant | - | - | compliant | compliant | not_compliant | compliant |
| ECCN代码 | 3A991.B.2.A | - | - | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
| 最长访问时间 | 35 ns | - | - | 35 ns | 25 ns | 20 ns | 25 ns |
| I/O 类型 | COMMON | - | - | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | R-PSMA-N72 | - | - | R-PSMA-N72 | R-PSMA-N72 | R-PZMA-T72 | R-PSMA-N72 |
| JESD-609代码 | e0 | - | - | e0 | e0 | e0 | e0 |
| 内存密度 | 33554432 bit | - | - | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit |
| 内存集成电路类型 | SRAM MODULE | - | - | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE |
| 内存宽度 | 32 | - | - | 32 | 32 | 32 | 32 |
| 功能数量 | 1 | - | - | 1 | 1 | 1 | 1 |
| 端子数量 | 72 | - | - | 72 | 72 | 72 | 72 |
| 字数 | 1048576 words | - | - | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
| 字数代码 | 1000000 | - | - | 1000000 | 1000000 | 1000000 | 1000000 |
| 工作模式 | ASYNCHRONOUS | - | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | - | - | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 1MX32 | - | - | 1MX32 | 1MX32 | 1MX32 | 1MX32 |
| 输出特性 | 3-STATE | - | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SIMM | - | - | SIMM | SIMM | ZIP | SIMM |
| 封装等效代码 | SSIM72 | - | - | SSIM72 | SSIM72 | ZIP72/76,.1,.1 | SSIM72 |
| 封装形状 | RECTANGULAR | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | MICROELECTRONIC ASSEMBLY | - | - | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| 并行/串行 | PARALLEL | - | - | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 电源 | 3.3 V | - | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 认证状态 | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大待机电流 | 0.27 A | - | - | 0.27 A | 0.27 A | 0.27 A | 0.27 A |
| 最小待机电流 | 3.14 V | - | - | 3.14 V | 3.14 V | 3.14 V | 3.14 V |
| 最大压摆率 | 1.1 mA | - | - | 1.1 mA | 1.1 mA | 1.1 mA | 1.1 mA |
| 最大供电电压 (Vsup) | 3.63 V | - | - | 3.63 V | 3.63 V | 3.63 V | 3.63 V |
| 最小供电电压 (Vsup) | 3.135 V | - | - | 3.135 V | 3.135 V | 3.135 V | 3.135 V |
| 标称供电电压 (Vsup) | 3.3 V | - | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | NO | - | - | NO | NO | NO | NO |
| 技术 | CMOS | - | - | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | - | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | TIN LEAD | - | - | TIN LEAD | TIN LEAD | Tin/Lead (Sn/Pb) | TIN LEAD |
| 端子形式 | NO LEAD | - | - | NO LEAD | NO LEAD | THROUGH-HOLE | NO LEAD |
| 端子节距 | 1.27 mm | - | - | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | SINGLE | - | - | SINGLE | SINGLE | ZIG-ZAG | SINGLE |
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